| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/23/2001 | US6177295 Method of manufacturing semiconductor devices with “chip size package” |
| 01/23/2001 | US6177294 Wiring layout method for semiconductor device and recording medium on which wiring layout program for semiconductor device is recorded |
| 01/23/2001 | US6177292 Method for forming GaN semiconductor single crystal substrate and GaN diode with the substrate |
| 01/23/2001 | US6177291 Method of making aggregate of semiconductor micro-needles |
| 01/23/2001 | US6177288 Method of making integrated circuit packages |
| 01/23/2001 | US6177286 Reducing metal voids during BEOL metallization |
| 01/23/2001 | US6177285 Process for determining the crystal orientation in a wafer |
| 01/23/2001 | US6177284 Conductive diffusion barrier layer, semiconductor device having the same, and manufacturing thereof |
| 01/23/2001 | US6177235 Photolithography patterning first layer subjacent to second layer of photosensitive resin in fabrication of integrated circuits by forming porous antireflective layer, depositing second layer of photosensitive resin, exposing, developing |
| 01/23/2001 | US6177233 Method of forming resist pattern |
| 01/23/2001 | US6177225 Comprising a capped polybenzoxazole precursor polymer, a photosensitive agent, and a solvent |
| 01/23/2001 | US6177218 Lithographic process for device fabrication using electron beam imaging |
| 01/23/2001 | US6177204 Ferromagnetic GMR material and method of forming and using |
| 01/23/2001 | US6177199 Forming a solution of a solvent and the organohydridosiloxane resin, dispensing the solution on a substrate, spinning the substrate, baking the substrate to remove the solvent, and curing the substrate to form the dielectric film |
| 01/23/2001 | US6177184 Method of making an interface layer for stacked lamination sizing and sintering |
| 01/23/2001 | US6177149 Method of forming titanium film by CVD |
| 01/23/2001 | US6177147 Process and apparatus for treating a substrate |
| 01/23/2001 | US6177145 Semiconductor processing method of making electrical contact to a node |
| 01/23/2001 | US6177143 Electron beam treatment of siloxane resins |
| 01/23/2001 | US6177135 Low temperature CVD processes for preparing ferroelectric films using Bi amides |
| 01/23/2001 | US6177127 Method of monitoring emissivity |
| 01/23/2001 | US6177040 Forming windows |
| 01/23/2001 | US6177026 CMP slurry containing a solid catalyst |
| 01/23/2001 | US6177023 Method and apparatus for electrostatically maintaining substrate flatness |
| 01/23/2001 | US6176993 Process for recycling reaction system of electroplating passivation of wafers |
| 01/23/2001 | US6176992 Method and apparatus for electro-chemical mechanical deposition |
| 01/23/2001 | US6176986 Hot-press sintering a powdered barium strontium titinate having mean primary particle size of 1mu.m or less at a sintering temperature 1000 to 1300 degree c., for sintering time 1-10 hours under pressure in vacuum or in inert gas |
| 01/23/2001 | US6176983 Methods of forming a semiconductor device |
| 01/23/2001 | US6176981 Wafer bias ring controlling the plasma potential in a sustained self-sputtering reactor |
| 01/23/2001 | US6176969 Baffle plate of dry etching apparatus for manufacturing semiconductor devices |
| 01/23/2001 | US6176966 Method of die bonding electronic component and die bonding apparatus thereof |
| 01/23/2001 | US6176944 Casting a pure cobalt metal having an intrinsic magnetic permeability and slowly cooling to form a sputter target comprising single hexagonal close packed phase, then hot working, slow cooling and cold working |
| 01/23/2001 | US6176936 Semiconductors; reductive decomposition of a metal halide |
| 01/23/2001 | US6176934 Inflatable door seal |
| 01/23/2001 | US6176933 End point window assembly in an etching apparatus for fabricating semiconductor devices |
| 01/23/2001 | US6176930 Apparatus and method for controlling a flow of process material to a deposition chamber |
| 01/23/2001 | US6176926 Laser processing method |
| 01/23/2001 | US6176925 Detached and inverted epitaxial regrowth & methods |
| 01/23/2001 | US6176763 Method and apparatus for uniformly planarizing a microelectronic substrate |
| 01/23/2001 | US6176668 In-situ substrate transfer shuttle |
| 01/23/2001 | US6176667 Multideck wafer processing system |
| 01/23/2001 | US6176438 Suck back valve having sensor for detecting diaphragm displacement amount |
| 01/23/2001 | US6176431 Method for producing data carriers with embedded elements and an apparatus for carrying out the method |
| 01/23/2001 | US6176417 Ball bonding method on a chip |
| 01/23/2001 | US6176414 Linkage guided bond head |
| 01/23/2001 | US6176374 Component carrier having a wave pattern tension reduction surface |
| 01/23/2001 | US6176265 Valve unit having an insert molded inner valve block |
| 01/23/2001 | US6176252 Apparatus for supplying liquid in semiconductor manufacturing process |
| 01/23/2001 | US6176120 Methods of analyzing water soluble contaminants generated during microelectronic device manufacturing processes |
| 01/23/2001 | US6176066 Hook and loop fastener strapping for semiconductor carrying trays |
| 01/23/2001 | US6176023 Device for transporting flat objects and process for transferring said objects between said device and a processing machine |
| 01/23/2001 | US6176008 Jig for mounting fine metal balls |
| 01/23/2001 | US6175984 Apparatus for cleaning precision components |
| 01/23/2001 | US6175983 Substrate washing apparatus and method |
| 01/23/2001 | CA2301118C A homogenization enhancing thermoplastic foam extrusion screw |
| 01/23/2001 | CA2171375C Manufacturing method of a silicon wafer having a controlled bmd concentration in the bulk and a good dz layer |
| 01/23/2001 | CA2121042C Thermal sensor |
| 01/23/2001 | CA2105342C Method of forming silicon carbide |
| 01/18/2001 | WO2001005205A1 Laminates for encapsulating devices |
| 01/18/2001 | WO2001005203A1 Underfilling material for semiconductor package |
| 01/18/2001 | WO2001005197A2 High-speed symmetrical plasma treatment system |
| 01/18/2001 | WO2001005020A1 Radio frequency power source for generating an inductively coupled plasma |
| 01/18/2001 | WO2001004970A1 Ferromagnetic double quantum well tunnel magneto-resistance device |
| 01/18/2001 | WO2001004963A1 Encapsulation of a device |
| 01/18/2001 | WO2001004961A1 Power semiconductor devices with buried insulating regions |
| 01/18/2001 | WO2001004960A1 Semiconductor device and method for the same manufacturing |
| 01/18/2001 | WO2001004956A1 Semiconductor device and method of manufacturing same |
| 01/18/2001 | WO2001004955A1 Monolithic low dielectric constant platform for passive components and method |
| 01/18/2001 | WO2001004954A1 Semiconductor devices and process for manufacture |
| 01/18/2001 | WO2001004952A1 Semiconductor device arrangement having configuration via adjacent bond pad coding |
| 01/18/2001 | WO2001004951A1 Low-capacitance bond pads for high speed devices |
| 01/18/2001 | WO2001004949A1 Nand type flash memory device |
| 01/18/2001 | WO2001004948A1 New method of forming select gate to improve reliability and performance for nand type flash memory devices |
| 01/18/2001 | WO2001004947A1 Method of compensating for material loss in a metal silicide layer in contacts of integrated circuit devices |
| 01/18/2001 | WO2001004946A1 Semiconductor device and method for producing the same |
| 01/18/2001 | WO2001004945A1 Electrostatic chuck and its manufacturing method |
| 01/18/2001 | WO2001004944A2 Method and apparatus for simultaneously cleaning and annealing a workpiece |
| 01/18/2001 | WO2001004943A1 Multilayered body, method for fabricating multilayered body, and semiconductor device |
| 01/18/2001 | WO2001004942A1 Chemical vapor deposition of silicon oxide films using alkylsiloxane oligomers with ozone |
| 01/18/2001 | WO2001004941A1 Fabrication process for dishing-free cu damascene structures |
| 01/18/2001 | WO2001004940A1 Method for doping gallium nitride (gan) substrates and the resulting doped gan substrate |
| 01/18/2001 | WO2001004939A1 Semiconductor film, liquid-crystal display using semiconductor film, and method of manufacture thereof |
| 01/18/2001 | WO2001004937A2 Method and apparatus for directing constituents through a processing chamber |
| 01/18/2001 | WO2001004936A1 Method of cleaning a semiconductor device processing chamber after a copper etch process |
| 01/18/2001 | WO2001004935A1 Apparatus and method for transferring a workpiece |
| 01/18/2001 | WO2001004934A1 Semiconductor wafer carrier |
| 01/18/2001 | WO2001004933A1 Method for separating two elements and device therefor |
| 01/18/2001 | WO2001004932A1 Handling system |
| 01/18/2001 | WO2001004931A2 Method and apparatus for providing uniform gas delivery to substrates in cvd and pecvd processes |
| 01/18/2001 | WO2001004930A2 Thermal processing chamber for heating and cooling wafer-like objects |
| 01/18/2001 | WO2001004929A2 A method of forming a film in a chamber |
| 01/18/2001 | WO2001004928A2 Improved apparatus and method for plating wafers, substrates and other articles |
| 01/18/2001 | WO2001004927A2 Methodologies to reduce process sensitivity to the chamber wall condition |
| 01/18/2001 | WO2001004926A1 Methods and apparatus for alignment of ion beam systems using beam current sensors |
| 01/18/2001 | WO2001004716A1 A system and method for a digital mass flow controller |
| 01/18/2001 | WO2001004715A1 System and method of operation of a digital mass flow controller |
| 01/18/2001 | WO2001004707A1 Photoresist removal process using forming gas plasma |
| 01/18/2001 | WO2001004682A1 Broad band ultraviolet catadioptric imaging system |
| 01/18/2001 | WO2001004652A1 Apparatus for electrical testing of a substrate having a plurality of terminals |
| 01/18/2001 | WO2001004643A2 Wafer-level burn-in and test cartridge and methods |