Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2001
10/11/2001US20010028083 Super-junction semiconductor device and method of manufacturing the same
10/11/2001US20010028082 Semiconductor integrated circuit device and method of manufacturing the same
10/11/2001US20010028081 Semiconductor memory device
10/11/2001US20010028080 Semiconductor device and method of fabricating the same
10/11/2001US20010028079 Semiconductor device and method of manufacturing the same
10/11/2001US20010028078 Vertical gain cell and array for a dynamic random access memory and method for forming the same
10/11/2001US20010028077 Semiconductor device and its manufacture
10/11/2001US20010028076 Fuse configuration for a semiconductor apparatus
10/11/2001US20010028074 Having first and second tetraethyl orthosilicate-ozone films formed on protection film through chemical vapor deposition; second film has higher ozone concentration and lower water content as compared to first film
10/11/2001US20010028073 Solid state image sensor and method for fabricating the same
10/11/2001US20010028071 Array substrate for use in LCD device and method of fabricating same
10/11/2001US20010028070 Compound semiconductor device and method for controlling characteristics of the same
10/11/2001US20010028069 Semiconductor integrated circuit making use of standard cells
10/11/2001US20010028067 Semiconductor device, method for fabricating the semiconductor device and semiconductor integrated circuit
10/11/2001US20010028065 Semiconductor device and method of fabricating the same
10/11/2001US20010028060 Semiconductor display device
10/11/2001US20010028058 Thin film transistor and a method of forming the same
10/11/2001US20010028057 Thin-film transistor and method for making the smae
10/11/2001US20010028056 Evaluation method of semiconductor chargeup damage and apparatus therefor
10/11/2001US20010028052 Light sensitive chemical-mechanical polishing aggregate
10/11/2001US20010028039 Method for directing an electron beam onto a target position on a substrate surface
10/11/2001US20010028037 Hollow-beam aperture for charged-particle-beam optical systems and microlithography apparatus, andbeam-adjustment methods employing same
10/11/2001US20010028035 Infrared sensor and manufacturing method thereof
10/11/2001US20010027990 Electrically conductive elevation shaping tool
10/11/2001US20010027989 Apparatus and method of clamping semiconductor devices using sliding finger supports
10/11/2001US20010027988 Lead penetrating clamping system
10/11/2001US20010027987 Ultrasonic horn for a bonding apparatus
10/11/2001US20010027972 Heating apparatus
10/11/2001US20010027971 Heat treatment method and a heat treatment apparatus for controlling the temperature of a substrate surface
10/11/2001US20010027970 Single-substrate-heat-processing apparatus for semiconductor process
10/11/2001US20010027969 Heat treatment apparatus
10/11/2001US20010027933 Accommodation container, accommodation container for accommodating semiconductor devices and method of carrying semiconductor devices
10/11/2001US20010027917 Ion milling chromium on a quartz substrate without causing defects in the quartz by moving the ion beam initially in a pattern that produces an uneven surface, followed by milling step where beam moves in a pattern of overlapping pixels
10/11/2001US20010027876 Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same
10/11/2001US20010027842 Method for filling high aspect ratio via holes in electronic substrates and the resulting holes
10/11/2001US20010027841 Method and apparatus for application of adhesive tape to semiconductor devices
10/11/2001US20010027803 Photovoltaic device and method of fabricating the same
10/11/2001US20010027799 Contacting the wafer with an aqueous solution of ozone to oxidize the organic coating on the surface of the wafer, and removing the coating
10/11/2001US20010027798 Ozone as oxidizing agent
10/11/2001US20010027797 The object to be cleaned such as a semiconductor, glass, plastic, metal, etc.., is set between scrubbing and ultrasonic wave projection means that oppose each other
10/11/2001US20010027748 Deposition apparatus
10/11/2001US20010027744 In-situ post epitaxial treatment process
10/11/2001US20010027727 Automatic aligning pressing apparatus
10/11/2001US20010027613 Drying apparatus and method
10/11/2001US20010027606 Semiconductor integrated circuit manufacturing method and bonding machine used for it
10/11/2001US20010027605 Method for producing printed wiring board
10/11/2001US20010027595 Stage device, exposure apparatus incorporating the stage device, and method of using the same
10/11/2001DE10117350A1 Semiconductor device such as lateral MOSFET has impurity concentration which gradually increases from semiconductor layer to drain region
10/11/2001DE10115796A1 Verfahren zum Einstellen der Frequenz einer elektronischen Komponente A method for adjusting the frequency of an electronic component
10/11/2001DE10112817A1 Ion extraction apparatus for ion implantation system has electrode manipulator with actuators for adjusting slit width and moving electrode
10/11/2001DE10108388A1 Halbleiterwafer-Bearbeitungsvorrichtung A semiconductor wafer processing apparatus
10/11/2001DE10106678A1 Waferpoliervorrichtung Wafer polishing apparatus
10/11/2001DE10106676A1 Waferpoliervorrichtung Wafer polishing apparatus
10/11/2001DE10065560A1 Oberflächeninspektionseinheit Surface Inspection Unit
10/11/2001DE10063870A1 Poliermittel und Verfahren zur Herstellung planarer Schichten Polishing compositions and methods for producing planar layers
10/11/2001DE10062238A1 Semiconductor device manufacture by selectively forming insulating layer and conducting layers to form vertical connection
10/11/2001DE10021329C1 Substrate disc handling method e.g. for semiconductor wafers, with rotation of disc in handling fluid between entry and exit points for ensuring uniform treatment by handling fluid
10/11/2001DE10018043A1 Verfahren zur Kontaktierung eines Hochleistungsdiodenlaserbarrens und eine Hochleistungsdiodenlaserbarren-Kontakt-Anordnung von elektrischen Kontakten thermisch untergeordneter Funktion Method for contacting a high-performance diode laser bar and a high-power diode laser bars contacting arrangement of electrical contacts with minor thermal function
10/11/2001DE10016925A1 Irisblende Iris
10/11/2001DE10015884A1 Schottky-Diode Schottky diode
10/11/2001DE10015270A1 Vertical implementation of thick film resistances in multilayer substrates
10/11/2001DE10014707A1 Yield loss computation and failure pattern classification for semiconductor device manufacture, involves using number of wafer sheets with identical failure patterns and yield loss value of wafers
10/11/2001DE10014660A1 Semiconducting arrangement improved to enable further increase in doping of drift path whilst preventing problems due to different thermal expansion coefficients - has rigid electrodes electrically separated by insulating arrangement contg. insulating or holding coating(s) and/or pn junction and at least one hollow vol
10/11/2001DE10014659A1 Semiconducting circuit arrangement improved to enable yet more effective suppression of unwanted transverse currents
10/11/2001DE10014492A1 Method for testing semiconductor wafers identifies signs of failure in semiconductor wafers by splitting test data into sub-sets of test data belonging to one failure characteristic and not belonging to this characteristic.
10/11/2001DE10014459A1 Method for producing cooling on cooling block via a press process through a matrix and with a shaped ejector to remove the block from the press
10/11/2001DE10014379A1 Verfahren und Vorrichtung zum Verbinden mindestens eines Chips mit einer Umverdrahtungsanordnung Method and device for connecting at least one chip having a rewiring
10/11/2001CA2405051A1 Leadless semiconductor product packaging apparatus having a window lid and method for packaging
10/11/2001CA2404032A1 Housing assembly for an electronic device
10/11/2001CA2403595A1 Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent
10/10/2001EP1143609A2 High frequency power amplifier having a bipolar transistor
10/10/2001EP1143583A2 High power diode laser bar contact system and contacting method for high power diode laser bars
10/10/2001EP1143529A2 Microlens, solid state imaging device, and production process thereof
10/10/2001EP1143528A2 Interconnect-embedded metal-insulator-metal capacitor and method of fabricating same.
10/10/2001EP1143527A1 Semiconductor device of soi structure
10/10/2001EP1143526A2 Field effect transistor and method of manufacturing the same
10/10/2001EP1143525A2 Transistor-type ferroelectric nonvolatile memory element
10/10/2001EP1143524A1 Method of forming a laser circuit having low penetration ohmic contact providing impurity gettering and the resultant laser circuit
10/10/2001EP1143520A2 High density and high speed cell array architecture
10/10/2001EP1143519A2 Apparatus and method for assembling optical devices
10/10/2001EP1143518A1 Resin-molded unit including an electronic circuit component covered by a protective magnetic film
10/10/2001EP1143516A2 Electromagnetic noise suppressor, semiconductor device using the same, and method of manufacturing the same
10/10/2001EP1143514A2 Resin-sealed power semiconductor device including substrate with all electronic components for control circuit mounted thereon
10/10/2001EP1143513A1 Semiconductor device and method of fabricating the same
10/10/2001EP1143510A2 Semiconductor device having increased reliability and method of producing the same and semiconductor chip suitable for such a semiconductor device and method of producing the same
10/10/2001EP1143509A2 Method of manufacturing the circuit device and circuit device
10/10/2001EP1143508A2 Apparatus for packaging electronic components
10/10/2001EP1143507A1 Integrated circuit
10/10/2001EP1143506A2 Pattern forming method
10/10/2001EP1143505A2 Planar isolation technique for integrated circuits
10/10/2001EP1143504A1 Electronic device and method of manufacture thereof
10/10/2001EP1143503A2 Method of producing P-type nitride based III-V compound semiconductor and method of fabricating semiconductor device using the same
10/10/2001EP1143502A1 Method for producing semiconductor device
10/10/2001EP1143501A1 Method of forming thin film
10/10/2001EP1143500A2 Electrically insulating thin-film-forming resin composition and method for forming thin film therefrom
10/10/2001EP1143499A2 Film forming method for a semiconductor device
10/10/2001EP1143498A2 Post etch photoresist and residue removal process
10/10/2001EP1143497A1 Plasma etching apparatus
10/10/2001EP1143496A1 Plasma etching method
10/10/2001EP1143495A1 Semiconductor manufacturing device, and method of heating wafer in semiconductor manufacturing device