Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2001
01/25/2001DE19931125A1 Ferroelektrischer Transistor Ferroelectric transistor
01/25/2001DE19931113A1 Verfahren zum Aufbringen von Verbindungsmaterialien für eine Verbindung zwischen einem Mikrochip und einem Substrat, Verfahren zum Herstellen einer elektrischen und mechanischen Verbindung zwischen einem Mikrochip und einem Substrat sowie Verwendung eines nach dem Tintendruckprinzip arbeitenden Druckkopfes A method of applying bonding materials for a connection between a microchip and a substrate, method of manufacturing an electrical and mechanical connection between a microchip and a substrate as well as the use of a working according to the ink pressure principle printhead
01/25/2001DE10032539A1 Diffraction grating finishing comprises forming photosensitive resist layer on base material, emitting near field light onto resist layer, forming diffraction grating pattern in the resist layer, and etching base material
01/25/2001DE10030461A1 Halbleiter-Fabrikautomatisierungssystem und Verfahren zum Verarbeiten von wenigstens einer Halbleiterwafer-Kassette Semiconductor factory automation system and method for processing at least one semiconductor wafer cassette
01/25/2001DE10028345A1 Organisches,nicht-reflektierendes Polymer und Verfahren zu dessen Herstellung Organic, non-reflective polymer and process for its preparation
01/25/2001DE10028344A1 Organisches,nicht reflektierendes Überzugspolymer und dessen Herstellungsverfahren Organic, non-reflective coating polymer and its production method
01/25/2001DE10023758A1 Verfahren zur Behandlung eines Halbleiterwafers und Halbleiterwafer-Tragelement A process for treating a semiconductor wafer and the semiconductor wafer support member
01/25/2001DE10020714A1 Elektronenstrahl-Belichtungsvorrichtung Electron beam exposure apparatus
01/25/2001DE10020394A1 Head component used in the production of integrated circuits contains a mounting surface, and an integrated circuit chip for processing signals covered by a layer
01/25/2001DE10020374A1 Disc unit head assembly has head IC chip mounted on suspension by ultrasonic bonding, protruding electrodes bonded onto electrode connection points by ultrasonic bonding
01/25/2001DE10005460A1 Mehrwert-Masken-Nurlesespeicher Value-mask read-only memory
01/25/2001CA2379762A1 Inorganic permeation layer for micro-electric device
01/24/2001EP1071310A2 Lamp unit and light radiating type heating device
01/24/2001EP1071141A2 Diamond semiconductor and method for the fabrication thereof.
01/24/2001EP1071135A2 Doubly graded junction termination extension for edge passivation of semiconductor devices
01/24/2001EP1071134A1 Process for manufacturing an electronic device comprising EEPROM memory cells with dimensional control of the floating gate regions
01/24/2001EP1071133A1 Vertical bipolar transistor with high gain obtained by means of a process for CMOS devices of non volatile memories
01/24/2001EP1071132A2 Method for reducing substrate capacitive coupling of a thin film inductor by reverse P/N junctions
01/24/2001EP1071130A2 Semiconductor device interconnection structure comprising additional capacitors
01/24/2001EP1071129A2 Crystal-axis-aligned vertical side wall DRAM and process for manufacture thereof
01/24/2001EP1071128A2 Real time defect source identification on a semiconductor substrate
01/24/2001EP1071127A2 High speed simulation method of an oxidation process in a semiconductor device
01/24/2001EP1071125A2 Process for producing transistors having independently adjustable parameters
01/24/2001EP1071124A2 Dry etching method for forming tungsten wiring in a semiconductor device
01/24/2001EP1071123A1 Method for forming film
01/24/2001EP1071122A1 Process for correcting the topography of microelectronic substrates
01/24/2001EP1071121A1 Process for the formation of a collar oxide in a trench in a semiconductor substrate
01/24/2001EP1071120A2 Method for providing pulsed plasma during a portion of a semiconductor wafer process
01/24/2001EP1071119A1 Handling apparatus for front opening unified pod
01/24/2001EP1071118A2 Substrate rotating apparatus
01/24/2001EP1071117A2 Method of fabricating a display device, and apparatus for forming a thin film
01/24/2001EP1071116A1 Method and apparatus for removing material from the periphery of a substrate, using a remote plasma source
01/24/2001EP1071113A2 Plasma reactors for processing semiconductor wafers
01/24/2001EP1071100A2 Use of barrier refractive or anti-reflective layer to improve laser trim characteristics of thin film resistors
01/24/2001EP1070991A1 Alkaline aqueous solution and method for forming pattern of photosensitive resin composition using the same
01/24/2001EP1070768A1 Method for making silicon nanocluster monolayers in silicon oxide
01/24/2001EP1070767A1 Method for magnetron sputtering
01/24/2001EP1070444A1 Method and device for producing thin-layer structures
01/24/2001EP1070381A1 Electrostatic wafer clamp having low particulate contamination of wafers
01/24/2001EP1070371A1 Method for forming an optical silicon layer on a support and use of said method in the production of optical components
01/24/2001EP1070352A1 Semiconductor memory and method for producing same
01/24/2001EP1070351A1 Over-voltage protection system for integrated circuits using the bonding pads and passivation layer
01/24/2001EP1070349A1 Semiconductor component
01/24/2001EP1070348A1 Method of forming a local interconnect
01/24/2001EP1070347A1 Semiconductor wafer processing tapes
01/24/2001EP1070346A1 Method for etching low k dielectrics
01/24/2001EP1070345A1 Organic removal process
01/24/2001EP1070344A1 Self-aligned contacts for semiconductor device
01/24/2001EP1070343A1 Depositing a material of controlled, variable thickness across a surface for planarization of that surface
01/24/2001EP1070342A1 Techniques for forming trenches in a silicon layer of a substrate in a high density plasma processing system
01/24/2001EP1070341A1 Silicon-germanium etch stop layer system
01/24/2001EP1070340A1 Methods of fabricating gallium nitride semiconductor layers by lateral overgrowth through masks, and gallium nitride semiconductor structures fabricated thereby
01/24/2001EP1070336A1 Direct temperature control for a component of a substrate processing chamber
01/24/2001EP1070335A1 Raster shaped beam, electron beam exposure strategy using a two dimensional multipixel flash field
01/24/2001EP1070159A1 Electrodeposition of metals in small recesses using modulated electric fields
01/24/2001EP1070157A1 Method for removing photoresist and plasma etch residues
01/24/2001EP1070155A1 Integrated ion implant scrubber system
01/24/2001EP1069972A1 Apparatus and methods for slurry removal in chemical mechanical polishing
01/24/2001EP1004141A4 A system and method for packaging integrated circuits
01/24/2001EP0753180B1 Method of manufacturing a chip card, and chip card thus produced
01/24/2001CN1281588A Post-lapping cleaning process for silicon wafers
01/24/2001CN1281517A Copper metallization of silicon wafers using insoluble anodes
01/24/2001CN1281392A Spin coating method and apparatus for liquid carbon dioxide systems
01/24/2001CN1281260A Semiconductor storage device possessing redundancy function
01/24/2001CN1281259A Integration scheme for raising deep groove capacity in semiconductor integrated circuit device
01/24/2001CN1281258A Semiconductor integrated circuit device, its manufacturing method and action method
01/24/2001CN1281257A 半导体器件 Semiconductor devices
01/24/2001CN1281254A Process for preparing very large scale integrated circuit (VLSIC)
01/24/2001CN1281253A Mixed 5F2 unit layout used in embedding surface strip directed at vertical transistor
01/24/2001CN1281252A Capacitor strip of dynamic random access storage
01/24/2001CN1281251A Word line actuating circuit using annular device
01/24/2001CN1281250A DC degradated word line activating timing with self refreshed DRAM
01/24/2001CN1281249A Semiconductor device and its manufacturing method
01/24/2001CN1281248A Ohm contact layer of semiconductor and its making method
01/24/2001CN1281247A Epitaxial growth method of semiconductor on substrate with high mismatched lattices
01/24/2001CN1281246A Method of manufacturing semiconductor structure for lowering leackage current density
01/24/2001CN1281245A Method of making semiconductor structure containing metal oxide interface of silicone
01/24/2001CN1281231A Substrate junction isolated integrated silicon inductor and its making method
01/24/2001CN1061174C Method for producing semiconductor packaging with transparent window
01/24/2001CN1061044C Tricyclic 5,6-dihydro-9H-pyrazolo [3,4-C]-1,2,4-triaolo [4,3-alpha] pyridines
01/23/2001US6178544 Simulation mesh generation method, apparatus, and program product
01/23/2001US6178543 Method of designing active region pattern with shift dummy pattern
01/23/2001US6178540 Profile design for wire bonding
01/23/2001US6178539 Method and system for determining critical area for circuit layouts using voronoi diagrams
01/23/2001US6178390 Method for controlling thicknesses of layers formed by deposition equipment for fabricating semiconductor devices
01/23/2001US6178361 Automatic modular wafer substrate handling device
01/23/2001US6178360 Methods and apparatus for determining optimum exposure threshold for a given photolithographic model
01/23/2001US6178135 Multi-bank memory devices having bank selection switches therein that enable efficient sense amplifier utilization
01/23/2001US6178134 Static random access memory with global bit-lines
01/23/2001US6178115 Semiconductor memory device and storage method thereof
01/23/2001US6178113 Dual floating gate programmable read only memory cell structure and method for its fabrication and operation
01/23/2001US6178110 Static semiconductor memory device capable of enhancing access speed
01/23/2001US6178108 Semiconductor memory device
01/23/2001US6178082 High temperature, conductive thin film diffusion barrier for ceramic/metal systems
01/23/2001US6177978 Stage device and exposure apparatus using the same
01/23/2001US6177974 Contact structure
01/23/2001US6177831 Semiconductor integrated circuit with well potential control circuit
01/23/2001US6177802 System and method for detecting defects in an interlayer dielectric of a semiconductor device using the hall-effect
01/23/2001US6177733 Semiconductor device
01/23/2001US6177731 Semiconductor package