| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/01/2001 | WO2001008212A1 Device for opening/closing semiconductor container and method for producing semiconductor device |
| 02/01/2001 | WO2001008211A1 Untreated body transfer device and semiconductor manufacturing device with the untreated body transfer device |
| 02/01/2001 | WO2001008210A1 Wafer storing method and storing container therefor and wafer transferring method for transferring wafer to the storing container |
| 02/01/2001 | WO2001008209A1 Multiple stage cleaning for plasma etching chambers |
| 02/01/2001 | WO2001008208A1 Semiconductor device, method for forming silicon oxide film, and apparatus for forming silicon oxide film |
| 02/01/2001 | WO2001008207A1 Method and apparatus for anisotropic etching |
| 02/01/2001 | WO2001008206A1 Processor and temperature control method therefor |
| 02/01/2001 | WO2001008203A1 Method for removing redepositions on a wafer and wafer which is devoid of redepositions |
| 02/01/2001 | WO2001008202A1 Low stress wafer mounting assembly and method |
| 02/01/2001 | WO2001008201A1 Method and device for transporting a semiconductor wafer through a treatment container |
| 02/01/2001 | WO2001008200A1 Device for treating substrates |
| 02/01/2001 | WO2001008199A1 Substrate and workpiece support for receiving a substrate |
| 02/01/2001 | WO2001008176A1 Method of manufacturing a magnetic tunnel junction device |
| 02/01/2001 | WO2001008163A1 Extreme ultraviolet soft x-ray projection lithographic method system and lithography elements |
| 02/01/2001 | WO2001008159A2 Method of forming memory capacitor contact openings |
| 02/01/2001 | WO2001007968A1 Mask for high resolution optical lithography |
| 02/01/2001 | WO2001007967A1 Extreme ultraviolet soft x-ray projection lithographic method and mask devices |
| 02/01/2001 | WO2001007926A1 Method of manufacturing a magnetic tunnel junction device |
| 02/01/2001 | WO2001007858A1 Heat exchanger |
| 02/01/2001 | WO2001007691A1 Apparatus for growing epitaxial layers on wafers |
| 02/01/2001 | WO2001007687A1 Plating method and device, and plating system |
| 02/01/2001 | WO2001007678A1 Plasma activated cvd method and device for producing a microcristalline si:h layer |
| 02/01/2001 | WO2001007677A1 Method and apparatus for manufacturing semiconductor device |
| 02/01/2001 | WO2001007346A1 Arrangement and method for manually moving a container for storing objects |
| 02/01/2001 | WO2001007339A1 Protective system for integrated circuit (ic) wafers |
| 02/01/2001 | WO2001007208A1 Cmp polishing head with three chambers and method for using the same |
| 02/01/2001 | WO2001007207A1 Membrane probing system |
| 02/01/2001 | WO2001007177A1 Process and apparatus for treating a workpiece such as a semiconductor wafer |
| 02/01/2001 | WO2000075983B1 A method for dicing wafers with laser scribing |
| 02/01/2001 | WO2000072090A3 A method for error reduction in lithography |
| 02/01/2001 | WO2000058713A3 Device for rapidly measuring angle-dependent diffraction effects on finely structured surfaces |
| 02/01/2001 | WO2000055690A3 A compact photoemission source, field and objective lens arrangement for high throughput electron beam lithography |
| 02/01/2001 | WO2000051012A3 Integrated circuit interconnect system |
| 02/01/2001 | DE4423186C2 Verfahren zum Betreiben einer automatischen Testeinrichtung sowie automatische Testeinrichtung A method for operating an automatic test equipment as well as automatic test equipment |
| 02/01/2001 | DE19960244C1 Arrangement for trimming reference voltages in semiconducting chips enables rapid and cost-effective reference voltage trimming |
| 02/01/2001 | DE19943760C1 DRAM cell arrangement comprises a substrate with a recess containing a storage node of a capacitor |
| 02/01/2001 | DE19935852A1 Production of an integrated circuit semiconductor component comprises producing gate paths in the regions of a substrate, forming source/drain regions in one region and distance pieces |
| 02/01/2001 | DE19935446A1 Ätzlösung, Flußsäure enthaltend Etching solution of hydrofluoric acid containing |
| 02/01/2001 | DE19935404A1 Beleuchtungssystem mit mehreren Lichtquellen A lighting system comprising a plurality of light sources |
| 02/01/2001 | DE19934301A1 Verfahren und Vorrichtung zum Transportieren eines Halbleiterwafers durch einen Behandlungsbehälter Method and device for transporting a semiconductor wafer by a treatment vessel |
| 02/01/2001 | DE19933959A1 Verfahren zur Herstellung zweier unterschiedlich dotierter benachbarter Gebiete in einem integrierten Halbleiter Process for the preparation of two differently doped adjacent regions in a semiconductor integrated |
| 02/01/2001 | DE19933842A1 Vorrichtung und Verfahren zum Ätzen eines Substrates mittels eines induktiv gekoppelten Plasmas Apparatus and method for etching a substrate by means of an inductively coupled plasma |
| 02/01/2001 | DE19933841A1 Vorrichtung und Verfahren zum Ätzen eines Substrates mittels eines induktiv gekoppelten Plasmas Apparatus and method for etching a substrate by means of an inductively coupled plasma |
| 02/01/2001 | DE19930748A1 Stages making EEPROM memory cell with trenched condenser, fill trench, form insulating collar, remove filling, construct condenser plates and insulation, and connect tunneling layer with optional DRAM region definition |
| 02/01/2001 | DE19929233C1 Speicherzellenanordnung mit auf einer Grabenseitenwand angeordnetem Floating-Gate und Herstellungsverfahren Memory cell arrangement with arranged on a grave side wall floating gate and manufacturing processes |
| 02/01/2001 | DE19926106C1 Halbleiterspeicherbauelement mit Speicherzellen, Logikbereichen und Füllstrukturen A semiconductor memory device having memory cells, logic regions and dummy |
| 02/01/2001 | DE10036183A1 Verfahren und Gerät zum Erhitzen eines Wafers und Verfahren und Gerät zum Ausheizen eines Photoresistfilms auf einem Wafer Method and apparatus for heating a wafer, and method and apparatus for baking a photoresist film on a wafer |
| 02/01/2001 | DE10033013A1 Flüssigkeits-Spritzpresssystem zum Vergießen von integrierten Halbleiterschaltungen Liquid molding system for encapsulating semiconductor integrated circuits |
| 02/01/2001 | DE10028327A1 Vorrichtung und Verfahren für bildformende Strahlen aus geladenen Teilchen und Bestrahlungsvorrichtung mit Strahlen aus geladenen Teilchen Apparatus and method for image-forming beams of charged particles and radiation device with beams of charged particles |
| 02/01/2001 | DE10025218A1 Multi-layer connection process transfer-marking structure e.g. for fabrication of semiconductor devices, has transfer marking lined up with transfer point used in preceding step |
| 02/01/2001 | DE10025217A1 Metal oxide transistor in a silicon-on-insulator construction suppressing effect of suspended body includes barrier layer formed by doping- and semiconductor layers, without application of external voltage |
| 02/01/2001 | DE10025216A1 Semiconducting device has silicon in isolator substrate, insulating layer, semiconducting layer, transistor with gate electrode, polycrystalline semiconducting region and contact hole |
| 02/01/2001 | DE10025210A1 Semiconductor device comprises a substrate having a primary surface, and a trench isolation region formed in the primary region of the substrate to divide the surface regions of the substrate into a number of active regions |
| 02/01/2001 | DE10024735A1 System und Verfahren zum automatischen Verwalten von Halbleiterproduktionsbuchten System and method for automatically managing semiconductor production bays |
| 02/01/2001 | DE10022665A1 Semiconductor device has current drive circuit which passes current between power-supply node and internal voltage line, based on charging voltage of capacitor |
| 02/01/2001 | DE10012700A1 Halbleitervorrichtung Semiconductor device |
| 01/31/2001 | EP1073325A2 Testing and transporting semiconductor chips |
| 01/31/2001 | EP1073124A2 Method for making integrated circuit capacitor including anchored plug |
| 01/31/2001 | EP1073123A2 High withstand voltage semiconductor device |
| 01/31/2001 | EP1073122A2 Semiconductor integrated circuit having high-density base cell array |
| 01/31/2001 | EP1073121A2 Semiconductor memory device and method for manufacturing the same |
| 01/31/2001 | EP1073120A2 An NROM fabrication method |
| 01/31/2001 | EP1073118A1 Mixed fuse technologies |
| 01/31/2001 | EP1073115A2 Process for manufacture of trench DRAM capacitor |
| 01/31/2001 | EP1073114A2 Integrated circuit capacitor including anchored metal plug |
| 01/31/2001 | EP1073112A1 Process for the manufacturing of a SOI wafer by oxidation of buried cavities |
| 01/31/2001 | EP1073111A2 Method and apparatus for forming a solder bump |
| 01/31/2001 | EP1073110A1 Method of manufacturing unipolar devices |
| 01/31/2001 | EP1073109A2 Single phase perovskite ferroelectric film on platinum electrode and method for forming same |
| 01/31/2001 | EP1073108A1 Chemical vapor deposition process for dielectric material |
| 01/31/2001 | EP1073106A2 Method for reducing oxidation of an interface of a semiconductor device and resulting device |
| 01/31/2001 | EP1073105A2 Method for wet etching oxides and/or insulators |
| 01/31/2001 | EP1073104A2 Scratch resistance improvement by filling metal gaps |
| 01/31/2001 | EP1073103A1 Backside bus vias |
| 01/31/2001 | EP1073102A2 Liners formed by ionized metal plasma deposition for gate electrode applications |
| 01/31/2001 | EP1073101A1 Method for manufacturing capacitor elements on a semiconductor substrate |
| 01/31/2001 | EP1073100A2 Method for making integrated circuit capacitor including anchored plugs |
| 01/31/2001 | EP1073099A2 Method of making integrated circuit capacitor including tapered plug |
| 01/31/2001 | EP1073098A1 Low stress wafer mounting assembly and method |
| 01/31/2001 | EP1073097A2 Dot mark reading apparatus and reading method |
| 01/31/2001 | EP1073096A1 Semiconductor workpiece processing apparatus and method |
| 01/31/2001 | EP1073095A2 Method for cleaning photovoltaic module and cleaning apparatus |
| 01/31/2001 | EP1073071A2 Magnetic multilayer |
| 01/31/2001 | EP1073062A1 Magnetic random access memory device |
| 01/31/2001 | EP1073061A1 Magnetic memory |
| 01/31/2001 | EP1072967A2 Computer integrated manufacturing techniques |
| 01/31/2001 | EP1072957A2 Illumination system with multiple light sources |
| 01/31/2001 | EP1072954A2 Lithographic process for device fabrication |
| 01/31/2001 | EP1072894A2 Capacitive probe for in situ measurement of wafer DC bias voltage |
| 01/31/2001 | EP1072693A1 Chemical vapor deposition apparatus and method of synthesizing carbon nanotubes using the apparatus |
| 01/31/2001 | EP1072666A2 Colloidal polishing of fused silica |
| 01/31/2001 | EP1072665A2 Colloidal silica polishing abrasive |
| 01/31/2001 | EP1072662A1 Chemical-mechanical abrasive composition and method |
| 01/31/2001 | EP1072570A1 Silicon carbide and process for its production |
| 01/31/2001 | EP1072359A2 Semiconductor wafer polishing apparatus |
| 01/31/2001 | EP1072057A1 Method of manufacturing a vertical metal connection in an integrated circuit |
| 01/31/2001 | EP1072056A1 Improved endpoint detection for semiconductor processes |
| 01/31/2001 | EP1072040A1 Non-volatile storage latch |
| 01/31/2001 | EP1071981A1 Method for producing large-surface membrane masks |
| 01/31/2001 | EP1071913A1 Compact external torch assembly for semiconductor processing |