| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/18/2001 | WO2001004641A2 Wafer level burn-in and electrical test system and method |
| 01/18/2001 | WO2001004609A1 Surface flaw detection using spatial raman-based imaging |
| 01/18/2001 | WO2001004585A1 Pressure insensitive gas control system |
| 01/18/2001 | WO2001004567A2 Method and apparatus for three dimensional inspection of electronic components |
| 01/18/2001 | WO2001004387A1 Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
| 01/18/2001 | WO2001004377A1 Seal means and its application in deposition reactor |
| 01/18/2001 | WO2001004376A1 A method of forming a silicon nitride layer on a semiconductor wafer |
| 01/18/2001 | WO2001004231A1 Polishing liquid composition |
| 01/18/2001 | WO2001004226A2 Cmp composition containing silane modified abrasive particles |
| 01/18/2001 | WO2001004049A1 Low-permittivity porous siliceous film, semiconductor devices having such films, and coating composition for forming the film |
| 01/18/2001 | WO2001004031A1 Apparatus and method for handling a wafer |
| 01/18/2001 | WO2001004028A1 Smif-compatible open cassette enclosure |
| 01/18/2001 | WO2001004027A1 Low profile automated pod door removal system |
| 01/18/2001 | WO2001004022A1 Transport module with latching door |
| 01/18/2001 | WO2001003858A1 Method and system for in situ cleaning of semiconductor manufacturing equipment using combination chemistries |
| 01/18/2001 | WO2001003812A1 Gas purification system with an integrated hydrogen sorption and filter assembly |
| 01/18/2001 | WO2000063964A3 Cmos process |
| 01/18/2001 | WO2000057454A3 Improved integrated oscillators and tuning circuits |
| 01/18/2001 | DE19962763A1 Verfahren zum Vereinzeln eines Wafers Method for separating a wafer |
| 01/18/2001 | DE19933632A1 Verfahren zur Herstellung von Monolagen aus Silizium-Nanoclustern in Siliziumdioxid Process for the preparation of monolayers of silicon nanoclusters in silica |
| 01/18/2001 | DE19931694A1 Production of electrical circuit or module with device, e.g. chip, on top, uses lead frame with fingers connected to contact areas of top metallization and encapsulation in insulating material leaving bottom metallization exposed |
| 01/18/2001 | DE19930583A1 Transistor with permeable base |
| 01/18/2001 | DE19930169A1 Testeinrichtung zum Prüfen eines Speichers Test device for testing a memory |
| 01/18/2001 | DE19928714A1 Process for implanting doping materials in a pre-doped silicon carbide substrate used in the production of power diodes comprises producing zones of second conductivity in a substrate of first conductivity and thermally treating |
| 01/18/2001 | DE19927286A1 Schleiflösung und Verfahren zum chemisch-mechanischen Polieren einer Edelmetall-Oberfläche Grinding solution and method for chemical mechanical polishing a noble metal surface |
| 01/18/2001 | DE19549490C2 Wet chemical treatment installation for substrate plates |
| 01/18/2001 | DE10031543A1 Production of a connecting structure used in the production of electronic circuits comprises producing an insert in a plastic layer formed on a planar substrate |
| 01/18/2001 | DE10031536A1 Results based semiconductor testing system for use in the electronic development automation of integrated circuit components by conversion of data from logic simulation into machine code and storage in data files |
| 01/18/2001 | DE10030546A1 Method of fixing electronic components, esp. surface acoustic wave (SAW) components on to fixture substrates, involves making maximum length of connection tool pressure surface greater than half length of rear face surface of component |
| 01/18/2001 | DE10030207A1 Halbleiterfabrikautomatisierungssystem und Verfahren für die Steuerung automatisch geführter Fahrzeuge Semiconductor factory automation system and method for controlling automatic guided vehicles |
| 01/18/2001 | DE10028644A1 Half tone phase shift mask green body with transparent film producing a phase difference with respect to light passing directly through transparent substrate and weakens the light intensity on the substrate |
| 01/18/2001 | DE10026319A1 Single crystalline body production comprises preparing substrate, forming seed crystal part on surface of substrate and contacting seed crystal part with solution containing chemical element in saturation |
| 01/18/2001 | DE10025213A1 Semiconductor device for protecting access e.g. to mobile telephone had circuit for encoding dispersion of polycrystalline substance in semiconductor element |
| 01/18/2001 | DE10024734A1 Halbleiterfabrikautomatisierungssystem und Verfahren zum Transportieren von Halbleiterwafern Semiconductor factory automation system and method for transporting semiconductor wafers |
| 01/18/2001 | DE10022333A1 Silicon carbide coated graphite component e.g. gas rectification tube, for silicon single crystal drawing apparatus, has graphite base adhered with primary and secondary layers of silicon carbide film |
| 01/18/2001 | DE10019704A1 Cleaning liquid for semiconductor device manufacturing includes phosphoric acid or orthophosphoric acid which has preset hydrogen ion concentration for removing resist scum adhered to wiring layer |
| 01/18/2001 | DE10015744A1 Contact structure in probe card, has projection made of electrically conducting material provided in contact board to connect contact pad that is in electrical communication with PCB, via contact trace in via hole |
| 01/18/2001 | DE10014489A1 LSI-Entwurfsverfahren, das nach Entwurf des Layouts und der Schaltung eines detaillierten Teils niemals Zeitplanungsfehler mit Einfluß auf die gesamte Spezifizierung einer LSI-Funktion produziert LSI design process that never produces according to design the layout and circuit part of a detailed scheduling error with influence on the entire specification of an LSI function |
| 01/18/2001 | DE10012803A1 Photomask cleaning in semiconductor device manufacture, involves removing foreign materials from photomask surface using hydrogen gas dissolved water, and allowing photomask to dry |
| 01/18/2001 | DE10011642A1 Production of a flat trench isolation used as electrical insulation in semiconductor components comprises forming trenches in a mask layer deposited on substrate, depositing an oxide layer and a covering oxide layer, and polishing |
| 01/18/2001 | DE10011005A1 Multichip module and method for producing a multichip module |
| 01/18/2001 | CA2378492A1 Cmp composition containing silane modified abrasive particles |
| 01/18/2001 | CA2373710A1 Fabrication process for dishing-free cu damascene structures |
| 01/18/2001 | CA2342946A1 Encapsulation of a device |
| 01/18/2001 | CA2342363A1 Laminates for encapsulating devices |
| 01/17/2001 | EP1069686A2 Programmable logic device with unified cell structure including signal interface bumps |
| 01/17/2001 | EP1069645A2 Semiconductor device with an antenna and fabrication method therefor |
| 01/17/2001 | EP1069620A1 A flash memory array |
| 01/17/2001 | EP1069619A2 Semiconductor integrated circuit device, production and operation method thereof |
| 01/17/2001 | EP1069615A2 Semiconductor device |
| 01/17/2001 | EP1069614A2 Method of fabricating an integrated circuit |
| 01/17/2001 | EP1069613A2 Low-leakage architecture for sub-0.18 micrometer salicided CMOS device |
| 01/17/2001 | EP1069612A2 Continuous, non-agglomerated adhesion of a seed layer to a barrier layer |
| 01/17/2001 | EP1069611A2 Method and apparatus for forming a conductive via comprising a refractory metal |
| 01/17/2001 | EP1069610A2 Refractory metal deposition process for low contact resistivity to silicon and corresponding apparatus |
| 01/17/2001 | EP1069609A2 Method for automatically identifying and classifying defects, in particular on a semiconductor wafer |
| 01/17/2001 | EP1069608A1 Method of wire bonding, semiconductor device, circuit board, electronic device and wire bonder |
| 01/17/2001 | EP1069607A2 Release member for use in producing a multi-layer package |
| 01/17/2001 | EP1069606A2 Method for fabricating a semiconductor structure with reduced leakage current destiny |
| 01/17/2001 | EP1069605A2 Method for fabricating a semiconductor structure including a metal oxide interface with silicon |
| 01/17/2001 | EP1069604A2 Method for etching layers on semiconductor substrates |
| 01/17/2001 | EP1069603A1 Processing apparatus |
| 01/17/2001 | EP1069602A2 Method of producing thin-film single-crystal device, solar cell module and method of producing the same |
| 01/17/2001 | EP1069601A1 Method of manufacturing semiconductor wafer |
| 01/17/2001 | EP1069599A2 Apparatus for deposition of thin films on wafers |
| 01/17/2001 | EP1069598A1 Method and apparatus for etching silicon |
| 01/17/2001 | EP1069597A1 Apparatus and method for manufacturing semiconductor device |
| 01/17/2001 | EP1069576A1 Article comprising a variable inductor |
| 01/17/2001 | EP1069504A2 Semiconductor memory device suitable for merging with logic |
| 01/17/2001 | EP1069477A2 Exposure apparatus and device manufacturing method using the same |
| 01/17/2001 | EP1069476A1 Apparatus and method for exposure |
| 01/17/2001 | EP1069465A1 Tft array substrate for liquid crystal display and method of producing the same, and liquid crystal display and method of producing the same |
| 01/17/2001 | EP1069453A2 Device for reducing the peak output of a pulse laser light source |
| 01/17/2001 | EP1069448A1 Catadioptric optical system and projection exposure apparatus equipped with the same |
| 01/17/2001 | EP1069213A2 Optimal anneal technology for micro-voiding control and self-annealing management of electroplated copper |
| 01/17/2001 | EP1069212A1 Electrochemical deposition for high aspect ratio structures using electrical pulse modulation |
| 01/17/2001 | EP1069211A2 Electroplating solutions |
| 01/17/2001 | EP1069208A2 Method of diffusing gas into a CVD chamber and gas diffusing means |
| 01/17/2001 | EP1069207A2 In-situ etch method for for cleaning a CVD chamber |
| 01/17/2001 | EP1069206A2 Nanoscale conductive connectors and method for making same |
| 01/17/2001 | EP1069194A1 Metal material for electronic parts, electronic parts, electronic apparatuses, and method of processing metal materials |
| 01/17/2001 | EP1068936A1 Grippers with ability to change wafer orientation |
| 01/17/2001 | EP1068928A2 Chemical mechanical polishing processes and components |
| 01/17/2001 | EP1068775A1 Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate |
| 01/17/2001 | EP1068646A1 Method for doping one side of a semiconductor body |
| 01/17/2001 | EP1068645A1 Storage cell arrangement and method for producing same |
| 01/17/2001 | EP1068644A1 Memory cell arrangement and method for producing the same |
| 01/17/2001 | EP1068642A1 An inductance device |
| 01/17/2001 | EP1068641A1 Stepper alignment mark formation with dual field oxide process |
| 01/17/2001 | EP1068640A1 Use of the constructional characteristics of an electronic component as a reference for positioning the component |
| 01/17/2001 | EP1068637A1 Reduced channel length lightly doped drain transistor using a sub-amorphous large tilt angle implant to provide enhanced lateral diffusion |
| 01/17/2001 | EP1068636A1 Ultra-high resolution liquid crystal display on silicon-on-sapphire |
| 01/17/2001 | EP1068635A1 Cluster tool |
| 01/17/2001 | EP1068633A1 Method and device for specifically manipulating and depositing particles |
| 01/17/2001 | EP1068632A1 Contamination controlling method and plasma processing chamber |
| 01/17/2001 | EP1068631A1 Use of variable impedance having rotating core to control coil sputter distribution |
| 01/17/2001 | EP1068529A2 Methods and compounds for modulating nuclear receptor coactivator binding |
| 01/17/2001 | EP1068480A1 Substrate support for a thermal processing chamber |
| 01/17/2001 | EP1068373A1 Automated chemical process control system |
| 01/17/2001 | EP1068370A1 Multi-ledge substrate support for a thermal processing chamber |