Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/1998
11/10/1998US5834352 Methods of forming integrated circuits containing high and low voltage field effect transistors therein
11/10/1998US5834351 Nitridation process with peripheral region protection
11/10/1998US5834350 Elevated transistor fabrication technique
11/10/1998US5834349 Method for fabricating memory cells using chemical mechanical polishing technology
11/10/1998US5834348 Method for manufacturing a semiconductor device having a ferroelectric capacitor
11/10/1998US5834347 MIS type semiconductor device and method for manufacturing same
11/10/1998US5834346 Procedure for eliminating bubbles formed during reflow of a dielectric layer over an LDD structure
11/10/1998US5834345 Method of fabricating field effect thin film transistor
11/10/1998US5834343 Method of manufacturing thin film transistor
11/10/1998US5834342 Using two different photoresist masks formed from same optical mask, forming thin film transistor with reduced source and drain resistance
11/10/1998US5834341 Process for fabricating low off current thin film transistor
11/10/1998US5834340 Plastic molded semiconductor package and method of manufacturing the same
11/10/1998US5834339 Electrically connecting contact pads on semiconductor chip to bond pads on printed circuit, forming gap, sealing gap with fluid curable encapsulant, applying uniform pressure to cause encapsulant to flow into gap, curing
11/10/1998US5834334 Method of forming a multi-chip module from a membrane circuit
11/10/1998US5834330 Selective etch method for II-VI semiconductors
11/10/1998US5834327 Preparing driver circuit on temporary substrate, attaching onto first substrate, removing temporary substrate, forming liquid crystal material between substrates, using as passive display
11/10/1998US5834325 Light emitting device, wafer for light emitting device, and method of preparing the same
11/10/1998US5834323 Method of modification and testing flip-chips
11/10/1998US5834322 Heat treatment of Si single crystal
11/10/1998US5834321 Depositing protective layer over array, forming repair area exposing open circuit defect, depositing layer of conductive repair materials over array, forming planarized protective layer, removing portions of protective layer
11/10/1998US5834320 Method of assembling a semiconductor device using a magnet
11/10/1998US5834162 Process for 3D chip stacking
11/10/1998US5834161 Method for fabricating word lines of a semiconductor device
11/10/1998US5834159 Image reversal technique for forming small structures in integrated circuits
11/10/1998US5834143 Frame-supported dustproof pellicle for photolithographic photomask
11/10/1998US5834142 X-ray mask for forming accurate lithography patterns, reducing stress of x-ray absorber to zero, heat treatment, annealing
11/10/1998US5834125 Non-reactive anti-reflection coating
11/10/1998US5834106 Ceramic substrate and producing process thereof, and a suction carrier for wafers using a ceramic wafer-chucking substrate
11/10/1998US5834071 Polycrystalline silicon
11/10/1998US5834068 Heating a wafer than cooling with a high thermal conductive gas, adjusting flow rate to stabilize the temperature and reduce surface temperature variations
11/10/1998US5834060 High dielectric constant thin film structure method for forming high dielectric constant thin film and apparatus for forming high dielectric contact thin film
11/10/1998US5834059 Semiconductors
11/10/1998US5834035 Method of and apparatus for molding resin to seal electronic parts
11/10/1998US5833903 Injection molding encapsulation for an electronic device directly onto a substrate
11/10/1998US5833870 Method for forming a high density quantum wire
11/10/1998US5833869 Method for etching photolithographically produced quartz crystal blanks for singulation
11/10/1998US5833831 Method and system for generating electrolyzed water
11/10/1998US5833820 Gas shielding to prevent metal plating on contacts; reduces particle contamination and increases thickness uniformity
11/10/1998US5833817 Method for improving conformity and contact bottom coverage of sputtered titanium nitride barrier layers
11/10/1998US5833783 Lead frame taping apparatus and taping method
11/10/1998US5833760 Apparatus and method for cleaning semiconductor devices without leaving water droplets
11/10/1998US5833759 Method for preparing vias for subsequent metallization
11/10/1998US5833754 Deposition apparatus for growing a material with reduced hazard
11/10/1998US5833749 Compound semiconductor substrate and process of producing same
11/10/1998US5833745 Bi-based ferroelectric composition and thin film, method for forming the thin film, and non-volatile memory
11/10/1998US5833426 Magnetically coupled wafer extraction platform
11/10/1998US5833425 Semiconductor device manufacturing apparatus employing vacuum system
11/10/1998US5833290 Gripping tool
11/10/1998US5833288 For entry between suction targets stacked at distances from each other
11/10/1998US5833128 Flux-free contacting of components
11/10/1998US5833073 Tacky film frame for electronic device
11/10/1998US5832620 Staging apparatus
11/10/1998US5832601 Method of making temporary connections between electronic components
11/10/1998US5832600 Method of mounting electronic parts
11/10/1998US5832596 Method of making multiple-bond shelf plastic package
11/10/1998US5832595 Method of modifying conductive lines of an electronic circuit board and its apparatus
11/10/1998US5832585 Method of separating micro-devices formed on a substrate
11/10/1998CA2048164C Photoimageable electrodepositable photoresist composition
11/05/1998WO1998049762A1 Device for limiting electrical alternating currents, especially during short-circuits
11/05/1998WO1998049731A1 Silicon carbide field conrolled bipolar switch
11/05/1998WO1998049730A1 DESIGN AND FABRICATION OF ELECTRONIC DEVICES WITH InA1AsSb/A1Sb BARRIER
11/05/1998WO1998049729A1 Improved solid state image sensor
11/05/1998WO1998049726A1 Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device
11/05/1998WO1998049725A1 Method for making connection balls on electronic circuits or components
11/05/1998WO1998049724A1 Process for manufacturing semiconductor device
11/05/1998WO1998049723A1 Method of planarizing the upper surface of a semiconductor wafer
11/05/1998WO1998049722A1 Capacitors in integrated circuits
11/05/1998WO1998049721A1 Improved process for producing nanoporous silica thin films
11/05/1998WO1998049720A1 Vacuum processing method and apparatus
11/05/1998WO1998049719A1 Undoped silicon dioxide as etch stop for selective etch of doped silicon dioxide
11/05/1998WO1998049718A2 Method of manufacturing a semiconductor device with a multilayer wiring
11/05/1998WO1998049646A2 Dynamically reconfigurable assembly line for electronic products
11/05/1998WO1998049603A1 Antireflective coating compositions for photoresist compositions and use thereof
11/05/1998WO1998049602A1 Light absorbing polymers
11/05/1998WO1998049543A1 Scanning optical detection system
11/05/1998WO1998049521A1 Equipment for inspecting semiconductor devices
11/05/1998WO1998049378A1 Method for single crystal growth
11/05/1998WO1998049018A1 Method and apparatus for a substrate having an irregular shape
11/05/1998WO1998048608A2 Microbellows actuator
11/05/1998WO1998031046A3 Testing station for semiconductor wafers or wafer fragments
11/05/1998DE19819517A1 Electrode connection production for electronic component
11/05/1998DE19818286A1 Intermediate, semi-finished material for double standard strip
11/05/1998DE19817087A1 Production of buffer system, for polishing of silicon
11/05/1998DE19746706A1 Silicon solar cell production
11/05/1998DE19718398A1 Handling mechanism for semiconductor wafer testing system
11/05/1998DE19717152A1 Production of sharp-edged polyimide patterns on silicon chips
11/05/1998CA2287983A1 Capacitors in integrated circuits
11/05/1998CA2287249A1 Method for making connection balls on electronic circuits or components
11/04/1998EP0876089A2 Method for judging the propriety of cutting position on laminated board and laminated ceramic electronic part
11/04/1998EP0875997A2 A BiCMOS logic gate
11/04/1998EP0875991A1 Circuit arrangement for generating an electronically controlled resistor
11/04/1998EP0875944A1 Capacitors with silicized polysilicon shielding in digital CMOS process
11/04/1998EP0875943A2 Non-volatile semiconductor memory having programming region for injecting and ejecting carrier into and from floating gate
11/04/1998EP0875942A2 MOS transistor and its method of fabrication
11/04/1998EP0875938A1 Electronic material, its manufacturing method, ferroelectric capacitator, and non-volatile memory
11/04/1998EP0875937A2 DRAM cell array and method of making the same
11/04/1998EP0875936A2 Wiring substrate having vias
11/04/1998EP0875935A2 Semiconductor device having a projecting electrode
11/04/1998EP0875934A2 System and method for reinforcing a bond pad
11/04/1998EP0875932A2 Semi-conductor substrates and methods
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