Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2001
03/06/2001US6197647 Method of forming ultra-thin oxides with low temperature oxidation
03/06/2001US6197646 Manufacture of semiconductor device with salicide electrode
03/06/2001US6197645 Method of making an IGFET with elevated source/drain regions in close proximity to gate with sloped sidewalls
03/06/2001US6197644 High density mosfet fabrication method with integrated device scaling
03/06/2001US6197643 Method for making level converting circuit, internal potential generating circuit and internal potential generating unit
03/06/2001US6197642 Method for manufacturing gate terminal
03/06/2001US6197641 Process for fabricating vertical transistors
03/06/2001US6197640 Semiconductor component and method of manufacture
03/06/2001US6197639 Method for manufacturing NOR-type flash memory device
03/06/2001US6197638 Oxide formation process for manufacturing programmable logic device
03/06/2001US6197637 Method for fabricating a non-volatile memory cell
03/06/2001US6197636 Electrically erasable programmable read-only memory device and method for fabricating the same
03/06/2001US6197635 Method of manufacturing a semiconductor device with reduced masking and without ARC loss in peripheral circuitry region
03/06/2001US6197634 Rugged metal electrodes for metal-insulator-metal capacitors
03/06/2001US6197633 Method for the production of an integrated semiconductor memory configuration
03/06/2001US6197632 Method for dual sidewall oxidation in high density, high performance DRAMS
03/06/2001US6197631 Semiconductor storage device with a capacitor using a ferroelectric substance and fabricating method thereof
03/06/2001US6197630 Method of fabricating a narrow bit line structure
03/06/2001US6197629 Method of fabricating a polysilicon-based load circuit for static random-access memory
03/06/2001US6197628 Providing a substrate assembly having a surface and forming a diffusion barrier layer over at least a portion of the surface, wherein the diffusion barrier layer is formed of ruthenium silicide
03/06/2001US6197627 MOS device and method of fabricating the same
03/06/2001US6197626 Method for fabricating semiconductor device
03/06/2001US6197625 Method of fabricating a thin film transistor
03/06/2001US6197624 Method of adjusting the threshold voltage in an SOI CMOS
03/06/2001US6197623 Method for crystallizing amorphous silicon thin-film for use in thin-film transistors and thermal annealing apparatus therefor
03/06/2001US6197619 Method for reinforcing a semiconductor device to prevent cracking
03/06/2001US6197618 Semiconductor device fabrication using adhesives
03/06/2001US6197617 Semiconductor device with high reliability of connection between projective electrode of semiconductor element and conductive wire of substrate and method of manufacturing the same
03/06/2001US6197616 Method of fabricating semiconductor device
03/06/2001US6197614 Quick turn around fabrication process for packaging substrates and high density cards
03/06/2001US6197613 Wafer level packaging method and devices formed
03/06/2001US6197612 Semiconductor chip mounting apparatus capable of preventing connected portion between semiconductor chip and substrate from thermal stress and method thereof
03/06/2001US6197611 Method for producing silicon solar cell
03/06/2001US6197609 Method for manufacturing semiconductor light emitting device
03/06/2001US6197608 Mask for area forming selective grating and selective area growth and method for fabricating semiconductor device by utilizing the same
03/06/2001US6197606 Determination of the thickness of a denuded zone in a silicon wafer
03/06/2001US6197604 Method for providing cooperative run-to-run control for multi-product and multi-process semiconductor fabrication
03/06/2001US6197603 Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step
03/06/2001US6197602 Burn-in method for microwave semiconductor transistor
03/06/2001US6197601 Method of correcting temperature of semiconductor substrate
03/06/2001US6197600 Ferroelectric thin film, manufacturing method thereof and device incorporating the same
03/06/2001US6197473 Photosensitive composition and a pattern forming process using the same
03/06/2001US6197457 X-ray mask and method of fabricating the same
03/06/2001US6197452 Prevents an exposure failure in a wiring pattern element of small dimensions
03/06/2001US6197441 Cubic nitride semiconductor device and fabrication method of the same
03/06/2001US6197388 Processing a substrate having an aluminum neodymium containing layer, an etch surface of said aluminum
03/06/2001US6197372 Cassette station and substrate with carriers, coating, heating and mounting
03/06/2001US6197222 Lead free conductive composites for electrical interconnections
03/06/2001US6197218 Phosphor spherical particles of yttrium-gadolinium borate, zinc silicate, barium magnesium aluminate and barium aluminate in a liquid vehicle to be applied to a substrate; flat panel displays, e.g. plasma type; fluorescent lighting elements
03/06/2001US6197182 Providing cathode electrode not in physical contact with second region of article, second region is electrically connected to first region; providing non-plating electrically conductive liquid; separating liquid from plating solution
03/06/2001US6197181 Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
03/06/2001US6197171 Pin contact mechanism for plating pin grid arrays
03/06/2001US6197167 Step coverage and overhang improvement by pedestal bias voltage modulation
03/06/2001US6197165 Method and apparatus for ionized physical vapor deposition
03/06/2001US6197150 Apparatus for wafer treatment for the manufacture of semiconductor devices
03/06/2001US6197123 Providing chamber having nozzle and exhaust from chamber; providing production mode in chamber; providing count of particles exhaust; causing gas supply mechanism to effect cleaning of chamber by supplying gas through nozzle to chamber
03/06/2001US6197121 Chemical vapor deposition apparatus
03/06/2001US6197119 Method and apparatus for controlling polymerized teos build-up in vacuum pump lines
03/06/2001US6197118 Thin film deposition apparatus
03/06/2001US6197117 Wafer out-of-pocket detector and susceptor leveling tool
03/06/2001US6197109 Method for producing low defect silicon single crystal doped with nitrogen
03/06/2001US6197102 Small amount of separation (segregation, precipitation) of excessive metallic elements' particles, little leakage current, hydrogen heat treatment resistance as well as voltage resistance
03/06/2001US6196901 Method of double-side lapping a wafer and an apparatus therefor
03/06/2001US6196900 Ultrasonic transducer slurry dispenser
03/06/2001US6196532 3 point vacuum chuck with non-resilient support members
03/06/2001US6196445 Method for positioning the bond head in a wire bonding machine
03/06/2001US6196444 Method and apparatus for soldering ball grid array modules to substrates
03/06/2001US6196441 Solder bump measuring method and apparatus
03/06/2001US6196264 System and method for shielding an opening of a tube from a liquid
03/06/2001US6196251 Gas inlet device for a coating system
03/06/2001US6196211 Support members for wafer processing fixtures
03/06/2001US6196155 Plasma processing apparatus and method of cleaning the apparatus
03/06/2001US6196096 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
03/06/2001US6196042 Coining tool and process of manufacturing same for making connection components
03/06/2001US6196001 Environment controlled WIP cart
03/06/2001US6195893 Method of manufacture of heat exchange unit
03/06/2001US6195873 Method for decreasing contact resistance
03/01/2001WO2001015236A1 Ferroelectric transistor and method for producing the same
03/01/2001WO2001015234A1 Thin-film transistors and method for producing the same
03/01/2001WO2001015230A1 Electronic device
03/01/2001WO2001015227A1 Microbeam assembly and associated method for integrated circuit interconnection to substrates
03/01/2001WO2001015224A1 Method for protecting integrated circuit chips by depositing a thin insulation layer
03/01/2001WO2001015222A1 Trench with buried trench plate and method of production thereof
03/01/2001WO2001015221A1 Selective oxide etch for forming a protection layer with different oxide thicknesses
03/01/2001WO2001015220A1 Method for bottomless deposition of barrier layers in integrated circuit metallization schemes
03/01/2001WO2001015219A2 Method for producing an integrated circuit having at least one metalicized surface
03/01/2001WO2001015218A1 Method for treating substrates for microelectronics and substrates obtained by said method
03/01/2001WO2001015217A2 Method for producing a semiconductor chip with an electrical property that can be adjusted after the silicon process
03/01/2001WO2001015216A1 Semiconductor device and method of manufacture thereof
03/01/2001WO2001015215A1 Method for treating substrates for microelectronics and substrates obtained according to said method
03/01/2001WO2001015214A1 Nanoporous silica treated with siloxane polymers for ulsi applications
03/01/2001WO2001015213A1 Method of etching
03/01/2001WO2001015212A1 Plasma processing apparatus and method of plasma processing
03/01/2001WO2001015211A1 Improved fill material for dual damascene processes
03/01/2001WO2001015200A1 Implanting system and method
03/01/2001WO2001015199A1 Electron beam plasma formation for surface chemistry
03/01/2001WO2001015171A2 Flash memory architecture employing three layer metal interconnect
03/01/2001WO2001015076A1 Method for making a mini-smart card
03/01/2001WO2001014934A1 Photoresist remover composition
03/01/2001WO2001014933A1 Silylation method for reducing critical dimension loss and resist loss