| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/13/2001 | US6187505 Mixture comprising polysilsesquioxane having phenolic groups crosslinkable with acid catalyzable curing agent, acid generator, photosensitizer, a base and surfactant; pattern resolution with high aspect ratio |
| 02/13/2001 | US6187500 Positive photoresist compositions and multilayer resist materials using same |
| 02/13/2001 | US6187482 For microcmachining; photolithography; semiconductors |
| 02/13/2001 | US6187481 Semiconductive material stencil mask and methods of manufacturing stencil masks from semiconductive material, utilizing different dopants |
| 02/13/2001 | US6187446 In chemical sensors, biochemical sensors, enzyme reactors |
| 02/13/2001 | US6187248 Nanoporous polymer films for extreme low and interlayer dielectrics |
| 02/13/2001 | US6187243 Preventing molded products from forming resin flash on their surfaces by pressing the release film on the surface of the part of the work piece |
| 02/13/2001 | US6187216 Method for etching a sacrificial silicon dioxide layer over a semiconductor substrate |
| 02/13/2001 | US6187211 Method for fabrication of multi-step structures using embedded etch stop layers |
| 02/13/2001 | US6187158 Device for coating plate-shaped substrates |
| 02/13/2001 | US6187152 Multiple station processing chamber and method for depositing and/or removing material on a substrate |
| 02/13/2001 | US6187134 Reusable wafer support for semiconductor processing |
| 02/13/2001 | US6187133 Gas manifold for uniform gas distribution and photochemistry |
| 02/13/2001 | US6187132 Substrate treatment device and substrate transporting method |
| 02/13/2001 | US6187121 Die-bonding equipment and a method for detecting residual adhesive material using the same |
| 02/13/2001 | US6187114 Solder material and electronic part using the same |
| 02/13/2001 | US6187110 Prepared by introducing energetic particles in a selected manner through a surface of a donor substrate to a selected depth underneath the surface, where the particles have a relatively high concentration to define a donor substrate |
| 02/13/2001 | US6187103 Apparatus and method for transporting wafers |
| 02/13/2001 | US6187102 Thermal treatment apparatus |
| 02/13/2001 | US6187101 Substrate processing device |
| 02/13/2001 | US6187100 Produced by depositing a non-impurity-doped silicon thin film or an impurity layer on an interface of underlying film, followed by deposition of impurity-doped silicon thin film, if necessary, followed by heat treatment |
| 02/13/2001 | US6187093 Apparatus and method for planarization of spin-on materials |
| 02/13/2001 | US6187092 Method and apparatus for controlling the thickness of a gate oxide in a semiconductor manufacturing process |
| 02/13/2001 | US6187091 Apparatus and process for growing silicon epitaxial layer |
| 02/13/2001 | US6187088 Laser irradiation process |
| 02/13/2001 | US6187077 Contacting gas mixture comprising tetrafluoromethane, perfluoroethane, nitrogen trifluoride, trifluoromethane, nitrogen and sulfur hexafluoride with membrane, contacting retentate stream with adsorbent to produce desired product |
| 02/13/2001 | US6187072 Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions |
| 02/13/2001 | US6187060 Sheet processing method |
| 02/13/2001 | US6186877 Multi-wafer polishing tool |
| 02/13/2001 | US6186873 Wafer edge cleaning |
| 02/13/2001 | US6186812 Manually operated top loading socket for ball grid arrays |
| 02/13/2001 | US6186779 Wafer clamp for a heater assembly |
| 02/13/2001 | US6186723 Load port |
| 02/13/2001 | US6186722 Chamber apparatus for processing semiconductor devices |
| 02/13/2001 | US6186389 Apparatus and process for mounting conductor balls on terminal pads of semiconductor devices |
| 02/13/2001 | US6186384 Method of cleaving a brittle material using a point heat source for providing a thermal stress |
| 02/13/2001 | US6186344 Cassette for loading glasses for liquid crystal display device |
| 02/13/2001 | US6186331 Container |
| 02/13/2001 | US6186216 Cast column grid array extraction apparatus and method |
| 02/13/2001 | US6186153 A dry cleaning method to remove film deposits adhering to the inner walls of a semiconductor manufacturing apparatus that result from etching or ion sputtering residue using a two-step plasma treatment using gases of different reactivity |
| 02/13/2001 | US6185839 Semiconductor process chamber having improved gas distributor |
| 02/13/2001 | US6185830 Semiconductor wafer fixture for alignment in a grating exposure process |
| 02/13/2001 | US6185816 Alignment method |
| 02/13/2001 | US6185815 Semiconductor mounting apparatus with a chip gripper travelling back and forth |
| 02/13/2001 | CA2178324C Porous semiconductor material |
| 02/13/2001 | CA2077952C Descrete phase shift mask writing |
| 02/13/2001 | CA2069309C Method of preparing silicon carbide surfaces for crystal growth |
| 02/10/2001 | CA2314512A1 Multi-channel grating interference alignment sensor |
| 02/08/2001 | WO2001010177A1 A circuit singulation system and method |
| 02/08/2001 | WO2001009980A2 Controlled compliance fine pitch interconnect |
| 02/08/2001 | WO2001009957A1 Inp collector ingaassb base dhbt device and method of forming the same |
| 02/08/2001 | WO2001009956A1 Method for producing a trench mos power transistor |
| 02/08/2001 | WO2001009955A1 Non-volatile semiconductor memory device |
| 02/08/2001 | WO2001009952A2 Interconnect assemblies and methods |
| 02/08/2001 | WO2001009950A1 Semiconductor package unit |
| 02/08/2001 | WO2001009949A1 Apparatus and methods of reinforcement of lead bonding in microelectronic packages |
| 02/08/2001 | WO2001009948A1 Dual wafer attachment process |
| 02/08/2001 | WO2001009947A1 Semiconductor capacitor with diffusion barrier |
| 02/08/2001 | WO2001009946A1 Method for producing integrated semiconductor components |
| 02/08/2001 | WO2001009945A1 Methods of forming an interlevel dielectric layer between different levels of metal layers in the fabrication of integrated circuit |
| 02/08/2001 | WO2001009944A1 Method for producing via-connections in a substrate and substrate equipped with same |
| 02/08/2001 | WO2001009943A1 Process for the forming of isolation layers of a predetermined thickness in semiconductor wafers for the manufacturing of integrated circuits |
| 02/08/2001 | WO2001009942A1 Process for forming structure with different doped regions, showing a hyperfine transition region, for forming porous silicon |
| 02/08/2001 | WO2001009941A1 Method for obtaining a high density module, based on encapsulated modular electronic components and resulting module |
| 02/08/2001 | WO2001009940A2 Method and molding tool for coating electronic components |
| 02/08/2001 | WO2001009939A1 Method and structure for manufacturing improved yield semiconductor packaged devices |
| 02/08/2001 | WO2001009938A1 Fabrication of lateral rf mos devices with enhanced rf properties |
| 02/08/2001 | WO2001009937A1 Tungsten hard mask for dry etching aluminum-containing layers |
| 02/08/2001 | WO2001009935A1 Etching solution, containing hydrofluoric acid |
| 02/08/2001 | WO2001009934A1 Sidewall polymer forming gas additives for etching processes |
| 02/08/2001 | WO2001009933A1 Process for the two-step selective anodizing of a semiconductor layer for forming porous silicon |
| 02/08/2001 | WO2001009932A1 Method of dicing semiconductor wafer into chips, and structure of groove formed in dicing area |
| 02/08/2001 | WO2001009931A1 Method for forming crystalline silicon nitride |
| 02/08/2001 | WO2001009930A2 Thin film capacitors on silicon germanium substrate and process for making the same |
| 02/08/2001 | WO2001009929A2 Method for etch rate enhancement by background oxygen control in a soft etch system |
| 02/08/2001 | WO2001009928A1 Method and apparatus to reduce contaminants from semiconductor wafers |
| 02/08/2001 | WO2001009927A1 Semiconductor structures and manufacturing methods |
| 02/08/2001 | WO2001009926A1 Improved ladder boat for supporting wafers |
| 02/08/2001 | WO2001009925A2 Apparatus and method for texture analysis on semiconductor wafers |
| 02/08/2001 | WO2001009921A1 Minimization of electron fogging in electron beam lithography |
| 02/08/2001 | WO2001009920A1 Electron beam column using high numerical aperture illumination of the photocathode |
| 02/08/2001 | WO2001009913A2 Patterned heat conducting photocathode for electron beam source |
| 02/08/2001 | WO2001009900A2 High speed latch and flip-flop |
| 02/08/2001 | WO2001009898A1 Method and apparatus for reading a magnetoresistive memory |
| 02/08/2001 | WO2001009828A1 Method for making a smart card with contact |
| 02/08/2001 | WO2001009684A1 Control of the distribution of lighting in the exit pupil of an euv lighting system |
| 02/08/2001 | WO2001009681A2 Multi mirror system for an illumination system |
| 02/08/2001 | WO2001009680A1 Structure for reflection lithography mask and method for making same |
| 02/08/2001 | WO2001009662A2 Scanning interferometric near-field confocal microscopy |
| 02/08/2001 | WO2001009630A1 System for aligning rectangular wafers |
| 02/08/2001 | WO2001009623A1 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
| 02/08/2001 | WO2001009566A1 X-ray reflectometry measurements on patterned wafers |
| 02/08/2001 | WO2001009020A1 Vertically stacked load lock and transport robot |
| 02/08/2001 | WO2001009016A1 Transport system with integrated transport carrier and directors |
| 02/08/2001 | WO2001009011A1 Substrate transfer chamber having a substrate holder vertically aligned with a substrate processing module |
| 02/08/2001 | WO2001008820A1 Wafer container cleaning system |
| 02/08/2001 | WO2001001443B1 Plasma processor with coil responsive to variable amplitude rf envelope |
| 02/08/2001 | WO2000070679B1 Carrier for electronic components and a method for manufacturing a carrier |
| 02/08/2001 | WO2000070495A3 Semiconductor processing techniques |
| 02/08/2001 | WO2000055608A3 Method and apparatus for the analysis of material composition |