Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2000
12/05/2000US6155198 A vapor deposition processing chamber comprising a radio frequency signal connected to a showerhead and a second radio frequency signal connected to a wafer support
12/05/2000US6155131 Handling robot
12/05/2000US6155027 Method and apparatus for packaging contaminant-sensitive articles and resulting package
12/05/2000CA2116678C Thermal isolation microstructure
12/01/2000CA2310358A1 Heat sinks for cpus for use in personal computers
11/2000
11/30/2000WO2000072645A1 Laser machining of plastic film of circuit board, and method of manufacturing circuit board
11/30/2000WO2000072644A1 Sheet for printed wiring board, method of forming via, resin sheet having filled via, printed wiring board and method of manufacturing the same
11/30/2000WO2000072636A1 Device and method for thermally treating substrates
11/30/2000WO2000072382A1 Ferroelectric based memory devices utilizing hydrogen getters and recovery annealing
11/30/2000WO2000072380A1 Robust interconnect structure
11/30/2000WO2000072379A1 Thermal capacity for electronic component operating in long pulses
11/30/2000WO2000072378A1 Substrate with at least two metallized polymer bumps for soldered connection to wiring
11/30/2000WO2000072377A1 Method for creating a trench contact for a memory location arrangement
11/30/2000WO2000072376A1 Electrostatic chuck and treating device
11/30/2000WO2000072375A1 Container for holder exposure apparatus, device manufacturing method, and device manufacturing apparatus
11/30/2000WO2000072374A1 Detection of processing-induced defects in silicon wafer
11/30/2000WO2000072373A1 Method for manufacturing nanostructured thin film electrodes
11/30/2000WO2000072372A1 Trench semiconductor device having gate oxide layer with multiple thicknesses and processes of fabricating the same
11/30/2000WO2000072371A1 Fabrication of integrated circuit by selective deposition of precursor liquid
11/30/2000WO2000072370A1 Method for etching silicon oxynitride and dielectric antireflection coatings
11/30/2000WO2000072369A1 Method for producing a damascene-type interconnection level comprising an organic dielectric
11/30/2000WO2000072368A1 Process for etching a silicon wafer
11/30/2000WO2000072367A1 Silicon wafering process flow
11/30/2000WO2000072366A1 Method for improving thickness uniformity of semiconductor wafers
11/30/2000WO2000072364A1 Apparatus for curing resist
11/30/2000WO2000072363A1 Process for removing contaminant from a surface and composition useful therefor
11/30/2000WO2000072362A1 Installation for processing wafers
11/30/2000WO2000072361A2 Apparatus and method for testing of sheet material
11/30/2000WO2000072359A2 Source-down power transistor
11/30/2000WO2000072355A1 Apparatus and methods for secondary electron emission microscopy with dual beam
11/30/2000WO2000072185A2 Behavioral-synthesis electronic design automation tool and business-to-business application service provider
11/30/2000WO2000072090A2 A method for error reduction in lithography
11/30/2000WO2000072080A1 Method and apparatus for providing rectangular shaped array of light beams
11/30/2000WO2000072030A1 Method and apparatus for wireless testing of integrated circuits
11/30/2000WO2000071921A2 Burrless castellation via process and product for plastic chip carrier
11/30/2000WO2000071787A2 Semi-insulating silicon carbide without vanadium domination
11/30/2000WO2000071782A1 Methods for wet processing electronic components having copper containing surfaces
11/30/2000WO2000071778A1 Protective gas shield apparatus
11/30/2000WO2000071550A1 Copper source reagent compositions, and method of making and using same for microelectronic device structures
11/30/2000WO2000071497A1 Gas for plasma reaction and method for production thereof
11/30/2000WO2000071297A1 Chemical mechanical planarization or polishing pad with sections having varied groove patterns
11/30/2000WO2000071268A1 Temperature controlled gassification of deionized water for megasonic cleaning of semiconductor wafers
11/30/2000WO2000059681B1 Cmp pad conditioner arrangement and method therefor
11/30/2000WO2000045196A3 Method and device for optically examining structured surfaces of objects
11/30/2000WO2000042231A3 Polycrystalline silicon germanium films for forming micro-electromechanical systems
11/30/2000WO2000041518A3 Electrodeposition chemistry for filling of apertures with reflective metal
11/30/2000WO2000041230A3 Electron beam treatment of siloxane resins
11/30/2000WO2000026941A3 Word line driver for semiconductor memories
11/30/2000WO1999040615A9 Method and apparatus for low-temperature annealing of metallization micro-structures in the production of a microelectronic device
11/30/2000DE19960458A1 Vorrichtung zum Polieren von Scheiben An apparatus for polishing wafers
11/30/2000DE19927962A1 Verfahren zum Erzeugen von Defekten in einer Gitterstruktur eines Halbleitermaterials A method of generating defects in a lattice structure of a semiconductor material
11/30/2000DE19926462C1 Verfahren und Vorrichtung zum Behandeln von Substraten Method and apparatus for treating substrates
11/30/2000DE19924935C1 Verfahren zur Herstellung von dreidimensionalen Schaltungen A process for producing three-dimensional circuits,
11/30/2000DE19924649A1 Semiconductor wafer, for semiconductor device production, has a non-uniform lattice defect distribution or oxygen precipitate nucleation center concentration profile
11/30/2000DE19924571A1 Verfahren zur Herstellung eines Doppel-Gate-MOSFET-Transistors A method for producing a double gate MOSFET transistor
11/30/2000DE19924058A1 Surface decontamination apparatus, especially for organic contaminant removal from a structured silicon wafer or body, comprises an ozone reactor in which a structured body is heated during ozone exposure
11/30/2000DE19923522A1 Source-Down-Leistungstransistor Source-down power transistor
11/30/2000DE19923400A1 Vorrichtung und Verfahren zum thermischen Behandeln von Substraten Apparatus and method for thermal treatment of substrates
11/30/2000DE19923385A1 Centrifuge for semiconductor disc, has apparatus which generates layer-like gas flow provided in casing which separates centrifugation process area and semiconductor disc from peripheral outer air
11/30/2000DE19922498A1 Vorrichtung zum einseitigen Ätzen einer Halbleiterscheibe Device for one-sided etching of a semiconductor wafer
11/30/2000DE19921867A1 Semiconductor component, e.g. a polymer stud grid array component, is produced by forming connected conductor lines outside an encapsulation region and, after chip mounting and encapsulation, separating the lines
11/30/2000DE19921113A1 Chip-on-board (COB) assembly method for assembling electronic chips on circuit boards
11/30/2000DE19920871A1 UV-unterstützte thermische Behandlung von Verbindungshalbleitern in RTP-Systemen UV-assisted thermal treatment of compound semiconductors in RTP systems
11/30/2000DE10025589A1 Stage apparatus for holding workpiece e.g. semiconductor wafer has magnetic motor for moving stage along X-axis and nonmagnetic motor for moving stage along Y-axis
11/30/2000CA2371980A1 Method for manufacturing nanostructured thin film electrodes
11/30/2000CA2336370A1 Method and apparatus for providing rectangular shaped array of light beams
11/29/2000WO2001041202A1 Heat treating device and heat treating method
11/29/2000EP1056139A2 Method for manufacturing photoelectric conversion device
11/29/2000EP1056135A1 Field-effect transistor and method of manufacturing same
11/29/2000EP1056134A2 Trench-gated device having trench walls formed by selective epitaxial growth and process for forming the device
11/29/2000EP1056128A2 Semiconductor memory device and method of fabricating the same
11/29/2000EP1056127A2 Method and apparatus for correlating data from a semiconductor wafer process
11/29/2000EP1056126A2 Electronic device, method of manufacturing the same, and apparatus for manufacturing the same
11/29/2000EP1056125A2 Lead germanate ferroelectric structure with multi-layered electrode
11/29/2000EP1056124A2 Assembly for wafer handling system
11/29/2000EP1056123A2 Dual buffer chamber cluster tool for semiconductor wafer processing
11/29/2000EP1056122A2 Substrate treating apparatus and method of operating the same
11/29/2000EP1056121A2 Method and apparatus for cleaning semiconductor wafers with a deionized water solution containing a gas at saturated concentration, with temperature controlled degasification and megasonic agitation
11/29/2000EP1056114A2 Ion implantation apparatus
11/29/2000EP1056113A2 Ion implanter and a method of implanting ions
11/29/2000EP1055920A1 Semiconductor pressure sensor and its manufacturing method
11/29/2000EP1055749A1 Process for producing a semiconductor wafer
11/29/2000EP1055747A1 Apparatus and method for forming a film on a substrate
11/29/2000EP1055746A1 Method of chemical vapor depositing tungsten films
11/29/2000EP1055486A2 Dressing apparatus and polishing apparatus
11/29/2000EP1055479A2 Laser irradiation apparatus
11/29/2000EP1055463A2 Wafer cleaning apparatus
11/29/2000EP1055448A2 Method of filtering a fluid
11/29/2000EP1055447A2 Method of filtering a fluid
11/29/2000EP1055446A2 Method of fabricating a semiconductor device with process liquid recycling
11/29/2000EP1055445A2 Apparatus for filtering a fluid
11/29/2000EP1055253A1 Device for loading substrates into and unloading them from a clean room
11/29/2000EP1055252A1 Substrate support for a thermal processing chamber
11/29/2000EP1055250A1 Plasma processing apparatus
11/29/2000EP1055249A1 Plasma assisted processing chamber with separate control of species density
11/29/2000EP1055163A1 High-speed precision positioning apparatus
11/29/2000EP1055155A1 Euv illumination system
11/29/2000EP1055154A1 Photomask provided with an esd-precluding envelope
11/29/2000EP1055153A1 Photomask with a mask edge provided with a ring-shaped esd protection area
11/29/2000EP1055020A2 Plating apparatus and method