Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2000
11/14/2000US6145499 Wire saw
11/14/2000US6145469 Plasma processing apparatus and processing method
11/14/2000US6145444 Micro clean sealed tubular transporter apparatus
11/14/2000US6145438 Method and apparatus for direct writing of semiconductor die using microcolumn array
11/14/2000US6145365 Method for forming a recess portion on a metal plate
11/14/2000US6145190 Method of assembling parts on a printed circuit board
11/14/2000US6145148 Method and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF)
11/14/2000CA2139637C Dose modulation and pixel deflection for raster scan lithography
11/09/2000WO2000067538A1 Method for manufacturing solderless high density electronic modules
11/09/2000WO2000067536A1 A method for making flexible circuits
11/09/2000WO2000067377A2 Mask configurable smart power circuits - applications and gs-nmos devices
11/09/2000WO2000067334A1 Universal tool interface and/or workpiece transfer apparatus for smif and open pod applications
11/09/2000WO2000067331A1 Ferroelectric field effect transistor having compositionally graded ferroelectric material and method of making the same
11/09/2000WO2000067329A1 A semiconductor element
11/09/2000WO2000067327A1 Minimally-patterned semiconductor devices for display applications
11/09/2000WO2000067326A1 Trench capacitor dram cell with vertical transistor
11/09/2000WO2000067324A1 Integrated circuit, method of manufacture thereof, and method of producing mask pattern
11/09/2000WO2000067322A2 Self-aligned source and drain extensions fabricated in a damascene contact and gate process
11/09/2000WO2000067321A2 6-t static random access memory (sram) having vertical cmos transistors
11/09/2000WO2000067319A1 Security method and device for a chip stack with a multidimensional structure
11/09/2000WO2000067318A1 Method and apparatus relating to interconnect lines
11/09/2000WO2000067317A1 Semiconductor device and method of manufacturing same
11/09/2000WO2000067316A2 Method for producing a portable electronic device with an integrated circuit protected by a photosensitive resin
11/09/2000WO2000067315A1 Semiconductor chip package
11/09/2000WO2000067313A1 Double gated transistor
11/09/2000WO2000067312A1 Method for removing defects from silicon bodies by a selective etching process
11/09/2000WO2000067311A2 Method for producing a wafer support in a high-temperature cvd reactor
11/09/2000WO2000067310A1 Microelectronic subassembly
11/09/2000WO2000067309A1 Method of manufacturing a semiconductor device comprising a field effect transistor
11/09/2000WO2000067308A1 Techniques for etching a low capacitance dielectric layer
11/09/2000WO2000067307A1 Methods for plasma etching silicon
11/09/2000WO2000067306A1 Method for anisotropic plasma etching of semiconductors
11/09/2000WO2000067305A1 Wafer polishing method and cleaning method, and protection film
11/09/2000WO2000067304A1 Method for removal of sic
11/09/2000WO2000067301A2 Method of making shallow junction semiconductor devices
11/09/2000WO2000067299A2 Method for generating defects in a grid support of a semiconductor material
11/09/2000WO2000067298A1 Spatially resolved temperature measurement and irradiance control
11/09/2000WO2000067297A2 Method of producing a semiconductor element
11/09/2000WO2000067291A2 Microfabricated template for multiple charged particle beam calibrations and shielded charged particle beam lithography
11/09/2000WO2000067289A1 Apparatus and method for reducing charge accumulation on a substrate
11/09/2000WO2000067281A1 Plasma etching
11/09/2000WO2000067164A1 Method and apparatus for creating testable circuit designs having embedded cores
11/09/2000WO2000067076A1 Improved method and apparatus for submicron ic design using edge fragment tagging to correct edge placement distortion
11/09/2000WO2000067074A1 Streamlined ic mask layout optical and process correction through correction reuse
11/09/2000WO2000066987A1 System and process for calibrating pyrometers in thermal processing chambers
11/09/2000WO2000066969A2 Interferometry system having a dynamic beam-steering assembly for measuring angle and distance
11/09/2000WO2000066697A1 Compositions for cleaning organic and plasma etched residues for semiconductor devices
11/09/2000WO2000066549A2 Apparatus and methods for collecting global data during a reticle inspection
11/09/2000WO2000066480A2 Edge gripping end effector wafer handling apparatus
11/09/2000WO2000066340A1 Method for manufacturing encapsulated electronical components
11/09/2000WO2000066312A1 Method for producing weld points on a substrate and guide for implementing said method
11/09/2000WO2000055971A8 Methods and apparatus for bipolar elimination in silicon-on-insulator (soi) domino circuits
11/09/2000WO2000035627A3 Multi-step chemical mechanical polishing
11/09/2000WO2000029640A9 Method for residue-free anisotropic etching of aluminum and its alloys
11/09/2000WO2000019528A9 Dram cell system and method for producing same
11/09/2000WO2000016407A3 Switching transistor with reduced switching losses
11/09/2000WO1999063580A3 Compound semiconductor structure with lattice and polarity matched heteroepitaxial layers
11/09/2000DE19929776A1 Production of a device for manufacturing semiconductors comprises forming a protective layer on a substrate, joining to a further substrate and alternately forming a film with high molecular weight and etching
11/09/2000DE19929308C1 Ferroelectric memory structure is produced by forming vias and conductive structures for connecting short-circuit transistors to upper capacitor electrodes
11/09/2000DE19929307C1 Structured layer, especially a FRAM capacitor lower electrode, is produced by heat treatment to cause layer material migration from a migration region to a target region of a substrate
11/09/2000DE19921230A1 Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten A method of handling of the thinned chip for insertion into chip cards
11/09/2000DE19921072A1 Einrichtung zum Handhaben von Substraten innerhalb und außerhalb eines Reinstarbeitsraumes Means for manipulating substrates inside and outside an ultraclean workroom
11/09/2000DE19919832A1 Verfahren zum anisotropen Plasmaätzen von Halbleitern A method for anisotropic plasma etching of semiconductors
11/09/2000DE19919471A1 Verfahren zur Beseitigung von Defekten von Siliziumkörpern durch selektive Ätzung A method for removing defects of silicon bodies by selective etching
11/09/2000DE19919110A1 Verfahren zum Strukturieren einer Metall- oder Metallsilizidschicht sowie ein mit diesem Verfahren hergestellter Kondensator A method for patterning a metal or metal silicide layer as well as a capacitor manufactured by this method
11/09/2000DE10020259A1 Production of a floating gate in a semiconductor component comprises forming a tunnel oxide layer, a polycrystalline silicon layer, an intermediate layer and a silicon nitride layer on a semiconductor substrate, and structuring
11/09/2000DE10018694A1 HEMT component on InP base with Schottky barrier with variable aluminium percentage content has lower layer with first aluminium content, per layer with higher concentration region
11/09/2000DE10017233A1 Verfahren zum Deponieren einer Schicht A method for depositing a layer
11/09/2000DE10012118A1 High frequency circuit apparatus e.g. for filter, has slits in electrodes opposing capacitance element for reducing eddy current loss
11/09/2000CA2372101A1 Minimally-patterned semiconductor devices for display applications
11/09/2000CA2369658A1 A method for making flexible circuits
11/09/2000CA2336557A1 Microfabricated template for multiple charged particle beam calibrations and shielded charged particle beam lithography
11/09/2000CA2336369A1 Apparatus and method for reducing charge accumulation on a substrate
11/09/2000CA2336107A1 Mask configurable smart power circuits - applications and gs-nmos devices
11/08/2000EP1050905A2 Semiconductor device with insulating layer
11/08/2000EP1050904A1 Method and apparatus for wafer processing
11/08/2000EP1050903A1 Ultrasonic bonding method and ultrasonic bonding apparatus
11/08/2000EP1050902A2 Method for forming a copper layer over a semiconductor wafer
11/08/2000EP1050901A2 Method of separating composite member and process for producing thin film
11/08/2000EP1050900A1 Exposure system, exposure apparatus, and coating developing exposure apparatus
11/08/2000EP1050899A1 An ultrasonic washing apparatus
11/08/2000EP1050898A2 An apparatus and method for aligning a processed wafer for regrinding and/or polishing
11/08/2000EP1050888A1 Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and method for manufacturing ceramic electronic part
11/08/2000EP1050844A1 Method of manufacturing a chip card
11/08/2000EP1050602A2 Process chamber with inner support
11/08/2000EP1050601A1 Thermal CVD process for depositing a low dielectric constant carbon-doped silicon oxide film
11/08/2000EP1050600A1 Thermal CVD process for depositing a low dielectric constant carbon-doped silicon oxide film
11/08/2000EP1050599A2 Method of forming interlayer insulating film
11/08/2000EP1050370A2 Grinding machine with a short stiffness loop between tool and workpiece
11/08/2000EP1050369A2 Method and apparatus for polishing workpieces
11/08/2000EP1050076A1 Method for producing diodes
11/08/2000EP1050075A1 Nanoporous silica dielectric films modified by electron beam exposure and having low dielectric constant and low water content
11/08/2000EP1050074A1 Anisotropic etching of organic-containing insulating layers
11/08/2000EP1050073A1 Method of eliminating edge effect in chemical vapor deposition of a metal
11/08/2000EP1050072A1 An improved high quality factor capacitor
11/08/2000EP1050071A2 Lateral thin-film silicon-on-insulator (soi) device having multiple doping profile slopes in the drift region
11/08/2000EP1050070A2 Holding device for a substrate
11/08/2000EP1050069A1 Device and method for treating substrates
11/08/2000EP1050068A1 Wafer cassette load station
11/08/2000EP1049960A1 Method of detecting aberrations of an optical imaging system
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