Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2000
11/28/2000US6153123 For flat panel display devices such as liquid crystal displays, plasma displays, thick film and thin film electroluminescent displays and field emission displays; narrow particle size distribution, spherical morphology
11/28/2000US6153115 Monitor of plasma processes with multivariate statistical analysis of plasma emission spectra
11/28/2000US6153068 Parallel plate sputtering device with RF powered auxiliary electrodes and applied external magnetic field
11/28/2000US6153044 Protection of lithographic components from particle contamination
11/28/2000US6153043 Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing
11/28/2000US6153018 Metal rinsing process with controlled metal microcorrosion reduction
11/28/2000US6153014 Using mixture of ammonium hydroxide, hydrogen peroxide and water
11/28/2000US6153012 Device for treating a substrate
11/28/2000US6153010 Method of growing nitride semiconductors, nitride semiconductor substrate and nitride semiconductor device
11/28/2000US6153008 Device and method for pulling a single crystal
11/28/2000US6152818 Flow control apparatus for a semiconductor manufacturing wet bench
11/28/2000US6152755 Device for loading/unloading modular IC to/from socket in modular IC handler
11/28/2000US6152680 Wafer cassette rotation mechanism
11/28/2000US6152677 Apparatus for and method of transferring substrates
11/28/2000US6152669 Mechanical interface apparatus
11/28/2000US6152507 Conveying device for thin disk-like articles
11/28/2000US6152153 Substrate cleaning/drying equipment and substrate cleaning/drying method
11/28/2000US6152148 Method for cleaning semiconductor wafers containing dielectric films
11/28/2000US6152074 Deposition of a thin film on a substrate using a multi-beam source
11/28/2000US6152073 Assembly for the manufacture of highly integrated circuits on a semiconductor substrate
11/28/2000US6152070 Tandem process chamber
11/28/2000US6151864 System and method for transferring components between packing media
11/28/2000US6151794 Apparatus for heat treating an object
11/28/2000US6151775 Multilayer circuit board and method of producing the same
11/28/2000US6151744 Method of and apparatus for cleaning substrate
11/28/2000CA2303471A1 Field-effect transistor and method of manufacturing same
11/28/2000CA2216054C Semiconductor integrated circuit device for enabling easy confirmation of discrete information
11/23/2000WO2000070924A1 Integrated circuits with copper matallization for interconnections
11/23/2000WO2000070685A1 Ferroelectric memory with disturb protection
11/23/2000WO2000070683A1 Semiconductor memory
11/23/2000WO2000070681A1 Improved rf power transistor
11/23/2000WO2000070680A1 Methods and compositions for improving interconnect metallization performance in integrated circuits
11/23/2000WO2000070679A1 Carrier for electronic components and a method for manufacturing a carrier
11/23/2000WO2000070678A1 Chip package with molded underfill
11/23/2000WO2000070675A1 Semiconductor memory device
11/23/2000WO2000070674A1 Capacitor for a semiconductor arrangement and method for producing a dielectric layer for the capacitor
11/23/2000WO2000070673A1 Tungsten-filled deep trenches
11/23/2000WO2000070672A1 Creation of a corner of an electric strip conductor, in particular, consisting of copper, which has been produced by damascene work on a substrate
11/23/2000WO2000070671A1 Mounting arrangement for a semiconductor element
11/23/2000WO2000070670A1 Semiconductor device and method for manufacturing the same, and electronic device
11/23/2000WO2000070669A1 Differential trench open process
11/23/2000WO2000070668A1 Etching end-point detecting method
11/23/2000WO2000070667A1 Method for treating a substrate with heat sensitive agents
11/23/2000WO2000070666A1 Method and apparatus for processing
11/23/2000WO2000070664A1 Method for depositing a two-layer diffusion barrier
11/23/2000WO2000070663A1 Method for manufacturing semiconductor device
11/23/2000WO2000070662A1 Device for film deposition
11/23/2000WO2000070661A1 Apparatus for manufacturing semiconductor device and method of manufacture thereof
11/23/2000WO2000070659A1 Plasma processing methods and apparatus
11/23/2000WO2000070658A1 Multi-zone resistive heater
11/23/2000WO2000070657A1 Chuck having pressurized zones of heat transfer gas
11/23/2000WO2000070656A1 Apparatus and method for dispensing processing fluid toward a substrate surface
11/23/2000WO2000070654A2 Low-resistance vdmos semiconductor component
11/23/2000WO2000070646A1 Secondary electron spectroscopy method and system
11/23/2000WO2000070555A1 Method for producing a contactless card
11/23/2000WO2000070495A2 Semiconductor processing techniques
11/23/2000WO2000070407A1 Projection lens for microlithography
11/23/2000WO2000070332A1 Method of and apparatus for inspection of articles by comparison with a master
11/23/2000WO2000070129A1 Method and apparatus for epitaxially growing a material on a substrate
11/23/2000WO2000070128A1 Plating jig and device for semiconductor wafer
11/23/2000WO2000070121A1 UTILIZATION OF SiH4, SOAK AND PURGE IN DEPOSITION PROCESSES
11/23/2000WO2000070118A1 Tantalum and tantalum-based films formed using fluorine-containing source precursors and methods of making the same
11/23/2000WO2000070116A1 Low pressure stagnation flow reactors with a flow barrier
11/23/2000WO2000069761A1 Cassette buffering within a minienvironment
11/23/2000WO2000069601A1 Corrosion resistant exoskeleton arm linkage assembly
11/23/2000WO2000069577A1 Methods for cleaning microelectronic substrates using ultradilute cleaning liquids
11/23/2000WO2000069575A1 Method and apparatus for washing a wafer carrier
11/23/2000WO2000049464A3 Photolithography method and apparatus configuration for performing photolithography
11/23/2000WO2000042236A3 Processing system and method for chemical vapor deposition
11/23/2000WO2000039848A3 Test method and assembly including a test die for testing a semiconductor product die
11/23/2000WO2000039839A3 High aspect ratio sub-micron contact etch process in an inductively-coupled plasma processing system
11/23/2000WO2000033372A9 Plasma etching of polysilicon using fluorinated gas mixtures
11/23/2000WO2000031774A3 Holding device for a substrate
11/23/2000WO2000030807A3 A carrier head with edge control for chemical mechanical polishing
11/23/2000WO2000030172A3 System for receiving and retaining a substrate
11/23/2000WO2000029135A9 Bath system for semiconductor wafers with obliquely mounted sonic transducers
11/23/2000WO2000028581A9 Processing chamber with rapid wafer exchange
11/23/2000WO2000022169A9 DETECTION USING Snz AND Sno GENES AND PROTEINS
11/23/2000WO2000021144A9 VERTICAL GEOMETRY InGaN LED
11/23/2000EP1050070A3 Holding device for a substrate
11/23/2000DE19922187A1 Low ohmic VDMOS semiconductor element has a region of different conducting type than the base in the base of a trench
11/23/2000DE19921795A1 Projektions-Belichtungsanlage und Belichtungsverfahren der Mikrolithographie Projection exposure apparatus and exposure method in microlithography
11/23/2000DE19921678A1 Manufacture of carrier e.g. multifunctional chip card with display, involves covering base with flowable plastic material so that electronic components are partially embedded and processing upper side of plastics material
11/23/2000DE19920721A1 Programming circuit for electrically-programmable element
11/23/2000DE19920593A1 Chipträger für ein Chipmodul und Verfahren zur Herstellung des Chipmoduls A chip carrier for a chip module and method of manufacturing the chip module
11/23/2000DE10022800A1 Schottky semiconductor element has a semiconductor stacking layer with an edge that reaches the protective ring
11/23/2000DE10014455A1 Level shifter for use in invertor apparatus, has NMOSFET formed in the area of substrate isolated from the area of formation of level shift resistance and higher pressure resistance pinch resistant area
11/23/2000DE10014071A1 Storage of semiconductor wafer after CMP includes exposure of the wafer to water before post-polishing cleaning, which prevents the drying out of the wafer
11/23/2000DE10007429A1 Photoresistzusammensetzung mit ausgezeichneter Beständigkeit gegenüber der Wirkung von Verzögerung nach dem Belichten The photoresist composition having excellent resistance to the effects of delay after exposure
11/23/2000CA2373752A1 Improved rf power transistor
11/22/2000EP1054511A2 Method for overload cut-out of an Isolated-Gate Bipolar Transistor (IGBT) and device for carrying out the method
11/22/2000EP1054457A2 Method and apparatus for manufacturing a semiconductor device
11/22/2000EP1054453A2 Nonvolatile memory using deep level capture of carrier at corner structure of oxide film
11/22/2000EP1054452A2 TFT and method for its fabrication
11/22/2000EP1054451A2 MOS-gated power device having extended trench and doping zone and process for forming same
11/22/2000EP1054450A2 MOSFET semiconductor device with highly doped barrier region
11/22/2000EP1054449A2 Magnetic random access memory and fabricating method thereof
11/22/2000EP1054448A2 Semiconductor device and method of fabricating the same
11/22/2000EP1054446A1 Method of packaging semiconductor chip
11/22/2000EP1054444A1 Process for depositing a porous, low dielectric constant silicon oxide film