Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2001
01/04/2001WO2001001464A1 Polysilicon semiconductor thin film substrate, method for producing the same, semiconductor device, and electronic device
01/04/2001WO2001001462A1 Method for producing a noble-metal electrode
01/04/2001WO2001001461A1 Method of producing a structured layer
01/04/2001WO2001001460A2 Temperature controlled wafer chuck
01/04/2001WO2001001459A1 Fluid delivery stabilization for wafer preparation systems
01/04/2001WO2001001458A1 Method and system of cleaning a wafer after chemical mechanical polishing or plasma processing
01/04/2001WO2001001457A1 Moveable barrier for multiple etch processes
01/04/2001WO2001001456A1 Semiconductor processing platform architecture having processing module isolation capabilities
01/04/2001WO2001001455A2 Chip with protruding microelectrodes and method for the production thereof
01/04/2001WO2001001454A2 Atmospheric wafer transfer module with nest for wafer transport robot and method of implementing same
01/04/2001WO2001001450A2 Dram cell fabrication process and method for operating same
01/04/2001WO2001001449A2 Semiconductor device manufacturing using low energy high tilt angle ion implantation
01/04/2001WO2001001445A1 Techniques for improving etch rate uniformity
01/04/2001WO2001001444A1 Elevated stationary uniformity ring
01/04/2001WO2001001443A1 Plasma processor with coil responsive to variable amplitude rf envelope
01/04/2001WO2001001442A1 A plasma reaction chamber component having improved temperature uniformity
01/04/2001WO2001001441A1 Plasma processing system, apparatus, and method for delivering rf power to a plasma processing chamber
01/04/2001WO2001001440A1 Real-time prediction of proximity resist heating and correction of raster scan electron beam lithography
01/04/2001WO2001001438A1 Ion beam generation apparatus
01/04/2001WO2001001421A1 Test device for testing a memory
01/04/2001WO2001001247A2 Semiconductor parallel tester
01/04/2001WO2001001118A1 Illumination module
01/04/2001WO2001001069A1 Method and device for measuring the thickness of a layer
01/04/2001WO2001000900A1 Device for monitoring intended or unavoidable layer deposits and corresponding method
01/04/2001WO2001000899A1 Sputtering target backing plate and sputtering target/backing plate assembly
01/04/2001WO2001000759A1 Stripper composition for negative chemically amplified resist
01/04/2001WO2001000735A1 Water-soluble resin composition
01/04/2001WO2001000522A2 Nanometer-scale modulation
01/04/2001WO2001000338A1 Chemical film cleaning and drying
01/04/2001WO2001000335A1 High rpm megasonic cleaning
01/04/2001WO2001000137A2 Apparatus and method for setting the parameters of an alert window used for timing the delivery of etc signals to a heart under varying cardiac conditions
01/04/2001WO2000059045A3 Multilayer semiconductor structure with phosphide-passivated germanium substrate
01/04/2001WO2000058999A3 Semiconductor structures having a strain compensated layer and method of fabrication
01/04/2001WO2000057162A3 Optical inspection of semi-conductor structures
01/04/2001WO2000033359B1 Specimen holding robotic arm end effector
01/04/2001WO2000033355A3 Apparatus for storing and moving a cassette
01/04/2001WO2000030160A9 Automatic wafer mapping in a wet environment on a wafer cleaner
01/04/2001WO2000028581A3 Processing chamber with rapid wafer exchange
01/04/2001DE19937503C1 Etching oxide films of a ferroelectric bismuth-containing mixed oxide comprises applying an oxide film to a substrate, contacting with an etching solution, and removing the etching solution
01/04/2001DE19930797A1 Elektrisches Halbleiterbauelement Electric semiconductor device
01/04/2001DE19930783A1 Halbleiterbauelement Semiconductor device
01/04/2001DE19930188A1 Verfahren zur Herstellung von Gräben für Speicherkondensatoren von DRAM-Halbleiterspeichern Process for the preparation of trenches for DRAM storage capacitors of semiconductor memories
01/04/2001DE19930019A1 Controlling transport of items for cleaning on conveyor path involves contrast analysis of digital camera image and comparison with reference image to control intervention devices
01/04/2001DE19929723A1 Verfahren zur Herstellung einer Elektrode A method for producing an electrode
01/04/2001DE19929591A1 Process for producing an epitaxial gallium nitride layer on a substrate comprises applying a precursor compound containing gallium carbodiimide on the substrate, and converting into crystalline gallium nitride by pyrolysis
01/04/2001DE19929211A1 MOS-Transistor und Verfahren zu dessen Herstellung sowie DRAM-Zellenanordnung und Verfahren zu deren Herstellung MOS transistor and method for its production as well as the DRAM cell arrangement and method for their preparation
01/04/2001DE19928949A1 Production of a semiconductor wafer used as the base material for a semiconductor component comprises removing the semiconductor from a single crystal, processing by ductile chip removal, and polishing and cleaning the surface
01/04/2001DE19928799A1 Mobiler Werkstückträger und Verfahren zu dessen Verwendung Mobile workpiece carrier and method of use
01/04/2001DE19928795A1 Combined Low Voltage/High Voltage production method with retrograde doped drain extensions for high voltage transistors achieves simplified production and reduced costs
01/04/2001DE19928564A1 Mehrkanal-MOSFET und Verfahren zu seiner Herstellung Multi-channel MOSFET and method for its preparation
01/04/2001DE19927806A1 Vorrichtung und Verfahren zum Hochratenätzen eines Substrates mit einer Plasmaätzanlage und Vorrichtung und Verfahren zum Zünden eines Plasmas und Hochregeln oder Pulsen der Plasmaleistung Apparatus and method for Hochratenätzen a substrate with a plasma etching system and apparatus and method for igniting a plasma and high rules or pulsing the plasma power
01/04/2001DE19927457A1 Process for determining the lengths of diffusion of minority supports in a semiconductor wafer comprises conditioning the wafer before measuring using a surface voltage method, transferring to an atmosphere containing ozone and drying
01/04/2001DE19924568A1 Ladungspumpe Charge pump
01/04/2001DE19916859C1 Vorrichtung zum berührungslosen Greifen und Positionieren von Bauteilen Device for contactless grasping and positioning of components
01/04/2001DE19909564A1 Verfahren zur Verbesserung thermischer Prozeßschritte A method for improving thermal process steps
01/04/2001DE10033144A1 Optical barrier used in the production of integrated circuits has a structured layer made of tungsten
01/04/2001DE10027780A1 Wafer defect measurement involves measuring depths of defects from wafer surface on basis of measured intensities of scattered laser radiation at two or more wafer temperatures
01/04/2001DE10023834A1 Production of a semiconductor element comprises preparing a substrate having an insulating section and a conducting section, forming a metallic layer on the substrate, and removing the first section of the metallic layer
01/04/2001DE10006912A1 Process for fixing a microsensor to a wafer comprises etching a holder of a base wafer, applying a sacrificial layer, forming a recess in a separate assembly wafer
01/04/2001CA2377628A1 Component and method for the production thereof
01/03/2001WO2001015223A1 Semiconductor device and method of manufacture thereof
01/03/2001EP1065734A2 Bonding type semiconductor substrate, semiconductor light emitting element, and preparation process thereof.
01/03/2001EP1065728A2 Heterojunction bipolar transistor and method for fabricating the same
01/03/2001EP1065727A2 Edge termination for silicon power devices
01/03/2001EP1065726A1 Silicon carbide semiconductor switching device
01/03/2001EP1065725A2 Method of manufacturing an electro-optical device
01/03/2001EP1065721A2 Standard cells and method for placing and routing thereof
01/03/2001EP1065718A1 Semiconductor chip module and method for manufacturing the same
01/03/2001EP1065716A2 Method for making air pockets in an HDI context
01/03/2001EP1065715A2 Bicmos process with low temperature coefficient resistor (TCRL)
01/03/2001EP1065714A1 Method of fabricating semiconductor device
01/03/2001EP1065713A2 Staged aluminium deposition process for filling vias
01/03/2001EP1065712A1 Method of wire bonding in semiconductor device
01/03/2001EP1065711A2 Method of manufacturing a plated electronic termination
01/03/2001EP1065710A2 Semiconductor device having a recessed gate and method of manufacturing therof
01/03/2001EP1065709A1 Semiconductor manufacturing apparatus
01/03/2001EP1065708A2 Silicon wafer cleaning process for post-chemical mechanical polishing using immersion
01/03/2001EP1065707A1 Integrated high and low resistance contacts
01/03/2001EP1065706A2 Method for making a diffused back-side layer on a bonded-wafer with a thick bond oxide
01/03/2001EP1065705A2 Group III nitride compound semiconductor device and producing method therefore
01/03/2001EP1065704A2 Low temperature coefficient resistor (TCRL)
01/03/2001EP1065703A2 Vacuum processing method and apparatus
01/03/2001EP1065702A2 Silicon carbide sleeve for substrate support assembly
01/03/2001EP1065701A2 Inert barrier for high purity epitaxial deposition systems
01/03/2001EP1065700A2 Method and apparatus for conserving energy within a process chamber
01/03/2001EP1065696A2 Ion implantation apparatus and ion source and ion source subassembly for use in ion implantation apparatus
01/03/2001EP1065568A2 EUV-Lithographic projection apparatus comprising an optical element with a capping layer
01/03/2001EP1065567A2 Integrated critical dimension control
01/03/2001EP1065566A2 Electron beam drawing mask blank, electron beam drawing mask, and method of manufacturing the same
01/03/2001EP1065532A2 Multilayer extreme-ultraviolet mirror with enhanced reflectivity and lithographic projection apparatus comprising the mirror
01/03/2001EP1065499A2 Defect inspecting apparatus
01/03/2001EP1065299A2 Group III-V nitride semiconductor growth method and vapor phase growth apparatus
01/03/2001EP1065295A1 Plasma cleaning method for processing chambers
01/03/2001EP1065251A1 Polishing composition
01/03/2001EP1065179A1 Process for the deposition of a tungsten and/or molybdenum based layer on a glass, ceramic or glass ceramic substrate and coated substrate according to the process
01/03/2001EP1065030A2 Determining when to replace a retaining ring used in substrate polishing operations
01/03/2001EP1064713A2 Exposure device having a planar motor
01/03/2001EP1064685A1 Method and arrangement for producing thin metal chalcogenide layers
01/03/2001EP1064684A1 Edge termination for a semiconductor component, schottky diode with an end termination and method for producing a schottky diode
01/03/2001EP1064682A1 Dram-cell arrangement and method of production thereof