Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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11/19/1998 | WO1998051838A1 Low resistivity w using b2h¿6? |
11/19/1998 | WO1998051837A2 Chemical vapour deposition precursors |
11/19/1998 | WO1998051819A1 Methods for electronic fluorescent perturbation for analysis and electronic perturbation catalysis for synthesis |
11/19/1998 | WO1998051756A1 Adhesive, method for bonding, and assemblies of mounted boards |
11/19/1998 | WO1998051718A1 Alkali-soluble resins and image-forming material prepared by using the same |
11/19/1998 | WO1998051488A1 Bonded joint |
11/19/1998 | WO1998051430A1 A method of producing a heat transfer device |
11/19/1998 | DE19811046A1 Electronic device with Schottky contact |
11/19/1998 | DE19800089A1 Transistor-containing semiconductor device e.g. memory device |
11/19/1998 | DE19750918A1 Semiconductor device especially DRAM cell |
11/19/1998 | DE19746408A1 Electronic component mounting method for laser diode |
11/19/1998 | DE19738922A1 Integrated circuit leadframe assembly device e.g. for chip mounting |
11/19/1998 | DE19731090C1 Thin film transistor active matrix production |
11/19/1998 | DE19730644C1 Detecting material transition in semiconductor structure |
11/19/1998 | DE19720847A1 Flexible bonding wire positioner for ultrasonic wire bonding |
11/19/1998 | DE19720680A1 Novel complementary C-MOS transistor pair |
11/19/1998 | DE19720193A1 Vertical metal-oxide-semiconductor transistor integrated circuit |
11/19/1998 | DE19719909A1 Dual damascene process for integrated circuits |
11/19/1998 | CA2290104A1 A controlled cleavage process |
11/19/1998 | CA2289733A1 Adhesive, method for bonding, and assemblies of mounted boards |
11/18/1998 | EP0878985A2 Electronic part for mounting on a substrate |
11/18/1998 | EP0878848A1 Vertical bipolar semiconductor power transistor with an interdigitised geometry, with optimisation of the base-to-emitter potential difference |
11/18/1998 | EP0878847A1 Ferroelectric material, nonvolatile memory device and their manufacturing methods |
11/18/1998 | EP0878844A2 High frequency apparatus including a low loss substrate |
11/18/1998 | EP0878843A2 Method of sputtering copper to fill trenches and vias |
11/18/1998 | EP0878842A1 Method and apparatus for monitoring processes using multiple parameters of a semiconductor wafer processing system |
11/18/1998 | EP0878841A2 Method and apparatus for imaging semiconductor devices |
11/18/1998 | EP0878840A1 Connecting structure of semiconductor element, liquid crystal display device using the structure, and electronic equipment using the display device |
11/18/1998 | EP0878839A1 Semiconductor unit package and semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging |
11/18/1998 | EP0878838A2 Process for chemical-mechanical polishing of semiconductor or insulating layers |
11/18/1998 | EP0878837A2 Ferroelectric thin film comprising a bufferlayer and a Bismuth layered compound |
11/18/1998 | EP0878836A2 Planarising a semiconductor substrate |
11/18/1998 | EP0878835A1 Etching method for silicon substrate |
11/18/1998 | EP0878834A2 A method for preventing electroplanting of copper on an exposed surface at the edge exclusion of a semiconductor wafer |
11/18/1998 | EP0878833A2 Process for the selective formation of salicide on active areas of MOS devices |
11/18/1998 | EP0878832A2 Drying processing method and apparatus using same |
11/18/1998 | EP0878831A2 Double side cleaning apparatus for semiconductor substrate |
11/18/1998 | EP0878826A2 Use of variable impedance to control coil sputter distribution |
11/18/1998 | EP0878825A2 Use of a variable impedance to control RF coil heating, substrate heating, and film deposition uniformity in a plasma reactor |
11/18/1998 | EP0878824A2 Method and apparatus for etching a workpiece |
11/18/1998 | EP0878823A2 Plasma-enhanced chemical vapor deposition apparatus and method M |
11/18/1998 | EP0878822A1 Charged Particle beam exposure apparatus having a stage position measurement device |
11/18/1998 | EP0878769A2 Method for verification of combinational circuits using a filtering oriented approach |
11/18/1998 | EP0878762A1 Method and apparatus for converting test signals |
11/18/1998 | EP0878761A1 Method and apparatus for diagnosing failure occurrence position |
11/18/1998 | EP0878560A2 Vapor generating method and apparatus using same |
11/18/1998 | EP0878559A1 Apparatus for transport of plate shaped substrates |
11/18/1998 | EP0878270A2 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
11/18/1998 | EP0878268A2 Polishing apparatus and method for hard material-coated wafer |
11/18/1998 | EP0878245A2 Thin film-forming method and apparatus therefor |
11/18/1998 | EP0878025A1 Semiconductor device with a high-frequency bipolar transistor on an insulating substrate |
11/18/1998 | EP0878023A1 Contact bump structure and method for fabricating contact bumps |
11/18/1998 | EP0878022A1 Method for forming ultra-thin gate oxides |
11/18/1998 | EP0878020A1 Electromagnetic high-frequency or microwave apparatus |
11/18/1998 | EP0800706B1 Forming polyimide and polyimidesiloxane coatings by screen printing |
11/18/1998 | EP0797792B1 Photolithographic method of producing structural features |
11/18/1998 | EP0786148A4 Radiation hardened charge coupled device |
11/18/1998 | EP0781424B1 Photolithographic method of producing structural features |
11/18/1998 | EP0780006B1 Process for producing a smart card module for contactless smart cards |
11/18/1998 | EP0681713B1 Sulphonic acid esters, radiation-sensitive mixtures made therewith, and their use |
11/18/1998 | CN1199507A Separating method, method for transferring thin film device, thin film device, thin film IC device and liquid crystal display device mfg by using transferring method |
11/18/1998 | CN1199506A Integrated circuit comprising substrate and wiring layer with buffer layer between substrate and wiring layer |
11/18/1998 | CN1199504A Glass/metal package and method for producing same |
11/18/1998 | CN1199429A Improved polishing slurries and method for their use |
11/18/1998 | CN1199319A Print board assembly producing system and method |
11/18/1998 | CN1199278A Low voltage operated oscillator |
11/18/1998 | CN1199248A Semiconductor device and mfg. method thereof |
11/18/1998 | CN1199247A Semiconductor device and manufacturing method thereof |
11/18/1998 | CN1199246A Method of manufacturing semiconductor device |
11/18/1998 | CN1199245A Method of forming integrated circuit capacitors and capacitors formed thereby |
11/18/1998 | CN1199244A Method of manufacturing semiconductor device having MOS transistor and bipolar transistor in mixture on same substrate |
11/18/1998 | CN1199241A Semiconductor integrated circuit |
11/18/1998 | CN1199192A Control apparatus and control method |
11/17/1998 | US5838951 Wafer map conversion method |
11/17/1998 | US5838629 Dynamic random access memory device |
11/17/1998 | US5838621 Spare decoder circuit |
11/17/1998 | US5838617 Method for changing electrically programmable read-only memory devices |
11/17/1998 | US5838615 Nonvolatile semiconductor memory device having reduced source line resistance |
11/17/1998 | US5838611 Nonvolatile semiconductor device and method of manufacturing same |
11/17/1998 | US5838605 Ferroelectric memory cell |
11/17/1998 | US5838604 Semiconductor memory device with an increased band width |
11/17/1998 | US5838581 Layout system for logic circuit |
11/17/1998 | US5838546 Mounting structure for a semiconductor circuit |
11/17/1998 | US5838530 Antifuses |
11/17/1998 | US5838529 Low voltage electrostatic clamp for substrates such as dielectric substrates |
11/17/1998 | US5838528 For retaining a wafer in a processing chamber |
11/17/1998 | US5838450 Direct reticle to wafer alignment using fluorescence for integrated circuit lithography |
11/17/1998 | US5838448 CMP variable angle in situ sensor |
11/17/1998 | US5838443 Exposure apparatus implementing priority speed setting arrangement |
11/17/1998 | US5838434 For calibration of semiconductor package outlines |
11/17/1998 | US5838426 Exposure apparatus and method which changes wavelength of illumination light in accordance with pressure changes occurring around projection optical system |
11/17/1998 | US5838399 TFT active matrix liquid crystal display devices with two layer gate lines, the first being the same level as gate electrodes. |
11/17/1998 | US5838361 Laser marking techniques |
11/17/1998 | US5838335 Graphic data processing method and device |
11/17/1998 | US5838174 Photocoupler having element isolation layers for low cross-talk low stress and high break down voltage |
11/17/1998 | US5838163 Testing and exercising individual, unsingulated dies on a wafer |
11/17/1998 | US5838160 Integral rigid chip test probe |
11/17/1998 | US5838121 Apparatus for transferring wafers |
11/17/1998 | US5838110 Powered by an ac supply source |
11/17/1998 | US5838093 Piezoelectric element package in which a piezoelectric element on a chip carrier is reliably shielded by using a cap |