| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 11/24/1998 | US5841102 Multiple pulse space processing to enhance via entrance formation at 355 nm |
| 11/24/1998 | US5841075 Method for reducing via inductance in an electronic assembly and article |
| 11/24/1998 | US5841074 For distributing power from a power source |
| 11/24/1998 | US5840897 Metal complex source reagents for chemical vapor deposition |
| 11/24/1998 | US5840821 Coating solution and method for preparing the coating solution, method for forming insulating films for semiconductor devices, and method for evaluating the coating solution |
| 11/24/1998 | US5840631 Forming wiring layer on substrate, adding catalyst gas, adding organosilicon compound as source gas for silicon oxide insulating film, forming wiring layer |
| 11/24/1998 | US5840630 FBI etching enhanced with 1,2 di-iodo-ethane |
| 11/24/1998 | US5840629 Copper chemical mechanical polishing slurry utilizing a chromate oxidant |
| 11/24/1998 | US5840628 Two step process of mixing titanium-based gas, nitrogen-based gas and hydrogen in first step of low mixing ratio and second step of increased mixing ratio |
| 11/24/1998 | US5840627 Method of customizing integrated circuits using standard masks and targeting energy beams for single resist development |
| 11/24/1998 | US5840626 Semiconductor device and method of manufacturing the same |
| 11/24/1998 | US5840625 Method of fabricating integrated circuit interconnection employing tungsten/aluminum layers |
| 11/24/1998 | US5840624 Using thin silicon nitride layer as etch stop to prevent attack of underlying interlevel dielectric layer |
| 11/24/1998 | US5840623 Efficient and economical method of planarization of multilevel metallization structures in integrated circuits using CMP |
| 11/24/1998 | US5840622 Phase mask laser fabrication of fine pattern electronic interconnect structures |
| 11/24/1998 | US5840621 Forming a silicon nitride layer between first and second conductive layers because silicon nitride layer does not react with conductive layer |
| 11/24/1998 | US5840619 Method of making a semiconductor device having a planarized surface |
| 11/24/1998 | US5840618 Method of manufacturing semiconductor device using an amorphous material |
| 11/24/1998 | US5840616 Method for preparing semiconductor member |
| 11/24/1998 | US5840615 Coating with organometallic solution; drying; oxidative sintering |
| 11/24/1998 | US5840614 Method of producing a semiconductor wafer using ultraviolet sensitive tape |
| 11/24/1998 | US5840613 Fabrication method for semiconductor device |
| 11/24/1998 | US5840612 Providing vertical integrated device having substrate, collector, base, emitter layers, forming photoresist, etching, exposing, developing, forming metal contacts |
| 11/24/1998 | US5840611 Forming insulating layer on substrate, forming conductive layer, patterning, etching, doping, removing etch pattern, oxidizing, doping, heating |
| 11/24/1998 | US5840610 Enhanced oxynitride gate dielectrics using NF3 gas |
| 11/24/1998 | US5840609 Method of manufacturing semiconductor device having stacked gate electrode structure |
| 11/24/1998 | US5840608 High density ROM and a method of making the same |
| 11/24/1998 | US5840607 Forming tunnel oxide layer on substrate, forming floating gate layer by sequentially forming undoped polysilicon layer, doped polysilicon layer, forming dielectric layer, gate, oxide layer, patterning |
| 11/24/1998 | US5840606 Method for manufacturing a comb-shaped lower electrode for a DRAM capacitor |
| 11/24/1998 | US5840605 Dual layer polysilicon capacitor node DRAM process |
| 11/24/1998 | US5840604 Methods of forming MOS transistors having hot-carrier suppression electrodes |
| 11/24/1998 | US5840603 Method for fabrication BiCMOS integrated circuit |
| 11/24/1998 | US5840602 Methods of forming nonmonocrystalline silicon-on-insulator thin-film transistors |
| 11/24/1998 | US5840601 Thin film transistor and method for making same |
| 11/24/1998 | US5840600 Stabilizing the interface between silicon film and oxidized silicon oxide layer by heat annealing the oxidation film in presence of ultraviolet light decomposed nitrogen oxide, nitriding a silicon bond |
| 11/24/1998 | US5840596 Forming undoped and doped silicon or silicon alloy layers, forming n-channel transistor, forming p-channel transistor, forming electrodes |
| 11/24/1998 | US5840595 Calibration of semiconductor pattern inspection device and a fabrication process of a semiconductor device using such an inspection device |
| 11/24/1998 | US5840594 Method of and apparatus for mounting electronic parts on a board |
| 11/24/1998 | US5840593 Membrane dielectric isolation IC fabrication |
| 11/24/1998 | US5840591 Method of manufacturing buried bit line DRAM cell |
| 11/24/1998 | US5840590 Impurity gettering in silicon using cavities formed by helium implantation and annealing |
| 11/24/1998 | US5840589 Method for fabricating monolithic and monocrystalline all-semiconductor three-dimensional integrated circuits |
| 11/24/1998 | US5840447 Multi-phase photo mask using sub-wavelength structures |
| 11/24/1998 | US5840446 Semiconductors |
| 11/24/1998 | US5840445 Method of manufacturing a self-aligned phase-shifting mask |
| 11/24/1998 | US5840427 A diamond-like carbon inorganic coatings over a silicon film; protective coatings, stress resistance |
| 11/24/1998 | US5840417 A multiplicity of electrically conductive adhesive members, each being separated from each other by means of a non-electrically conductive adhesive; useful in the assembly of multi-chip modules and multilayer electronic devices |
| 11/24/1998 | US5840382 Ceramic substrate, glass adhesive layer; nonwarping, noncracking; capacitors, resistors |
| 11/24/1998 | US5840368 Apparatus for forming low-temperature oxide films and method of forming low-temperature oxide films |
| 11/24/1998 | US5840366 Method of forming thin film |
| 11/24/1998 | US5840205 Searching for defect, cutting wafer adjacent defect, molding with resin, grinding substrate to form ground face, etching to expose defect |
| 11/24/1998 | US5840203 In-situ bake step in plasma ash process to prevent corrosion |
| 11/24/1998 | US5840202 Apparatus and method for shaping polishing pads |
| 11/24/1998 | US5840200 Method of manufacturing semiconductor devices |
| 11/24/1998 | US5840167 Sputtering deposition apparatus and method utilizing charged particles |
| 11/24/1998 | US5840129 Hesitation free roller |
| 11/24/1998 | US5840127 Surface treating agents and treating process for semiconductors |
| 11/24/1998 | US5840126 Washing material in aqueous solution containing water repellent surfactant, applying sonication to remove contaminants, allowing monomolecular layer of surfactant to form on surface, rinsing with pure water, drying |
| 11/24/1998 | US5840125 Rapid thermal heating apparatus including a substrate support and an external drive to rotate the same |
| 11/24/1998 | US5840118 Preparing semiconductor film on substrate, directing pulsed laser beam toward substrate to selectively heat portions of film |
| 11/24/1998 | US5840117 Method for surface flattening a crystal substrate |
| 11/24/1998 | US5840116 Crystallizing the single silicon crystal with uniform oxygen concentration distribution by melting, applying a low magnetic field |
| 11/24/1998 | US5840115 Single crystal growth method |
| 11/24/1998 | US5840110 Metal alkoxycarboxylate-based liquids |
| 11/24/1998 | US5839877 Suction holding assembly for lead frames |
| 11/24/1998 | US5839722 Fluid flow transport system for moving a flexible object |
| 11/24/1998 | US5839645 Bonding machine of electronic components and bonding method thereof |
| 11/24/1998 | US5839641 Apparatus for placing and aligning solder balls onto solder pads on a substrate for manufacturing IC devices |
| 11/24/1998 | US5839460 Apparatus for cleaning semiconductor wafers |
| 11/24/1998 | US5839456 Wafer wet treating apparatus |
| 11/24/1998 | US5839455 Enhanced high pressure cleansing system for wafer handling implements |
| 11/24/1998 | US5839424 Process for the orientation of several single crystals disposed side by side on a cutting support for their simultaneous cutting in a cutting machine and device for practicing this process |
| 11/24/1998 | US5839324 Stage apparatus and exposure apparatus provided with the stage apparatus |
| 11/24/1998 | US5839191 Vibrating template method of placing solder balls on the I/O pads of an integrated circuit package |
| 11/24/1998 | US5839187 Apparatus and method for mounting a chip |
| 11/24/1998 | CA2102880C System using induced current for contactless testing of wiring networks |
| 11/24/1998 | CA2089791C Electronic devices having metallurgies containing copper-semiconductor compounds |
| 11/24/1998 | CA2071085C Rolling element cage constraint |
| 11/24/1998 | CA2064922C Tapering sidewalls of via holes |
| 11/19/1998 | WO1998052389A1 Plasma focus high energy photon source |
| 11/19/1998 | WO1998052278A2 An amplified mos biasing circuit for avoiding latch-up |
| 11/19/1998 | WO1998052258A1 Improved laser cutting methods |
| 11/19/1998 | WO1998052257A1 Improved laser cutting apparatus |
| 11/19/1998 | WO1998052234A1 Method of doping silicon, metal doped silicon, method of making solar cells, and solar cells |
| 11/19/1998 | WO1998052232A1 A PN-DIODE OF SiC AND A METHOD FOR PRODUCTION THEREOF |
| 11/19/1998 | WO1998052226A1 Method and apparatus for identifying integrated circuits |
| 11/19/1998 | WO1998052224A1 Lithographically defined microelectronic contact structures |
| 11/19/1998 | WO1998052220A1 Process for manufacturing semiconductor package and circuit board assembly |
| 11/19/1998 | WO1998052219A1 Reliability barrier integration for cu metallisation |
| 11/19/1998 | WO1998052218A1 Connector and probing system |
| 11/19/1998 | WO1998052217A2 Method of forming a chip scale package, and a tool used in forming the chip scale package |
| 11/19/1998 | WO1998052216A1 A controlled cleavage process |
| 11/19/1998 | WO1998052215A1 Spacer structure as transistor gate |
| 11/19/1998 | WO1998052214A2 Magnetically-levitated rotor system for an rtp chamber |
| 11/19/1998 | WO1998052213A1 Reflector cover for a semiconductor processing chamber |
| 11/19/1998 | WO1998052212A1 Pick and place cutting head that separates chip scale packages from a multi-layered film strip |
| 11/19/1998 | WO1998052211A2 Integrated cmos circuit configuration, and production of same |
| 11/19/1998 | WO1998052208A1 Method and apparatus for producing a uniform density plasma above a substrate |
| 11/19/1998 | WO1998052207A2 Central coil design for ionized metal plasma deposition |
| 11/19/1998 | WO1998051844A1 Co-rotating edge ring extension for use in a semiconductor processing chamber |