Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2000
12/19/2000US6162586 Forming titanium nitride layer over oxide and aluminum metallization film
12/19/2000US6162584 Method of fabricating polysilicon structures with different resistance values for gate electrodes, resistors and capacitor plates in an integrated circuit
12/19/2000US6162583 Method for making intermetal dielectrics (IMD) on semiconductor integrated circuits using low dielectric constant spin-on polymers
12/19/2000US6162581 Shaping aperture image can be vibrated
12/19/2000US6162567 Process for producing halftone mask
12/19/2000US6162566 Includes a thin-film portion having an aperture pattern forming region and a supporting frame portion; for use in electron-beam exposure, ion-beam exposure, x-ray exposure
12/19/2000US6162564 Comprising circular optically transparent substrate, light shielding film, resist
12/19/2000US6162543 High purity siliconized silicon carbide having high thermal shock resistance
12/19/2000US6162501 Thin films of metal oxide for semiconductors
12/19/2000US6162370 Consisting essentially of phosphoric acid and hexafluorosilicic acid
12/19/2000US6162368 Technique for chemical mechanical polishing silicon
12/19/2000US6162367 Treating sample by contacting sample with a gas-phase bromine trifluoride containing etchant to produce a controlled etch depth in said sample; micromachining
12/19/2000US6162336 Clamping ring design to reduce wafer sticking problem in metal deposition
12/19/2000US6162323 Plasma processing apparatus
12/19/2000US6162319 Fixing method for electronics
12/19/2000US6162301 Scrubbing using an acidic cleaning solution
12/19/2000US6162299 Multi-position load lock chamber
12/19/2000US6162294 Spin coating bowl exhaust system
12/19/2000US6162293 Method for manufacturing ferroelectric thin film, substrate covered with ferroelectric thin film, and capacitor
12/19/2000US6162010 Method for recovering object to be treated after interruption
12/19/2000US6162008 Wafer orientation sensor
12/19/2000US6162006 Stackable cassette for use with wafer cassettes
12/19/2000US6161969 Apparatus for processing a substrate
12/19/2000US6161753 Method of making a low-profile wire connection for stacked dies
12/19/2000US6161748 Process for manufacturing electronic circuits
12/19/2000US6161747 Bonding apparatus
12/19/2000US6161575 Apparatus and method for preventing chamber contamination
12/19/2000US6161498 Plasma processing device and a method of plasma process
12/19/2000US6161311 System and method for reducing particles in epitaxial reactors
12/19/2000US6161300 Alcohol vapor dryer system
12/19/2000CA2212690C Transfer port system
12/17/2000CA2311618A1 Silicon with structured oxygen doping, its production and use
12/16/2000CA2310403A1 Ultrasonic vibration bonding machine
12/14/2000WO2000076281A1 Multilayer printed wiring board and method of manufacturing multilayer printed wiring board
12/14/2000WO2000076279A1 Process for producing printed wiring board, ic card and printed wiring substrate
12/14/2000WO2000076278A1 Wet etch system for spherical shaped devices
12/14/2000WO2000076273A1 Ceramic heater and method for producing the same, and conductive paste for heating element
12/14/2000WO2000076200A1 Solid-state imaging device, method for driving the same, and image input device
12/14/2000WO2000075998A1 Connection arrangement for a semiconductor device and method of manufacturing same
12/14/2000WO2000075997A1 Non-volatile semiconductor memory cell, comprising a metal-oxide dielectric and a method for producing the same
12/14/2000WO2000075995A1 Chip and method for fitting out a chip comprising a plurality of electrodes
12/14/2000WO2000075994A1 Semiconductor device with a non-volatile memory
12/14/2000WO2000075993A1 Layout and wiring scheme for memory cells with vertical transistors
12/14/2000WO2000075992A1 Ferroelectric memory device and method of manufacturing the same
12/14/2000WO2000075989A1 Semiconductor device comprising a high-voltage circuit element
12/14/2000WO2000075988A1 Integrated circuits with multiple low dielectric-constant inter-metal dielectrics
12/14/2000WO2000075987A1 Fuse for semiconductor device
12/14/2000WO2000075985A1 Method for making an integrated circuit portable device with electric conduction paths
12/14/2000WO2000075984A1 Method for expanding trenches by an anisotropic wet etch
12/14/2000WO2000075983A1 A method for dicing wafers with laser scribing
12/14/2000WO2000075982A1 Fabrication method for self aligned cu diffusion barrier in an integrated circuit
12/14/2000WO2000075981A1 Method for manufacturing semiconductor device
12/14/2000WO2000075980A1 Method of estimating lifetime of semiconductor integrated circuit device and method of controlling the same
12/14/2000WO2000075979A1 Process of using siloxane dielectric films in the integration of organic dielectric films in electronic devices
12/14/2000WO2000075978A1 Low temperature oxidation of conductive layers for semiconductor fabrication
12/14/2000WO2000075977A1 Low temperature sacrificial oxide formation
12/14/2000WO2000075976A1 Low temperature self-aligned collar formation
12/14/2000WO2000075975A2 Low dielectric constant polyorganosilicon coatings generated from polycarbosilanes
12/14/2000WO2000075974A1 Method for engraving a thin dielectric layer on a silicon substrate and equipment for carrying out said method
12/14/2000WO2000075973A1 Plasma processing device, window member for the plasma processing device and electrode plate for the plasma processing device
12/14/2000WO2000075972A1 Vacuum processing apparatus
12/14/2000WO2000075971A1 Film-forming apparatus
12/14/2000WO2000075970A1 Substrate support for plasma processing
12/14/2000WO2000075969A1 Wafer orientation sensor
12/14/2000WO2000075968A1 Method for transferring elements and device enabling said transfer
12/14/2000WO2000075967A2 Method for fabrication of a low resistivity mosfet gate with thick metal silicide on polysilicon
12/14/2000WO2000075966A2 Dual epitaxial layer for high voltage vertical conduction power mosfet devices
12/14/2000WO2000075965A2 Power mosfet and method of making the same
12/14/2000WO2000075964A2 Method of fabricating semiconductor device employing copper interconnect structure
12/14/2000WO2000075856A1 Unitary package identification and dimensioning system employing ladar-based scanning methods
12/14/2000WO2000075729A1 Exposure device capable of aligning while moving mask
12/14/2000WO2000075728A1 Photosensitive resin composition and method of improving dry etching resistance of photosensitive resin composition
12/14/2000WO2000075727A2 Coatings on reflective mask substrates
12/14/2000WO2000075713A1 Method/system measuring object features with 2d and 3d imaging coordinated
12/14/2000WO2000075677A1 Segmented contactor
12/14/2000WO2000074896A1 Method of modifying a surface of a structured wafer
12/14/2000WO2000074552A2 Method for determinig alert window parameters for etc signal delivery
12/14/2000WO2000001615A9 Method and apparatus for the preparation of high purity phosphine or other gas
12/14/2000DE19946201C1 Voltage buffering arrangement in dynamic CMOS memory, i.e. DRAM
12/14/2000DE19930353A1 Method for slicing semiconductor bars with grinding suspension continuously refreshed
12/14/2000DE19928081A1 Method for encapsulating COB packages on wiring carriers with very small pitch spacings involves vibrating package when applying encapsulation material
12/14/2000DE19913367C1 Verfahren zur Herstellung einer elektrischen Schaltung A method of producing an electrical circuit
12/14/2000DE10024749A1 Automatic control device for automated semiconductor manufacturing process compares batch process data with specification data and halts next batch processes if irregularity is detected
12/14/2000CA2671386A1 Method and apparatus for iteratively, selectively tuning the impedance of integrated semiconductor devices using a focussed heating source
12/14/2000CA2375741A1 Method/system measuring object features with 2d and 3d imaging coordinated
12/14/2000CA2374004A1 Method of modifying a surface of a structured wafer
12/13/2000EP1059677A2 Method for manufacturing a nitride semiconductor device and device manufactured by the method
12/13/2000EP1059675A2 Method of encapsulating a photovoltaic module by an encapsulating material and the photovoltaic module
12/13/2000EP1059672A2 High withstand voltage semiconductor device and method of manufacturing the same
12/13/2000EP1059670A2 Damascene FeRAM cell structure and method for making same
12/13/2000EP1059669A1 Integrated semiconductor read only memory device
12/13/2000EP1059666A1 Monolithic semiconductor integrated circuit device
12/13/2000EP1059664A2 Method of depositing and etching dielectric layers
12/13/2000EP1059663A2 Process for producing a semiconductor thin film with a bonding and separating steps, solar cell fabrication and anodizing apparatus
12/13/2000EP1059662A1 Method for detaching an epitaxial layer from one substrate and transferring it to another substrate
12/13/2000EP1059661A2 Crack-free epitaxial semiconductor layer formed by lateral growth
12/13/2000EP1059660A2 Sealed container, storage apparatus, conveyance system, and method of storage and conveyance of electronic parts
12/13/2000EP1059584A2 Method and apparatus for generating test pattern for circuit blocks
12/13/2000EP1059564A1 Photosensitive resin composition
12/13/2000EP1059296A1 Lewis adducts of aluminum organyls for preparation of alumina films by CVD