Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2000
11/21/2000US6150191 Method of making an organic thin film transistor and article made by the method
11/21/2000US6150186 Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive
11/21/2000US6150185 Methods of manufacturing and testing integrated circuit field effect transistors using scanning electron microscope to detect undesired conductive material
11/21/2000US6150184 Method of fabricating partially or completely encapsulated top electrode of a ferroelectric capacitor
11/21/2000US6150183 Method for manufacturing metal oxide capacitor and method for manufacturing semiconductor memory device
11/21/2000US6150073 Degradation-free low-permittivity dielectrics patterning process for damascene
11/21/2000US6150072 Filling trench having inclined surface; forming etch stop and silicon dioxide and silicon nitride layers; vapor deposition; oxidation
11/21/2000US6150071 Fabrication process for flex circuit applications
11/21/2000US6150070 Method of creating optimal profile in single layer photoresist
11/21/2000US6150068 Photosensitive resin composition for far-ultraviolet exposure
11/21/2000US6150059 Photomask having main holes opposite the positions at which pattern parts are to form, and further has minute auxiliary holes between main holes which pass light to a degree that it is not transferred onto the substrate at the time of exposure
11/21/2000US6150031 A non-porous monocrystalline semiconductor region is arranged on a porous monocrystalline semiconductor region.
11/21/2000US6150029 Method of forming a film having enhanced reflow characteristics at low thermal budget
11/21/2000US6150023 Dummy wafer
11/21/2000US6150010 Integrated circuit insulator
11/21/2000US6150006 Quartz glass component used in the production of semiconductors
11/21/2000US6149987 Enhancing the surface sensitivity of a pecvd liner layer with activated oxygen.
11/21/2000US6149976 Plasma cvd apparatus on a semiconductor wafer using a gas which is a mixture of a silicon source gas, a silicon type fluorine source gas, an oxidizing agent and an inert gas.
11/21/2000US6149974 Deposits a ramp layer while ramping pressure to a target deposition pressure and deposits an sacvd layer over the ramp layer. in one
11/21/2000US6149966 Composition and process for forming electrically insulating thin films
11/21/2000US6149830 Composition and method for reducing dishing in patterned metal during CMP process
11/21/2000US6149829 Generating plasma from gas-c, a mixture of water and nitrogen or group 8a gases, injecting gas-d downstream of the plasma source, setting object downstream of gas-d injection; processing surface using species generated from gases c and d
11/21/2000US6149828 Supercritical etching compositions and method of using same
11/21/2000US6149784 Sputtering chamber shield promoting reliable plasma ignition
11/21/2000US6149779 Filling gaps during integrated circuit production using gas mixture consisting of silicon-containing, oxygen-containing and boron-containing components to deposit film over said gaps by simultaneous chemical vapor deposition and sputter etching
11/21/2000US6149777 Method of producing smooth titanium nitride films having low resistivity
11/21/2000US6149761 Etching apparatus and etching system using the method thereof
11/21/2000US6149759 Process and device for one-sided treatment of disk-shaped objects
11/21/2000US6149758 Sheet removing apparatus and method
11/21/2000US6149731 Multistage cleaning of valves with deionized water and analyzing
11/21/2000US6149730 Apparatus for forming films of a semiconductor device, a method of manufacturing a semiconductor device, and a method of forming thin films of a semiconductor
11/21/2000US6149728 Semiconductor manufacturing device
11/21/2000US6149727 Substrate processing apparatus
11/21/2000US6149508 Chemical mechanical planarization system
11/21/2000US6149507 Wafer polishing apparatus having measurement device and polishing method
11/21/2000US6149505 Cavitational polishing pad conditioner
11/21/2000US6149498 Semiconductor wafer handling system
11/21/2000US6149379 Wafer transfer method using a serial number detecting device in semiconductor fabricating equipment
11/21/2000US6149368 Wafer disk pad having one or more wafer loading points to facilitate vacuum wand wafer loading and unloading
11/21/2000US6149365 Support frame for substrates
11/21/2000US6149316 Flash EEprom system
11/21/2000US6149299 Direct temperature sensing of a semiconductor device semiconductor device
11/21/2000US6149122 Method for building interconnect structures by injection molded solder and structures built
11/21/2000US6149047 Die-bonding machine
11/21/2000US6148846 Waste liquid collection system
11/21/2000US6148833 Continuous cleaning megasonic tank with reduced duty cycle transducers
11/21/2000US6148765 Electrode for plasma processes and method for manufacture and use thereof
11/21/2000US6148763 Deposited film forming apparatus
11/21/2000US6148762 Plasma processing apparatus
11/21/2000US6148761 Dual channel gas distribution plate
11/21/2000US6148512 Method for attaching an electronic device
11/21/2000US6148505 System and method for wiring electronic components in a three-dimensional manner
11/21/2000US6148463 Cleaning apparatus
11/21/2000CA2308758A1 Gas delivery metering tube
11/17/2000CA2308832A1 Gas distribution system
11/16/2000WO2000069241A1 Component mounting apparatus and method therefor
11/16/2000WO2000069235A1 Manufacturing electronic components in a direct-write process using precision spraying and laser irradiation
11/16/2000WO2000069234A1 Wiring method and wiring device
11/16/2000WO2000069229A1 System and method for providing a lithographic light source for a semiconductor manufacturing process
11/16/2000WO2000069220A1 Hot plate and conductive paste
11/16/2000WO2000069219A1 Hot plate and method of producing the same
11/16/2000WO2000069218A1 Hot plate and conductor paste
11/16/2000WO2000069217A1 Hot plate and conductive paste
11/16/2000WO2000069073A1 Heterogeneous programmable gate array
11/16/2000WO2000068996A1 Surface mount ic stacking method and device
11/16/2000WO2000068995A1 Ic chip
11/16/2000WO2000068994A1 Chip holder for a chip module and method for producing said chip module
11/16/2000WO2000068990A1 Method for handling thinned chips for introducing them into chip cards
11/16/2000WO2000068989A1 Moisture repellant integrated circuit dielectric material combination
11/16/2000WO2000068988A1 Uv-supported activation of a doping agent in compound semiconductors by means of rtp systems
11/16/2000WO2000068987A1 Semiconductor device and method of manufacturing semiconductor device
11/16/2000WO2000068986A1 Method and apparatus for vacuum treatment
11/16/2000WO2000068984A1 Method for cleaning a silicon substrate surface and use for making integrated electronic components
11/16/2000WO2000068983A1 Method for producing an element with material that has been made porous
11/16/2000WO2000068982A1 Fabrication of ohmic contacts to inp using non- stoichiometric inp layers
11/16/2000WO2000068981A1 Method for the growth of a thin silicon oxide layer on a silicon substrate surface and double reactor machine
11/16/2000WO2000068979A2 An apparatus for sensing temperature on a substrate in an integrated circuit fabrication tool
11/16/2000WO2000068978A1 INVERTER MADE OF COMPLEMENTARY p AND n CHANNEL TRANSISTORS USING A SINGLE DIRECTLY-DEPOSITED MICROCRYSTALLINE SILICON FILM
11/16/2000WO2000068977A1 Method for transferring wafers and ring
11/16/2000WO2000068976A1 Device for handling substrates inside and outside a clean room
11/16/2000WO2000068975A2 System for manufacturing semiconductor products
11/16/2000WO2000068974A2 System for processing wafers
11/16/2000WO2000068973A2 System for treating wafers
11/16/2000WO2000068971A2 Device for treating wafers
11/16/2000WO2000068956A1 Nanoporous material fabricated using a dissolvable reagent
11/16/2000WO2000068952A1 Ramped or stepped gate channel erase for flash memory application
11/16/2000WO2000068843A1 Computer-implemented conversion of combination-logic module to improve timing characteristics
11/16/2000WO2000068673A1 Inspection systems performing two-dimensional imaging with line light spot
11/16/2000WO2000068656A1 System for non-destructive measurement of samples
11/16/2000WO2000068625A1 End-effector with integrated cooling mechanism
11/16/2000WO2000068474A1 SiC WAFER, SiC SEMICONDUCTOR DEVICE AND SiC WAFER PRODUCTION METHOD
11/16/2000WO2000068473A1 Detached and inverted epitaxial regrowth & methods
11/16/2000WO2000068472A1 Truncated susceptor for vapor-phase deposition
11/16/2000WO2000068471A1 Sequential hydride vapor-phase epitaxy
11/16/2000WO2000068470A1 Magnesium-doped iii-v nitrides & methods
11/16/2000WO2000068332A1 Magnetic polishing fluids
11/16/2000WO2000067951A1 Optical endpoint detection during chemical mechanical planarization
11/16/2000WO2000067944A1 Ultrasonic wire bonding device
11/16/2000WO2000047366A3 Apparatus and method for grinding, lapping and polishing semiconductor wafers
11/16/2000WO2000045422A3 Inflatable slit/gate valve
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