| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/22/2001 | DE10036001A1 Vorrichtung und Verfahren zur Waferheizung Apparatus and method for wafer heating |
| 02/22/2001 | DE10032311A1 Non-volatile ferroelectric memory comprises partial word lines, bit lines that cut the partial word lines, source/drain impurity regions formed on both sides of the word lines, and ferroelectric capacitors |
| 02/22/2001 | DE10031626A1 Trench structure used in the production of MOSFETs comprises a trench formed in a substrate, a dielectric material covering a wall of the trench to form a dielectric layer |
| 02/22/2001 | DE10031605A1 Liquid processing method used in the production of a semiconductor device comprises adding liquid to the object to be processed, contacting with a treatment fluid and removing the treatment fluid |
| 02/22/2001 | DE10027132A1 Method and system of multi-band UV illumination of wafers for optical test and measurement systems employing microscopes with wafer images processed using special data processing algorithms |
| 02/22/2001 | DE10027091A1 Negativ arbeitende Resistzusammensetzungen des chemischen Verstärkungstyps Negative-working resist compositions of chemical amplification type |
| 02/22/2001 | DE10024361A1 Semiconductor device used as a DRAM of a capacitor-over-bitline has a lower insulating layer covering source/drain regions, an upper insulating layer and storage node contacts |
| 02/22/2001 | DE10002639A1 Bandträger für einen BGA und eine Halbleitervorrichtung, die diesen benutzt Band carrier for BGA and a semiconductor device using this |
| 02/22/2001 | CA2378793A1 Polishing system with stopping compound and method of its use |
| 02/22/2001 | CA2378790A1 Polishing system and method of its use |
| 02/22/2001 | CA2378771A1 Chemical mechanical polishing systems and methods for their use |
| 02/21/2001 | EP1077494A2 Heterojunction bipolar transistor and method for fabricating the same |
| 02/21/2001 | EP1077490A1 Improvements in or relating to integrated circuit dies |
| 02/21/2001 | EP1077487A2 Trench capacitor DRAM cell with vertical transistor |
| 02/21/2001 | EP1077486A1 Semiconductor device |
| 02/21/2001 | EP1077485A2 Method to deposit a platinum seed layer for use in selective copper plating |
| 02/21/2001 | EP1077484A2 Barrier layer for electroplating processes |
| 02/21/2001 | EP1077483A2 Method of making an integrated circuit device having a planar interlevel dielectric layer |
| 02/21/2001 | EP1077482A2 Semiconductor contacting device |
| 02/21/2001 | EP1077481A2 Etching aluminium over refractory metal with successive plasmas |
| 02/21/2001 | EP1077480A1 Method and apparatus to enchance properties of Si-O-C low K films |
| 02/21/2001 | EP1077479A1 Post-deposition treatment to enchance properties of Si-O-C low K film |
| 02/21/2001 | EP1077478A2 Method of making ferroelectric thin film, ferroelectric capacitor, ferroelectric memory and method for fabricating ferroelectric memory |
| 02/21/2001 | EP1077477A1 Surface treatment of C-doped Si02 film to enhance film stability during 02 ashing |
| 02/21/2001 | EP1077476A2 Oxygen free plasma stripping process |
| 02/21/2001 | EP1077475A2 Method of micromachining a multi-part cavity |
| 02/21/2001 | EP1077474A2 Backside etching in a scrubber |
| 02/21/2001 | EP1077473A2 Method and apparatus for cleaning a surface of a semiconductor wafer |
| 02/21/2001 | EP1077472A2 Etching apparatus |
| 02/21/2001 | EP1077381A2 Probe card and method of testing wafer having a plurality of semiconductor devices |
| 02/21/2001 | EP1077274A1 Lid cooling mechanism and method for optimized deposition of low-k dielectric using tri methylsilane-ozone based processes |
| 02/21/2001 | EP1077243A2 Film adhesive composition for electronic packaging |
| 02/21/2001 | EP1077241A2 Composition for use in a chemical-mechanical planarization process |
| 02/21/2001 | EP1077240A1 Aqueous dispersion for chemical mechanical polishing |
| 02/21/2001 | EP1077111A1 Method and tool for abrasive machining of a substantially flat surface |
| 02/21/2001 | EP1077108A1 Polishing method and polishing apparatus |
| 02/21/2001 | EP1076930A1 Surface acoustic wave device package and method |
| 02/21/2001 | EP1076916A1 Flash memory cell with self-aligned gates and fabrication process |
| 02/21/2001 | EP1076914A1 Electrostatic chuck formed by integral ceramic and metal sintering |
| 02/21/2001 | EP1076913A1 Flip chip with integrated flux, mask and underfill |
| 02/21/2001 | EP1076911A1 Method and apparatus for ionized physical vapor deposition |
| 02/21/2001 | EP1076906A1 Lighting system, especially for extreme ultraviolet lithography |
| 02/21/2001 | EP1076835A1 Broadband diffractive diffuser and associated methods |
| 02/21/2001 | EP1076826A1 Method for producing micromechanical components |
| 02/21/2001 | EP1076814A1 Chemical-mechanical-planarization (cmp) slurry quality control process and particle size distribution measuring systems |
| 02/21/2001 | EP1076732A1 Injector for reactor |
| 02/21/2001 | EP1076730A1 A method of etching an opening |
| 02/21/2001 | EP1076500A1 Tiltable z-axis platform based on uni-directional tilt platform |
| 02/21/2001 | CN1285007A Method for selectively depositing bismuth based ferroelectric films |
| 02/21/2001 | CN1285006A Free floating shield and semiconductor processing system |
| 02/21/2001 | CN1284790A Surface acoustic wave device suitable for installing flip-chip |
| 02/21/2001 | CN1284748A Semiconductor device having nitrogen gate containing insulating film and manufacturing method |
| 02/21/2001 | CN1284747A Semiconductor device and method for manufacture of the same |
| 02/21/2001 | CN1284745A Manufacture of dielectric layer |
| 02/21/2001 | CN1284744A Wafer defect detecting and characteristics analyzing method |
| 02/21/2001 | CN1284743A Method of manufacturing transistor for semiconductor device |
| 02/21/2001 | CN1284742A Method for manufacturing semiconductor device with semiconductor layer |
| 02/21/2001 | CN1284741A Laser device, laser annealing method and method for manufacturing semiconductor device |
| 02/21/2001 | CN1284740A Method for electronic beam exposing and method for maaufacture of semiconductor device |
| 02/21/2001 | CN1284694A Manufacture of electro-optical device |
| 02/21/2001 | CN1284613A Collecting device |
| 02/21/2001 | CN1284526A Film adhesion agent composition for electronic encapsulation |
| 02/21/2001 | CN1062233C Wafer shipper |
| 02/20/2001 | USRE37059 Wiring pattern of semiconductor integrated circuit device |
| 02/20/2001 | US6192510 Method of preparing a partial one-shot electron beam exposure mask and method of direct-writing patterns by use of a partial one-shot electron beam exposure mask |
| 02/20/2001 | US6192496 System for verifying signal timing accuracy on a digital testing device |
| 02/20/2001 | US6192330 Method and apparatus for string model simulation of a physical semiconductor process including use of specific depth angles and segment list with removal of redundant segments |
| 02/20/2001 | US6192291 Method of controlling semiconductor fabricating equipment to process wafers of a single lot individually |
| 02/20/2001 | US6192290 System and method of manufacturing semicustom integrated circuits using reticle primitives from a library and interconnect reticles |
| 02/20/2001 | US6192289 Method and apparatus for analyzing cuts |
| 02/20/2001 | US6192287 Method and apparatus for fault detection and control |
| 02/20/2001 | US6192000 Semiconductor memory device having decreased layout area and method of manufacturing the same |
| 02/20/2001 | US6191994 Semiconductor device |
| 02/20/2001 | US6191990 Semiconductor integrated circuit device having stabilizing capacitors connected between power lines of main amplifiers |
| 02/20/2001 | US6191980 Single-poly non-volatile memory cell having low-capacitance erase gate |
| 02/20/2001 | US6191978 Non-volatile semiconductor memory device |
| 02/20/2001 | US6191975 Non-volatile NAND type semiconductor memory device with stacked gate memory cells and a stacked gate select transistor |
| 02/20/2001 | US6191967 Voltage supply device having self-testing circuit |
| 02/20/2001 | US6191962 Step-up power supply circuit and semiconductor integrated circuit device |
| 02/20/2001 | US6191952 Compliant surface layer for flip-chip electronic packages and method for forming same |
| 02/20/2001 | US6191946 Heat spreader with excess solder basin |
| 02/20/2001 | US6191880 Radial polarization-rotating optical arrangement and microlithographic projection exposure system incorporating said arrangement |
| 02/20/2001 | US6191864 Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers |
| 02/20/2001 | US6191858 Position detecting method and apparatus using optical system with oblique optical axes |
| 02/20/2001 | US6191844 Scanning exposure apparatus in which light exposure is a function of the speed of the mask or substrate stage |
| 02/20/2001 | US6191843 Exposure device, method of making and using same, and objects exposed by the exposure device |
| 02/20/2001 | US6191817 Charge transfer device and method of driving the charge transfer device |
| 02/20/2001 | US6191647 Low noise integrated circuit device for reducing a noise on LSI power supply nets to supply electric charges required to operate IC |
| 02/20/2001 | US6191604 Integrated circuit testing device |
| 02/20/2001 | US6191598 High resolution analytical probe station |
| 02/20/2001 | US6191596 Method for detecting a contact position between an object to be measured and measuring pins |
| 02/20/2001 | US6191498 Power-supplying device for generating different voltage outputs |
| 02/20/2001 | US6191494 Semiconductor device and method of producing the same |
| 02/20/2001 | US6191493 Resin seal semiconductor package and manufacturing method of the same |
| 02/20/2001 | US6191491 Semiconductor integrated circuit device |
| 02/20/2001 | US6191489 Micromechanical layer stack arrangement particularly for flip chip or similar connections |
| 02/20/2001 | US6191488 Flip chip type semiconductor package and method of injecting resin into device thereof |
| 02/20/2001 | US6191487 Semiconductor and flip chip packages and method having a back-side connection |
| 02/20/2001 | US6191485 Semiconductor device |
| 02/20/2001 | US6191484 Method of forming planarized multilevel metallization in an integrated circuit |