| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 01/11/2001 | WO2001003194A1 Heterojunction iii-v transistor, in particular hemt field effect transistor or heterojunction bipolar transistor |
| 01/11/2001 | WO2001003193A1 Semiconductor element |
| 01/11/2001 | WO2001003191A1 Soi substrate, method of manufacture thereof, and semiconductor device using soi substrate |
| 01/11/2001 | WO2001003189A1 Multichip module and method for producing a multichip module |
| 01/11/2001 | WO2001003186A1 Semiconductor device, method of manufacturing the same, and structure for mounting semiconductor device |
| 01/11/2001 | WO2001003183A2 Method for applying connecting materials for connecting a microchip and a substrate and utilization of a printing head working according to the ink printing principle |
| 01/11/2001 | WO2001003181A1 Method for etching capacitor trenches |
| 01/11/2001 | WO2001003180A1 Method of subdividing a wafer |
| 01/11/2001 | WO2001003179A1 Dual-damascene dielectric structures and methods for making the same |
| 01/11/2001 | WO2001003178A1 Method for producing an electrode arrangement |
| 01/11/2001 | WO2001003177A1 Device for quantitative detection of copper in silicon by transient ionic drift and method using same |
| 01/11/2001 | WO2001003176A1 Electric charge generating semiconductor substrate bump forming device, method of removing electric charge from electric charge generating semiconductor substrate, device for removing electric charge from electric charge generating semiconductor substrate, and electric charge generating semiconductor substrate |
| 01/11/2001 | WO2001003175A1 Electrical-mechanical connection between electronic circuit systems and substrates and method for the production thereof |
| 01/11/2001 | WO2001003173A1 Method for patterning a layer of a low dielectric constant material |
| 01/11/2001 | WO2001003172A1 Method for producing a thin membrane and resulting structure with membrane |
| 01/11/2001 | WO2001003171A1 Method for making a thin film using pressurisation |
| 01/11/2001 | WO2001003169A1 Semiconductor manufacture equipment, and method and apparatus for semiconductor manufacture |
| 01/11/2001 | WO2001003168A1 Semiconductor manufacture equipment |
| 01/11/2001 | WO2001003167A1 Semiconductor manufacture equipment, and method and apparatus for semiconductor manufacture |
| 01/11/2001 | WO2001003166A1 Method for producing an electrode |
| 01/11/2001 | WO2001003165A1 Spin, rinse, and dry station with adjustable nozzle assembly for semiconductor wafer backside rinsing |
| 01/11/2001 | WO2001003164A1 Method for validating pre-process adjustments to a wafer cleaning system |
| 01/11/2001 | WO2001003163A1 Gas distribution apparatus for semiconductor processing |
| 01/11/2001 | WO2001003162A1 Low-pressure apparatus and pressure control valve |
| 01/11/2001 | WO2001003159A1 Gas distribution apparatus for semiconductor processing |
| 01/11/2001 | WO2001003157A1 Object inspection and/or modification system and method |
| 01/11/2001 | WO2001003155A1 Method and apparatus for simultaneously depositing and observing materials on a target |
| 01/11/2001 | WO2001003126A2 High density non-volatile memory device |
| 01/11/2001 | WO2001002909A1 Photosensitive resin composition and method for improving dry etching resistance of photosensitive resin composition |
| 01/11/2001 | WO2001002907A1 Apparatus and method of image enhancement through spatial filtering |
| 01/11/2001 | WO2001002822A1 Apparatus and method for evaluating a target larger than a measuring aperture of a sensor |
| 01/11/2001 | WO2001002628A1 Doped diamond |
| 01/11/2001 | WO2001002134A1 Improved chemical mechanical polishing slurries for metal |
| 01/11/2001 | WO2001002133A2 Improvement in and relating to edge grinding |
| 01/11/2001 | WO2001002108A1 Fluid heating system for processing semiconductor materials |
| 01/11/2001 | WO2001002106A1 Chemical solutions system for processing semiconductor materials |
| 01/11/2001 | WO2001001828A1 Wafer container |
| 01/11/2001 | WO2000066549A3 Apparatus and methods for collecting global data during a reticle inspection |
| 01/11/2001 | WO2000059003A3 Device for manufacturing semiconductor products |
| 01/11/2001 | WO2000058188B1 Wafer handling robot having x-y stage for wafer handling and positioning |
| 01/11/2001 | WO2000052739A3 A controlled collapse chip connection (c4) integrated circuit package that has a filler which seals an underfill material |
| 01/11/2001 | WO2000021118A3 Method for producing a double gate of a vertical mosfet |
| 01/11/2001 | DE19933316A1 Verfahren und Vorrichtung zur Messung der Schichtdicke Method and device for measuring the layer thickness |
| 01/11/2001 | DE19931848A1 Astigmatische Komponenten zur Reduzierung des Wabenaspektverhältnisses bei EUV-Beleuchtungssystemen Astigmatic components to reduce the honeycomb aspect ratio in EUV illumination systems |
| 01/11/2001 | DE19931751A1 Vorrichtung zur Reduzierung der Peakleistung einer Pulslaser-Lichtquelle Apparatus for reducing the peak power of a pulse laser light source |
| 01/11/2001 | DE19930781A1 Diode mit Metall-Halbleiterkontakt und Verfahren zu ihrer Herstellung Diode metal-semiconductor contact and procedures for their preparation |
| 01/11/2001 | DE19930586A1 Nichtflüchtige Halbleiter-Speicherzelle mit separatem Tunnelfenster und dazugehöriges Herstellungsverfahren Non-volatile semiconductor memory cell with a separate tunnel window and associated manufacturing processes |
| 01/11/2001 | DE19929618A1 Verfahren zur Herstellung einer nichtflüchtigen Halbleiter-Speicherzelle mit separatem Tunnelfenster A method of manufacturing a nonvolatile semiconductor memory cell with a separate tunnel window |
| 01/11/2001 | DE19929542A1 Chip mit räumlich vorstehenden Mikroelektroden und Verfahren zur Herstellung eines solchen Chip with spatially protruding micro-electrodes and methods for producing such |
| 01/11/2001 | DE19928563A1 MOS transistor used in CMOS circuits comprises a semiconductor island on a main surface of substrate and an annular isolating structure arranged on the island |
| 01/11/2001 | DE19928225A1 Process for increasing the gas permeability of ceramic bodies, especially silicon carbide setter plates, comprises treatment with a chemical reactive solution or a reactive gas |
| 01/11/2001 | DE19919036C1 Production of an etching mask made of a polymeric material comprises initially applying the polymer mask material to a structured layer and then graphitizing the surface of the mask material |
| 01/11/2001 | DE10032425A1 Wafer suction pad is mounted on transport arm of transport device, holds wafer by suction on pad body with suction surface with number of annular apertures in concentric arrangement |
| 01/11/2001 | DE10031603A1 Production of a semiconductor wafer comprises etching the wafer using an etching medium along a flow direction laminar to an edge of the wafer |
| 01/11/2001 | DE10031601A1 Semiconductor manufacturing automation system has monitoring device for state information that updates stored state, generates warning signal if unit has faulty function |
| 01/11/2001 | DE10031035A1 Thermal chuck for holding test devices such as integrated circuits for carrying out low voltage and low power tests at varying temperatures has a capacitative connection for filtering out electrical noise |
| 01/11/2001 | DE10030428A1 Positiv arbeitende Resistzusammensetzung The positive resist composition |
| 01/11/2001 | DE10030308A1 Production of a contact pin of a semiconductor element comprises using a gas mixture containing sulfur hexafluoride, trifluoromethane and carbon tetrafluoride in the back etching of the polysilicon layer |
| 01/11/2001 | DE10025211A1 Test socket for measuring electric characteristics of electronic device or semiconductor package has protrusions formed from smooth curved surfaces in portion to contact external connection terminals of electronic device |
| 01/11/2001 | DE10022664A1 Semiconductor memory for computer, has memory cell array with peripheral circuit area and insulating layer formed on peripheral circuit area to alleviate step formed by cylindrical electrode in memory cell |
| 01/11/2001 | DE10020713A1 Contact structure for probe card, has contactor formed on dielectric substrate by minute machining operation such that contact section of contactor is perpendicularly formed on one end of horizontal section |
| 01/11/2001 | DE10000451A1 Clock signal analyzer has three memories, pre-processor, simulation device, post-processor and display showing a two-dimensional simulation map |
| 01/11/2001 | CA2377896A1 High voltage protection circuit on standard cmos process |
| 01/10/2001 | EP1067828A1 Instantaneous balance control scheme for ionizer |
| 01/10/2001 | EP1067607A2 An insulated gate transistor and the method of manufacturing the same |
| 01/10/2001 | EP1067605A1 Ferroelectric memory cell and corresponding manufacturing method |
| 01/10/2001 | EP1067604A2 Semiconductor apparatus with self-security function |
| 01/10/2001 | EP1067600A1 CMOS compatible SOI process |
| 01/10/2001 | EP1067599A1 A method of forming structures with buried oxide regions in a semiconductor substrate |
| 01/10/2001 | EP1067598A1 Method of packaging semiconductor device using anisotropic conductive adhesive |
| 01/10/2001 | EP1067597A2 Transitors with low overlap capacitance |
| 01/10/2001 | EP1067596A2 Process for forming vertical semiconductor device having increased source contact area |
| 01/10/2001 | EP1067595A2 Liquid precursor mixtures for deposition of multicomponent metal containing materials |
| 01/10/2001 | EP1067593A2 Semiconductor thin film forming system |
| 01/10/2001 | EP1067592A2 Compact apparatus and method for storing and loading semiconductor wafer carriers |
| 01/10/2001 | EP1067591A2 Edge bead removal/spin rinse dry module |
| 01/10/2001 | EP1067590A2 Electroplating system |
| 01/10/2001 | EP1067589A2 Semiconductor substrate aligner apparatus and method |
| 01/10/2001 | EP1067588A2 Thermal reaction chamber for semiconductor wafer processing operations |
| 01/10/2001 | EP1067587A2 Thermally processing a substrate |
| 01/10/2001 | EP1067586A2 A semiconductor processing system |
| 01/10/2001 | EP1067585A2 Method and a system for sealing an epitaxial silicon layer on a substrate |
| 01/10/2001 | EP1067584A2 Enhanced cooling IMP coil support |
| 01/10/2001 | EP1067583A2 Substrate transport container |
| 01/10/2001 | EP1067578A2 Methods and apparatus for ionized metal plasma copper deposition with enhanced in-film particle performance |
| 01/10/2001 | EP1067577A2 Sputtering reactor and method of using an unbalanced magnetron |
| 01/10/2001 | EP1067557A1 Flash compatible EEPROM |
| 01/10/2001 | EP1067437A2 Anamorphic components for reducing an aspect ratio in illumination systems |
| 01/10/2001 | EP1067435A1 Positively photosensitive resin composition |
| 01/10/2001 | EP1067392A2 Method for testing electronic components |
| 01/10/2001 | EP1067371A2 Methods and apparatus for calibrating temperature measurements and measuring currents |
| 01/10/2001 | EP1067370A1 Thermally processing substrates |
| 01/10/2001 | EP1067221A2 Method and apparatus for plating substrate and plating facility |
| 01/10/2001 | EP1067208A1 Method of making sputtering targets |
| 01/10/2001 | EP1067163A1 Adhesive and semiconductor devices |
| 01/10/2001 | EP1067162A1 Adhesive and semiconductor devices |
| 01/10/2001 | EP1067161A1 Silicone adhesive sheet and method for manufacturing |
| 01/10/2001 | EP1067134A2 Hybridization of polynucleotides conjugated with chromophores and fluorophores to generate donor-to-donor energy transfer system |
| 01/10/2001 | EP1067112A2 Carboxylic acid derivatives and their synthesis method |
| 01/10/2001 | EP1067096A2 Quartz glass members for excimer laser, and their method of manufacture |