| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/06/2001 | US6184090 Fabrication method for a vertical MOS transistor |
| 02/06/2001 | US6184089 Method of fabricating one-time programmable read only memory |
| 02/06/2001 | US6184088 Method for manufacturing a split game type transistor |
| 02/06/2001 | US6184087 Method for forming high density nonvolatile memories with high capacitive-coupling ratio |
| 02/06/2001 | US6184085 Methods of forming nonvolatile memory devices using improved masking techniques |
| 02/06/2001 | US6184084 Method to elimate silicide cracking for nand type flash memory devices by implanting a polish rate improver into the second polysilicon layer and polishing it |
| 02/06/2001 | US6184083 Semiconductor device and method of manufacturing the same |
| 02/06/2001 | US6184082 Method of fabricating dynamic random access memory |
| 02/06/2001 | US6184081 Method of fabricating a capacitor under bit line DRAM structure using contact hole liners |
| 02/06/2001 | US6184080 Method of the simultaneous formation for the storage node contacts, bit line contacts, and the contacts for periphery circuits |
| 02/06/2001 | US6184079 Method for fabricating a semiconductor device |
| 02/06/2001 | US6184078 Method for fabricating a capacitor for a dynamic random access memory cell |
| 02/06/2001 | US6184077 Method for fabricating crown-type capacitor of semiconductor device |
| 02/06/2001 | US6184076 DRAM contact process by localized etch-stop removal |
| 02/06/2001 | US6184075 Method of fabricating interconnect lines and plate electrodes of a storage capacitor in a semiconductor device |
| 02/06/2001 | US6184074 Method of fabrication a self-aligned polysilicon/diffusion barrier/oxygen stable sidewall bottom electrode structure for high-K DRAMS |
| 02/06/2001 | US6184073 Process for forming a semiconductor device having an interconnect or conductive film electrically insulated from a conductive member or region |
| 02/06/2001 | US6184072 Process for forming a high-K gate dielectric |
| 02/06/2001 | US6184071 Semiconductor device and method for fabricating the same |
| 02/06/2001 | US6184070 Thin film transistor and method of manufacturing the same |
| 02/06/2001 | US6184069 Fabrication of thin film transistor-liquid crystal display with self-aligned transparent conducting layers |
| 02/06/2001 | US6184068 Process for fabricating semiconductor device |
| 02/06/2001 | US6184066 Method for fabricating semiconductor device |
| 02/06/2001 | US6184065 Photolithographically patterned spring contact |
| 02/06/2001 | US6184064 Semiconductor die back side surface and method of fabrication |
| 02/06/2001 | US6184063 Method and apparatus for breaking and separating a wafer into die using a multi-radii dome |
| 02/06/2001 | US6184062 Process for forming cone shaped solder for chip interconnection |
| 02/06/2001 | US6184061 Electrode of semiconductor device, method of manufacturing thereof, and the semicondutor device |
| 02/06/2001 | US6184060 Integrated circuits and methods for their fabrication |
| 02/06/2001 | US6184059 Process of making diamond-metal ohmic junction semiconductor device |
| 02/06/2001 | US6184053 Method of making microelectronic spring contact elements |
| 02/06/2001 | US6184052 Process for manufacturing high-sensitivity capacitive and resonant integrated sensors, particularly accelerometers and gyroscopes, and sensors made therefrom |
| 02/06/2001 | US6184051 Process for manufacturing high-sensitivity accelerometric and gyroscopic integrated sensors, and sensor thus produced |
| 02/06/2001 | US6184049 Method for fabricating compound semiconductor epitaxial wafer and vapor phase growth apparatus using the same |
| 02/06/2001 | US6184047 Contactor sleeve assembly for a pick and place semiconductor device handler |
| 02/06/2001 | US6184046 Non-contact voltage stressing method for thin dielectrics at the wafer level |
| 02/06/2001 | US6184045 Method for DRAM cell arrangement and method for its production |
| 02/06/2001 | US6184044 Thin film capacitor including perovskite-type oxide layers having columnar structure and granular structure |
| 02/06/2001 | US6183941 Rotating semiconductor wafer; dispensing process liquid through nozzle connected to liquid source such that process liquid exits nozzle in circumferentially continuous sheet onto rotating wafer surface |
| 02/06/2001 | US6183940 Method of retaining the integrity of a photoresist pattern |
| 02/06/2001 | US6183938 Conformal organic coatings for sidewall patterning of sublithographic structures |
| 02/06/2001 | US6183935 For forming minute inorganic pattern; resolution, sensitivity, aspect ratio, |
| 02/06/2001 | US6183920 Detecting diffusion layer corresponding concave shape; correcting by indenting inner bottom surface of diffusion layer to ensure projection of gate from inside of layer corresponding concave shape for preventing corner rounding |
| 02/06/2001 | US6183875 Composite material which is prepared by directly solidifying molten aluminum or aluminum alloy on at least portion of ceramic substrate |
| 02/06/2001 | US6183874 Aluminum silicon carbide composite alloys |
| 02/06/2001 | US6183857 Substrate with semi-insulating layer of silicon and particles embedded in silicon |
| 02/06/2001 | US6183819 Method for processing a poly defect |
| 02/06/2001 | US6183813 Gripping and suspension of semiconductor resins |
| 02/06/2001 | US6183713 Method for producing nitrogen trifluoride by gas-solid reaction |
| 02/06/2001 | US6183656 Method of detecting end point of polishing of wafer and apparatus for detecting end point of polishing |
| 02/06/2001 | US6183655 Tunable process for selectively etching oxide using fluoropropylene and a hydrofluorocarbon |
| 02/06/2001 | US6183615 Transport system for wafer processing line |
| 02/06/2001 | US6183614 Rotating sputter magnetron assembly |
| 02/06/2001 | US6183611 Method and apparatus for the disposal of processing fluid used to deposit and/or remove material on a substrate |
| 02/06/2001 | US6183605 Sputtering dielectrics |
| 02/06/2001 | US6183589 Method for manufacturing lead-on-chip (LOC) semiconductor packages using liquid adhesive applied under the leads |
| 02/06/2001 | US6183588 Process for transferring a thin-film structure to a substrate |
| 02/06/2001 | US6183566 UV/halogen metals removal process |
| 02/06/2001 | US6183565 Method and apparatus for supporting a semiconductor wafer during processing |
| 02/06/2001 | US6183564 Buffer chamber for integrating physical and chemical vapor deposition chambers together in a processing system |
| 02/06/2001 | US6183563 Apparatus for depositing thin films on semiconductor wafers |
| 02/06/2001 | US6183523 Apparatus for thermal control of variously sized articles in vacuum |
| 02/06/2001 | US6183358 Isolated multilevel fabricating facility with two way clean tunnel transport system with each tool having adjacent support skid |
| 02/06/2001 | US6183354 Carrier head with a flexible membrane for a chemical mechanical polishing system |
| 02/06/2001 | US6183351 Method of supplying a chemical mechanical polishing liquid and apparatus therefor |
| 02/06/2001 | US6183345 Polishing apparatus and method |
| 02/06/2001 | US6183267 Ultra-miniature electrical contacts and method of manufacture |
| 02/06/2001 | US6183223 Chemical supply system with a pair of bellows connected in series for pumping a fluid |
| 02/06/2001 | US6183189 Self aligning wafer chuck design for wafer processing tools |
| 02/06/2001 | US6183186 Wafer handling system and method |
| 02/06/2001 | US6183183 Dual arm linear hand-off wafer transfer assembly |
| 02/06/2001 | US6183130 Apparatus for substrate temperature measurement using a reflecting cavity and detector |
| 02/06/2001 | US6183127 System and method for the real time determination of the in situ emissivity of a workpiece during processing |
| 02/06/2001 | US6183026 End effector |
| 02/06/2001 | US6182885 Wire bonding method |
| 02/06/2001 | US6182882 Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe |
| 02/06/2001 | US6182851 Vacuum processing chambers and method for producing |
| 02/06/2001 | US6182829 I.C. carrier insert |
| 02/06/2001 | US6182828 Reel tape for provisionally supporting a bare chip |
| 02/06/2001 | US6182675 Apparatus for recovering impurities from a silicon wafer |
| 02/06/2001 | US6182605 Apparatus for particle beam induced modification of a specimen |
| 02/06/2001 | US6182604 Hollow cathode for plasma doping system |
| 02/06/2001 | US6182603 Surface-treated shower head for use in a substrate processing chamber |
| 02/06/2001 | US6182602 Inductively coupled HDP-CVD reactor |
| 02/06/2001 | US6182546 Apparatus and methods for separating microelectronic packages from a common substrate |
| 02/06/2001 | US6182376 Degassing method and apparatus |
| 02/06/2001 | US6182369 Pattern forming apparatus |
| 02/06/2001 | US6182358 Process for producing a metal-ceramic substrate |
| 02/06/2001 | US6182356 Apparatus for solder ball mold loading |
| 02/01/2001 | WO2001008411A1 Field programmable gate array with program encryption |
| 02/01/2001 | WO2001008242A1 Preferred methods for producing electrical circuit elements used to control an electronic display |
| 02/01/2001 | WO2001008241A1 Reactive formation of dielectric layers and protection of organic layers in organic semiconductor device |
| 02/01/2001 | WO2001008229A1 ZnO COMPOUND SEMICONDUCTOR LIGHT EMITTING ELEMENT AND PRODUCTION METHOD THEREOF |
| 02/01/2001 | WO2001008225A1 Method for making a device comprising layers of planes of quantum dots |
| 02/01/2001 | WO2001008222A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 02/01/2001 | WO2001008221A1 High frequency module |
| 02/01/2001 | WO2001008217A1 Methods of forming capacitor-over-bit line memory cells |
| 02/01/2001 | WO2001008216A1 Method of making a buried strap for a trench capacitor |
| 02/01/2001 | WO2001008215A1 Method for producing a semiconductor memory element |
| 02/01/2001 | WO2001008213A1 REDUCED ELECTROMIGRATION AND STRESS INDUCED MIGRATION OF Cu WIRES BY SURFACE COATING |