Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/1998
12/01/1998US5843802 Semiconductor laser formed by layer intermixing
12/01/1998US5843799 Circuit module redundancy architecture process
12/01/1998US5843798 Method for manufacturing semiconductor device having step of forming electrode pins on semiconductor chip using electrode-pin forming mask, and method for testing semiconductor chip using electrode-pin forming mask
12/01/1998US5843797 Method of reducing offset for ion-implantation in semiconductor devices
12/01/1998US5843796 Method of making an insulated gate bipolar transistor with high-energy P+ im
12/01/1998US5843627 Method for forming fine patterns of semiconductor device
12/01/1998US5843625 Method of reducing via and contact dimensions beyond photolithography equipment limits
12/01/1998US5843624 Energy-sensitive resist material and a process for device fabrication using an energy-sensitive resist material
12/01/1998US5843616 Positive resist composition
12/01/1998US5843602 Method of adjusting concentration of developer through load cell utilization and wet nitrogen gas atmosphere
12/01/1998US5843591 Polymeric metal oxide materials and their formation and use
12/01/1998US5843590 Epitaxial wafer and method of preparing the same
12/01/1998US5843550 Adhesive tape for tape automated bonding
12/01/1998US5843535 forming a layer
12/01/1998US5843520 Substrate clamp design for minimizing substrate to clamp sticking during thermal processing of thermally flowable layers
12/01/1998US5843516 Liquid source formation of thin films using hexamethyl-disilazane
12/01/1998US5843363 Ablation patterning of multi-layered structures
12/01/1998US5843360 Method and pellet for encapsulating lead frames
12/01/1998US5843341 Electro-conductive oxide electrodes and devices using the same
12/01/1998US5843322 Process for etching N, P, N+ and P+ type slugs and wafers
12/01/1998US5843290 Electrolytic polishing apparatus
12/01/1998US5843277 Dry-etch of indium and tin oxides with C2H5I gas
12/01/1998US5843251 Process for connecting circuits and adhesive film used therefor
12/01/1998US5843237 Apparatus for manufacturing a semiconductor device having a wafer loading stage with an annular slope
12/01/1998US5843234 Method and apparatus for aiming a barrel reactor nozzle
12/01/1998US5843233 Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus
12/01/1998US5843229 Crystal holding apparatus
12/01/1998US5843228 Apparatus for preventing heater electrode meltdown in single crystal pulling apparatus
12/01/1998US5843227 Crystal growth method for gallium nitride films
12/01/1998US5843226 Etch process for single crystal silicon
12/01/1998US5843225 Process for fabricating semiconductor and process for fabricating semiconductor device
12/01/1998US5843224 Composite structure comprising a semiconductor layer arranged on a diamond or diamond-like layer and process for its production
12/01/1998US5843196 Ultra-clean transport carrier
12/01/1998US5842917 Automated manufacturing plant for semiconductor devices
12/01/1998US5842910 Off-center grooved polish pad for CMP
12/01/1998US5842825 Incremented rotated wafer placement on electro-static chucks for metal etch
12/01/1998US5842824 Substrate transport apparatus
12/01/1998US5842690 Semiconductor wafer anchoring device
12/01/1998US5842628 Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method
12/01/1998US5842491 Semiconductor wafer cleaning apparatus
12/01/1998US5842461 Dicing machine
12/01/1998US5842275 Reflow soldering to mounting pads with vent channels to avoid skewing
12/01/1998US5842273 Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby
12/01/1998CA2059345C Method and apparatus for fabrication of micro-structures using non-planar, exposure beam lithography
11/1998
11/30/1998CA2239124A1 Semiconductor device having a metal-insulator-metal capacitor
11/26/1998WO1998053651A1 A system and method for packaging integrated circuits
11/26/1998WO1998053510A1 Patterning organic light-emitting devices
11/26/1998WO1998053506A1 Ferroelectric memory element and method of producing the same
11/26/1998WO1998053505A2 Lateral mos semiconductor device
11/26/1998WO1998053502A1 Semiconductor device and method for manufacturing the same
11/26/1998WO1998053499A1 Substrate for electronic packaging, pin jig fixture
11/26/1998WO1998053497A1 Method for mos transistor isolation
11/26/1998WO1998053496A1 A method for manufacturing encapsulated semiconductor devices
11/26/1998WO1998053495A1 Fine pitch bonding tool for constrained bonding
11/26/1998WO1998053494A1 Method of manufacturing a patterned array of solder bumps
11/26/1998WO1998053493A1 A system and method for packaging integrated circuits
11/26/1998WO1998053492A1 Mofset in a trench and method of manufacture thereof
11/26/1998WO1998053491A2 Manufacture of a semiconductor device with a mos transistor having an ldd structure
11/26/1998WO1998053490A1 A one mask, power semiconductor device fabrication process
11/26/1998WO1998053489A2 Integrated circuit, components thereof and manufacturing method
11/26/1998WO1998053488A1 Method for polishing a composite comprising an insulator, a metal, and titanium
11/26/1998WO1998053487A1 Planarization process for semiconductor substrates
11/26/1998WO1998053485A1 Bump forming method and bump bonder
11/26/1998WO1998053484A1 Processing apparatus
11/26/1998WO1998053482A1 Apparatus for coupling power through a workpiece in a semiconductor wafer processing system
11/26/1998WO1998053447A2 Method of manufacturing a body having a structure of layers
11/26/1998WO1998053330A2 Test head structure for integrated circuit tester
11/26/1998WO1998053246A1 High capacity gas storage and dispensing system
11/26/1998WO1998053125A1 Single crystal silicon carbide and process for preparing the same
11/26/1998WO1998053116A1 Method and apparatus for low pressure sputtering
11/26/1998WO1998052852A1 Fiber dispensing system
11/26/1998WO1998052697A1 Washing unit for joint seal in a semiconductor bath system
11/26/1998WO1998052575A1 Use of metalloproteinase inhibitors in the treatment and prevention of pulmonary emphysema
11/26/1998WO1998028320A3 Affinity based self-assembly systems and devices for photonic and electronic applications
11/26/1998DE19800624A1 Dryer employing water-soluble solvent liquid and vapour
11/26/1998DE19758077A1 Unit for controlling testing of integrated circuits using multiple testers
11/26/1998DE19754897A1 Dryer employing water-soluble solvent vapour
11/26/1998DE19751078A1 Combined MOS and bipolar transistor
11/26/1998DE19737589C1 Interface arrangement for IC with full-custom and semi-custom clock domain
11/26/1998DE19734837A1 Self-aligning silicide manufacturing method
11/26/1998DE19721114A1 Two stage oxide layer production on silicon carbide
11/26/1998CA2295541A1 A system and method for packaging integrated circuits
11/26/1998CA2291114A1 Integrated circuit, components thereof and manufacturing method
11/26/1998CA2290819A1 Substrate for electronic packaging, pin jig fixture
11/26/1998CA2290396A1 A system and method for packaging integrated circuits
11/26/1998CA2288912A1 Method of manufacturing a patterned array of solder bumps
11/26/1998CA2238246A1 Photoresist composition
11/26/1998CA2238244A1 Photoresist composition
11/25/1998EP0880183A2 LDMOS power device
11/25/1998EP0880177A2 Semiconductor device having lead terminals bent in J-shape
11/25/1998EP0880176A2 Semiconductor device having pellet mounted on radiating plate thereof
11/25/1998EP0880175A2 Thin power tape ball grid array package
11/25/1998EP0880174A1 Method of fabricating semiconductor device capable of providing mosfet which is improved in a threshold voltage thereof
11/25/1998EP0880173A2 Improved integrated multi-layer test pads and methods therefor
11/25/1998EP0880171A2 Integrated circuit chip structure for improved packaging
11/25/1998EP0880170A2 Mounting method of semiconductor device
11/25/1998EP0880169A1 Method of fabricating a field-effect transistor utilizing an SOI substrate
11/25/1998EP0880168A2 System and method of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxides
11/25/1998EP0880167A2 Capacitor comprising improved ta0x-based dielectric
11/25/1998EP0880166A2 Method and apparatus for depositing an etch stop layer
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