Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2001
02/20/2001US6190993 Method of fabricating capacitor for semiconductor device
02/20/2001US6190992 Method to achieve rough silicon surface on both sides of container for enhanced capacitance/area electrodes
02/20/2001US6190991 Method for fabricating a capacitor
02/20/2001US6190990 Method for manufacturing the storage node of a capacitor on a semiconductor wafer
02/20/2001US6190989 Method for patterning cavities and enhanced cavity shapes for semiconductor devices
02/20/2001US6190988 Method for a controlled bottle trench for a dram storage node
02/20/2001US6190987 MOS semiconductor device and method of manufacturing the same
02/20/2001US6190985 Practical way to remove heat from SOI devices
02/20/2001US6190984 Method for fabricating of super self-aligned bipolar transistor
02/20/2001US6190983 Method for fabricating high-voltage device
02/20/2001US6190982 Method of fabricating a MOS transistor on a semiconductor wafer
02/20/2001US6190981 Method for fabricating metal oxide semiconductor
02/20/2001US6190980 Method of tilted implant for pocket, halo and source/drain extension in ULSI dense structures
02/20/2001US6190979 Method for fabricating dual workfunction devices on a semiconductor substrate using counter-doping and gapfill
02/20/2001US6190978 Method for fabricating lateral RF MOS devices with enhanced RF properties
02/20/2001US6190977 Method for forming MOSFET with an elevated source/drain
02/20/2001US6190976 Fabrication method of semiconductor device using selective epitaxial growth
02/20/2001US6190975 Method of forming HCMOS devices with a silicon-germanium-carbon compound semiconductor layer
02/20/2001US6190974 Method of fabricating a mask ROM
02/20/2001US6190973 Method of fabricating a high quality thin oxide
02/20/2001US6190971 Formation of 5F2 cell with partially vertical transistor and gate conductor aligned buried strap with raised shallow trench isolation region
02/20/2001US6190970 Method of making power MOSFET and IGBT with optimized on-resistance and breakdown voltage
02/20/2001US6190969 Method to fabricate a flash memory cell with a planar stacked gate
02/20/2001US6190968 Method for forming EPROM and flash memory cells with source-side injection
02/20/2001US6190966 Process for fabricating semiconductor memory device with high data retention including silicon nitride etch stop layer formed at high temperature with low hydrogen ion concentration
02/20/2001US6190965 Spacer patterned, high dielectric constant capacitor
02/20/2001US6190964 Method of producing a stacked capacitor
02/20/2001US6190963 Forming an electrode of a ferroelectric capacitor
02/20/2001US6190962 Method of fabricating capacitor
02/20/2001US6190961 Fabricating a square spacer
02/20/2001US6190960 Method for coupling to semiconductor device in an integrated circuit having edge-defined sub-lithographic conductors
02/20/2001US6190959 Semiconductor memory array having sublithographic spacing between adjacent trenches and method for making the same
02/20/2001US6190958 Fully self-aligned method for fabricating transistor and memory
02/20/2001US6190957 Method of forming a ferroelectric device
02/20/2001US6190956 Forming a capacitor structure of a semiconductor
02/20/2001US6190955 Fabrication of trench capacitors using disposable hard mask
02/20/2001US6190954 Robust latchup-immune CMOS structure
02/20/2001US6190953 Semiconductor device and method for producing same
02/20/2001US6190952 Multiple semiconductor-on-insulator threshold voltage circuit
02/20/2001US6190951 Method for manufacturing a liquid crystal display apparatus
02/20/2001US6190950 Dense SOI programmable logic array structure
02/20/2001US6190949 Silicon thin film, group of silicon single crystal grains and formation process thereof, and semiconductor device, flash memory cell and fabrication process thereof
02/20/2001US6190947 Silicon semiconductor rectifier chips and manufacturing method thereof
02/20/2001US6190946 Fabricating method of semiconductor package
02/20/2001US6190945 Integrated heat sink
02/20/2001US6190940 Flip chip assembly of semiconductor IC chips
02/20/2001US6190937 Method of producing semiconductor member and method of producing solar cell
02/20/2001US6190934 Liquid crystal display device and a method for manufacturing the same
02/20/2001US6190933 Monolithic
02/20/2001US6190928 Method for actually measuring misalignment of via
02/20/2001US6190927 Method and apparatus for detecting optimal endpoints in plasma etch processes
02/20/2001US6190926 Yield enhancement technique for integrated circuit processing to reduce effects of undesired dielectric moisture retention and subsequent hydrogen out-diffusion
02/20/2001US6190925 Epitaxially grown lead germanate film and deposition method
02/20/2001US6190924 Apparatus and method to form ferroelectric capacitors having low dielectric loss
02/20/2001US6190911 Semiconductor device and fabrication method thereof
02/20/2001US6190841 Pattern forming process and a photosensitive composition
02/20/2001US6190839 High conformality antireflective coating compositions
02/20/2001US6190836 Methods for repair of photomasks
02/20/2001US6190835 A coaxial shielding fluid is produced around the process fluid plume. a plasma is generated by providing an energy source that impinges on the process fluid plume.
02/20/2001US6190829 Allows for wider exposure dosage windows, therefore increasing the yield or performance and line density.
02/20/2001US6190808 X-ray mask and method of manufacturing the same
02/20/2001US6190788 Having a high crack-forming thickness limit; from a reaction product of a polysilazane compound and a dialkylalkanolamine
02/20/2001US6190746 Polishing cloth and a method for attaching/detaching the polishing cloth to/from a base plate of a polishing machine
02/20/2001US6190631 Low defect density, ideal oxygen precipitating silicon
02/20/2001US6190629 Removing hazardous gas from exhaust stream; air pollution control; nontoxic, corrosion resistance
02/20/2001US6190529 Method for plating gold to bond leads on a semiconductor substrate
02/20/2001US6190520 Impurity measuring device
02/20/2001US6190518 Device for reducing plasma etch damage and method for manufacturing same
02/20/2001US6190509 Blend of dielectric and electroconductive particles; applying electromagnetic waves
02/20/2001US6190496 Plasma etch reactor and method for emerging films
02/20/2001US6190495 Magnetron plasma processing apparatus
02/20/2001US6190494 Method and apparatus for electrically endpointing a chemical-mechanical planarization process
02/20/2001US6190493 Thin-film multilayer wiring board and production thereof
02/20/2001US6190460 Apparatus for low pressure chemical vapor depostion
02/20/2001US6190459 Gas treatment apparatus
02/20/2001US6190458 Apparatus for eliminating impurities by ozone generated in space above substrate surface and film forming method and system therewith
02/20/2001US6190453 Growth of epitaxial semiconductor material with improved crystallographic properties
02/20/2001US6190452 Silicon single crystal wafer and method for producing it
02/20/2001US6190425 Memory bar and related circuits and methods
02/20/2001US6190424 Process for fabricating two different types of wafers in a semiconductor wafer production line
02/20/2001US6190237 pH-buffered slurry and use thereof for polishing
02/20/2001US6190234 Endpoint detection with light beams of different wavelengths
02/20/2001US6190233 Method and apparatus for improving gap-fill capability using chemical and physical etchbacks
02/20/2001US6190179 Method of making a field effect transistor having a channel in an epitaxial silicon layer
02/20/2001US6190118 Tilt mechanism for wafer cassette
02/20/2001US6190113 Quartz pin lift for single wafer chemical vapor deposition/etch process chamber
02/20/2001US6190104 Treatment object conveyor apparatus, semiconductor manufacturing apparatus, and treatment object treatment method
02/20/2001US6190103 Wafer transfer device and method
02/20/2001US6190040 Apparatus for sensing temperature on a substrate in an integrated circuit fabrication tool
02/20/2001US6190037 Non-intrusive, on-the-fly (OTF) temperature measurement and monitoring system
02/20/2001US6189943 Robot hand
02/20/2001US6189772 Method of forming a solder ball
02/20/2001US6189771 Method of forming solder bump and method of mounting the same
02/20/2001US6189766 Zero stress bonding of silicon carbide to diamond
02/20/2001US6189765 Apparatus and method for detecting double wire bonding
02/20/2001US6189762 Apparatus and method of clamping semiconductor devices using sliding finger supports
02/20/2001US6189761 Wire bonding apparatus
02/20/2001US6189760 Chip junction nozzle
02/20/2001US6189680 Rotary conveyor
02/20/2001US6189591 Wafer sheet expanding apparatus and pellet bonding apparatus using thereof