Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2001
03/01/2001WO2001014893A1 Test needle for a raster-matching adapter and a device for testing printed circuit boards
03/01/2001WO2001014842A1 Semiconductor pressure sensor and pressure sensing device
03/01/2001WO2001014811A1 Continuous-conduction wafer bump reflow system
03/01/2001WO2001014619A1 Method and device for depositing materials with a large electronic energy gap and high binding energy
03/01/2001WO2001014510A1 Stripping and cleaning compositions
03/01/2001WO2001014496A1 Compositions for insulator and metal cmp and methods relating thereto
03/01/2001WO2001014484A1 Adhesive agent, method for connecting wiring terminals and wiring structure
03/01/2001WO2001014463A1 Etchant composition for polyimide resin and method of etching
03/01/2001WO2001014227A1 Material delivery system for clean room environments
03/01/2001WO2000079579A3 Device and method for the high-frequency etching of a substrate using a plasma etching installation and device and method for igniting a plasma and for pulsing the plasma output or adjusting the same upwards
03/01/2001WO2000059009A3 Processing chamber with optical window cleaned using process gas
03/01/2001WO2000058995B1 Apparatus for improving plasma distribution and performance in an inductively coupled plasma
03/01/2001WO2000054933B1 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control
03/01/2001WO2000021139A8 Low stress polysilicon film and method for producing same
03/01/2001DE19940120A1 Forming a bottle-like deep channel in a substrate comprises etching to form an upper region of the channel in the substrate using a plasma gas, etching to form a bottle-like base region of the channel and vertically etching
03/01/2001DE19940035A1 Manufacture of integrated inductor which reduces energy loss through underlying silicon substrate
03/01/2001DE19939955A1 Prüfnadel für einen Rasteranpassungsadapter einer Vorrichtung zum Testen von Leiterplatten Test needle for a pattern adapter of a device for testing printed circuit boards
03/01/2001DE19939700A1 Process for characterizing and improving defect-adhered boundary surfaces in heterostructures on silicon comprises inserting foreign atoms into the heterostructure and detecting by a deep profiling process as boundary surface accumulation
03/01/2001DE19939597A1 Microelectronic structure manufacturing method for integrated circuits
03/01/2001DE19937995A1 Verfahren zur Strukturierung einer organischen Antireflexionsschicht Method for structuring an organic anti-reflective layer
03/01/2001DE19937387C1 Vorrichtung zur Überwachung eines Auftrags eines flüssigen bis pastenförmigen Mediums auf ein Substrat Apparatus for monitoring the deposition of a liquid-to-pasty medium on a substrate
03/01/2001DE19937262A1 Anordnung mit Transistor-Funktion Arrangement with transistor function
03/01/2001DE19936569A1 Production of a porous silicon surface for making thin layer solar cells involves passing silicon strip through electrolyte bath
03/01/2001DE19935441A1 Verfahren und Moldwerkzeug zum Umhüllen von elektronischen Bauelementen A method and molding tool for wrapping electronic components
03/01/2001DE19935046A1 Plasma-CVD-Verfahren und Vorrichtung zur Herstellung einer mikrokristallinen Si:H-Schicht auf einem Substrat sowie deren Verwendung Plasma CVD method and apparatus for producing a microcrystalline Si: H layer on a substrate and the use thereof
03/01/2001DE10041118A1 Verfahren und Vorrichtung zur Detektion von Mikrokratzern in einem Wafer Method and device for the detection of micro-scratches in a wafer
03/01/2001DE10040963A1 Vernetzermonomer, umfassend eine Doppelbindung, und ein dieses enthaltendes Photoresist-Copolymer Crosslinker comprising one double bond, and a photoresist containing this copolymer
03/01/2001DE10037950A1 Non-volatile ferroelectric memory device arrangement, includes pairs of a control-line and a read-line formed in the direction intersecting the word-lines at fixed intervals
03/01/2001DE10036217A1 Coordinate table mechanism for semiconductor lithography device has sliding shafts fitted with table surface within vacuum chamber supported by pressurized gas bearings
03/01/2001DE10031881A1 Semiconductor device for e.g. high speed RAM, has titanium oxide film formed uniformly on lower strontium-ruthenium oxide film formed on semiconductor substrate
03/01/2001DE10031056A1 Kondensator für eine Halbleiterspeichervorrichtung und Verfahren zu dessen Herstellung A capacitor for a semiconductor memory device and method for its production
03/01/2001DE10030183A1 Semiconductor wafer cutting apparatus has chuck table to convey wafer from wafer mounting area to cutting area in X-axis direction
03/01/2001DE10028062A1 Verfahren zum Durchschneiden einer Schutzfolie bei Halbleiterwafern Method for cutting a protective film semiconductor wafers
03/01/2001DE10022425A1 Halbleiterbauelement und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same
03/01/2001DE10017383A1 Halbleitervorrichtung Semiconductor device
03/01/2001CA2316548A1 Surface stabilization of silicon rich silica glass using increased post deposition delay
02/2001
02/28/2001EP1079671A2 Antenna device for generating inductively coupled plasma
02/28/2001EP1079480A2 Electro-optic systems
02/28/2001EP1079444A2 Light-emitting semiconductor device using group III nitride compound
02/28/2001EP1079439A1 Process for packaging a detector chip and a semiconductor device or package
02/28/2001EP1079438A2 High frequency semiconductor device
02/28/2001EP1079434A2 Power device packaging structure
02/28/2001EP1079430A2 A method of manufacturing a semiconductor device
02/28/2001EP1079429A1 Alignment processing mechanism and semiconductor processing device using it
02/28/2001EP1079428A2 Method of monitoring a patterned transfer process using line width metrology
02/28/2001EP1079427A2 Encapsulated electronic part and method of fabricating thereof
02/28/2001EP1079426A1 Integration scheme using selfplanarized dielectric layer for shallow trench isolation (STI)
02/28/2001EP1079425A1 Process and device for vacuum plasma treatment of substrate
02/28/2001EP1079424A1 A method for forming a deep trench in a semiconductor substrate
02/28/2001EP1079423A1 Apparatus for gas processing
02/28/2001EP1079422A2 Method and apparatus for manufacturing semiconductor device
02/28/2001EP1079421A1 Overhead transport system for open cassette transport
02/28/2001EP1079420A2 Inspection apparatus
02/28/2001EP1079419A2 Method and apparatus for reducing migration of conductive material on a component
02/28/2001EP1079418A2 Vacuum processing apparatus and operating method therefor
02/28/2001EP1079417A2 Non-contact detecting apparatus for detecting flat surface area, method thereof, apparatus for measuring tilt angle of tilted flat plane, laser marker provided with the same and mark reading apparatus
02/28/2001EP1079416A1 Hot plate unit
02/28/2001EP1079415A1 Substrate (plasma) processing taking account of optical instabilities
02/28/2001EP1079394A1 Semiconductor memory
02/28/2001EP1079277A1 Hybrid illumination system for use in photolithography
02/28/2001EP1079273A2 Mask repair
02/28/2001EP1079260A2 Electro-optical device
02/28/2001EP1079203A1 Capacitive monitoring of the application of an adhesive on a substrate with complex permittivity
02/28/2001EP1079007A2 Single crystal SiC composite material for producing a semiconductor device and a method of producing the same
02/28/2001EP1079004A2 Aluminium-neodymium etch process with hydrogen iodide
02/28/2001EP1079001A1 Dual fritted bubbler
02/28/2001EP1079000A1 Method for removing residue from an exhaust line
02/28/2001EP1078998A2 Dielectric film with a perovskite structure and method of fabricating the same
02/28/2001EP1078945A2 Polymer for use in a photoresist composition
02/28/2001EP1078717A2 Fixed abrasive polishing tool
02/28/2001EP1078506A1 Laser pattern generator
02/28/2001EP1078454A1 Planar resist structure, especially an encapsulation for electric components and a thermomechanical method for the production thereof
02/28/2001EP1078404A4 Annealing of a crystalline perovskite ferroelectric cell and cells exhibiting improved barrier properties
02/28/2001EP1078404A1 Annealing of a crystalline perovskite ferroelectric cell and cells exhibiting improved barrier properties
02/28/2001EP1078402A1 Semiconductor system with trenches for separating doped areas
02/28/2001EP1078401A1 Power mos transistor with overtemperature protection circuit
02/28/2001EP1078399A1 Method of manufacturing a leadframe assembly
02/28/2001EP1078396A1 A two-step borophosphosilicate glass deposition process and related devices and apparatus
02/28/2001EP1078395A1 Method for etching silicon dioxide using fluorocarbon gas chemistry
02/28/2001EP1078394A1 Wet processing methods for the manufacture of electronic components
02/28/2001EP1078392A1 An automated substrate processing system
02/28/2001EP1078391A1 Method and device for changing a semiconductor wafer position
02/28/2001EP1078389A1 Reduction of metal oxide in dual frequency plasma etch chamber
02/28/2001EP1078388A1 Method and installation for correcting integrated circuit faults with an ion beam
02/28/2001EP1078372A1 High-efficiency miniature magnetic integrated circuit structures
02/28/2001EP1078371A1 Circuit with a sensor and non-volatile memory
02/28/2001EP1078217A1 Non-destructive analysis of a semiconductor using reflectance spectrometry
02/28/2001EP1078113A1 Energy transfer system and method for thermal processing applications
02/28/2001EP1078112A1 A sub-atmospheric chemical vapor deposition system with dopant bypass
02/28/2001EP1077790A1 A carrier head with a retaining ring for a chemical mechanical polishing system
02/28/2001EP1077789A1 Substrate retainer
02/28/2001EP1030788A4 Plasma processing methods and apparatus
02/28/2001EP0998592A4 Method of using hydrogen and oxygen gas in sputter deposition of aluminum-containing films and aluminum-containing films derived therefrom
02/28/2001EP0909311A4 Post clean treatment
02/28/2001EP0831978B1 On-site ammonia purification for semiconductor manufacture
02/28/2001CN1285955A Semiconductor substrate and method for making same
02/28/2001CN1285954A In situ wafer cleaning process
02/28/2001CN1285932A Method of molecular-scale pattern imprinting at surface
02/28/2001CN1285837A Alcohol-based processors for producing manoporous silica thin films
02/28/2001CN1285656A Conductive cap, electronic assembly and method for forming insulation film of conductive cap