| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/27/2001 | US6193803 Substrate holding apparatus for processing semiconductors |
| 02/27/2001 | US6193802 Parallel plate apparatus for in-situ vacuum line cleaning for substrate processing equipment |
| 02/27/2001 | US6193798 Arrangement for treatment of wafer-shaped articles, particularly silicon wafers |
| 02/27/2001 | US6193783 Pumping a solution, degassing, opening a passage then discharging |
| 02/27/2001 | US6193601 Module bay with directed flow |
| 02/27/2001 | US6193586 Method and apparatus for grinding wafers using a grind chuck having high elastic modulus |
| 02/27/2001 | US6193585 Method of polishing a hard material-coated wafer |
| 02/27/2001 | US6193507 Multi-function chamber for a substrate processing system |
| 02/27/2001 | US6193459 Integrated wafer pod-load/unload and mass-transfer system |
| 02/27/2001 | US6193143 Solder bump forming method and mounting apparatus and mounting method of solder ball |
| 02/27/2001 | US6193136 Component mounting method and apparatus |
| 02/27/2001 | US6193132 Method for bonding semiconductor chip and device therefor |
| 02/27/2001 | US6193130 Bump bonding apparatus |
| 02/27/2001 | US6193090 Reusable container |
| 02/27/2001 | US6193068 Containment device for retaining semiconductor wafers |
| 02/27/2001 | US6192956 Method and apparatus for application of spray adhesive to a leadframe for chip bonding |
| 02/27/2001 | US6192938 Gas panel |
| 02/27/2001 | US6192903 Spin-processing apparatus and spin-processing method |
| 02/27/2001 | US6192902 Chemical treating apparatus and flow rate controlling method thereof |
| 02/27/2001 | US6192899 Forming a residual etch film by an etch of a dielectric material and exposing the residual etch film to a solution comprising dulcitol |
| 02/27/2001 | US6192898 Method and apparatus for cleaning a chamber |
| 02/27/2001 | US6192829 Antenna coil assemblies for substrate processing chambers |
| 02/27/2001 | US6192828 Thin film forming device for forming silicon thin film having crystallinity |
| 02/27/2001 | US6192827 Double slit-valve doors for plasma processing |
| 02/27/2001 | US6192709 Quencher clamping operation using an electromagnet |
| 02/27/2001 | US6192603 Vacuum processing apparatus and magnetic seal rotary bearing unit |
| 02/27/2001 | US6192601 Method and apparatus for reducing particle contamination during wafer transport |
| 02/27/2001 | US6192600 Thermocapillary dryer |
| 02/27/2001 | US6192581 Method of making printed circuit board |
| 02/27/2001 | US6192579 Tape carrier and manufacturing method therefor |
| 02/27/2001 | US6192578 Method for electrically coupling bond pads of a microelectronic device |
| 02/27/2001 | US6192570 Method for the remanufacturing of a sealed module |
| 02/27/2001 | US6192547 Air curtain system used in manufacturing thin film transistor liquid crystal display |
| 02/27/2001 | CA2316083A1 Mask repair |
| 02/27/2001 | CA2200587C Stainless steel acid treatment |
| 02/22/2001 | WO2001013697A1 Assembly device |
| 02/22/2001 | WO2001013679A1 Ceramic heater |
| 02/22/2001 | WO2001013436A1 Passivation of gan based fets |
| 02/22/2001 | WO2001013434A1 Semiconductor diode and method for producing the same |
| 02/22/2001 | WO2001013433A1 Spherical shaped integrated circuit utilizing an inductor |
| 02/22/2001 | WO2001013431A1 Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies |
| 02/22/2001 | WO2001013429A1 Method for fabricating 4f2 memory cells with vertical transistor and stacked capacitor |
| 02/22/2001 | WO2001013428A1 Method for fabrication of enlarged stacked dram capacitors |
| 02/22/2001 | WO2001013427A1 Method for contact size control for nand technology |
| 02/22/2001 | WO2001013426A1 Method of producing copper features on semiconductor wafers |
| 02/22/2001 | WO2001013425A1 Manufacture of an integrated circuit isolation structure |
| 02/22/2001 | WO2001013424A1 Ceramic substrate, ceramic heater, electrostatic chuck and wafer prober for use in semiconductor producing and inspecting devices |
| 02/22/2001 | WO2001013423A1 Semiconductor production device ceramic plate |
| 02/22/2001 | WO2001013421A1 Method of simultaneously growing oxide layers with different ticknesses on a semiconductor body using selective implantations of oxygen and nitrogen |
| 02/22/2001 | WO2001013420A1 Integration scheme using self-planarized dielectric layer for shallow trench isolation (sti) |
| 02/22/2001 | WO2001013419A1 Processing apparatus and processing method |
| 02/22/2001 | WO2001013418A1 A single-operation method of cleaning semiconductors after final polishing |
| 02/22/2001 | WO2001013417A1 Polishing compound for chemimechanical polishing and method for polishing substrate |
| 02/22/2001 | WO2001013416A1 Method and apparatus for depositing and controlling the texture of a thin film |
| 02/22/2001 | WO2001013415A1 Production method of semiconductor device and production device therefor |
| 02/22/2001 | WO2001013414A1 A process for making island arrays |
| 02/22/2001 | WO2001013413A1 Exposure during rework for enhanced resist removal |
| 02/22/2001 | WO2001013412A1 Method for structuring an organic anti-reflection coating |
| 02/22/2001 | WO2001013411A1 Method for carry in and installation of semiconductor manufacturing apparatus and substitute for apparatus |
| 02/22/2001 | WO2001013410A1 Wafer holder assembly |
| 02/22/2001 | WO2001013409A1 Assembly device |
| 02/22/2001 | WO2001013408A1 Overhead transport system for open cassette transport |
| 02/22/2001 | WO2001013404A1 Diamond coated parts in a plasma reactor |
| 02/22/2001 | WO2001013403A1 Inductively coupled plasma process chamber with shield electrode interposed between antenna and dielectric window |
| 02/22/2001 | WO2001013401A1 Method for monitoring a production process for preparing a substrate in semiconductor manufacturing |
| 02/22/2001 | WO2001013387A1 Method for producing a magnetic tunnel contact and magnetic tunnel contact |
| 02/22/2001 | WO2001013384A1 Inductor element |
| 02/22/2001 | WO2001013377A1 Circuit implementation to quench bit line leakage current in programming and over-erase correction modes in flash eeprom |
| 02/22/2001 | WO2001013330A1 Integrated circuit and circuit arrangement for supplying an integrated circuit with electricity |
| 02/22/2001 | WO2001013180A1 Antireflective coating material for photoresists |
| 02/22/2001 | WO2001013179A1 Water-processable photoresist compositions |
| 02/22/2001 | WO2001013178A1 Halftone phase shift photomask and blanks for halftone phase shift photomask for it and pattern forming method using this |
| 02/22/2001 | WO2001013177A1 Photomask, method for manufacturing the same, projection aligner using the photomask, and projection exposing method |
| 02/22/2001 | WO2001013176A1 Methods of determining alignment in the forming of phase shift regions in the fabrication of a phase shift mask |
| 02/22/2001 | WO2001013134A1 Parameter adjustment in a mos integrated circuit |
| 02/22/2001 | WO2001013130A1 Electrical contactor, especially wafer level contactor, using fluid pressure |
| 02/22/2001 | WO2001013098A1 Variable angle illumination wafer inspection system |
| 02/22/2001 | WO2001013054A1 Hot wall rapid thermal processor |
| 02/22/2001 | WO2001012884A1 p-TYPE SINGLE CRYSTAL ZINC OXIDE HAVING LOW RESISTIVITY AND METHOD FOR PREPARATION THEREOF |
| 02/22/2001 | WO2001012875A1 Film forming device |
| 02/22/2001 | WO2001012873A1 Pulsed plasma processing method and apparatus |
| 02/22/2001 | WO2001012741A1 Polishing system with stopping compound and method of its use |
| 02/22/2001 | WO2001012740A1 Polishing system and method of its use |
| 02/22/2001 | WO2001012739A1 Chemical mechanical polishing systems and methods for their use |
| 02/22/2001 | WO2001012634A1 Group(iii)-metal-hydrides with a guanidino-type ligand |
| 02/22/2001 | WO2001012384A2 Apparatus for moving a workpiece |
| 02/22/2001 | WO2001012300A1 Method for reducing the amount of perfluorocompound gas contained in exhaust emissions from plasma processing |
| 02/22/2001 | WO2000060665A3 An eeprom cell on soi |
| 02/22/2001 | WO2000059011A3 Memory cell capacitor plate |
| 02/22/2001 | WO2000059002A3 Device for manufacturing semiconductor products |
| 02/22/2001 | WO2000059001A3 Device for treating wafers |
| 02/22/2001 | WO2000041217A3 Method and apparatus for preventing warp of clamp ring used for wafer coating apparatus |
| 02/22/2001 | WO2000005747A3 Metallization structures for microelectronic applications and process for forming the structures |
| 02/22/2001 | DE19954356A1 Cleaning semiconductor wafers comprises using an aqueous hydrogen fluoride solution acidified with a mineral acid, rinsing with or in pure water and then cleaning with an aqueous ozone solution |
| 02/22/2001 | DE19939687A1 Large-area electron beam radiation exposure dose determination for microelectronics layout, involves dividing the total surface area into several disjunctive part-areas with different structural widths |
| 02/22/2001 | DE19939600A1 Arrangement for treatment of substrates e.g. wafers during the finishing of electronic and microelectronic components comprises substrate support plates arranged over each other in a vacuum chamber |
| 02/22/2001 | DE19938215A1 Verfahren zur Herstellung eines magnetischen Tunnelkontakts sowie magnetischer Tunnelkontakt A method of manufacturing a magnetic tunnel junction and a magnetic tunnel junction |
| 02/22/2001 | DE19937994A1 Ätzprozeß für eine Zweischicht-Metallisierung Etching process for a two-layer metallization |
| 02/22/2001 | DE19935130C1 Verfahren zur Herstellung eines Kontaktloches für ein Halbleiterspeicherbauelement A process for preparing a contact hole for a semiconductor memory device |
| 02/22/2001 | DE19926500A1 Nichtflüchtige Halbleiter-Speicherzelle und Verfahren zu deren Herstellung A non-volatile semiconductor memory cell and process for their preparation |