H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2001
10/18/2001	US20010029665 Method of manufacturing ceramic thick-film printed circuit board
10/18/2001	EP1145283A3 A method for measuring stress induced leakage current and gate dielectric integrity using corona discharge
10/18/2001	DE10117872A1 Multilayer monolithic ceramic substrate has thick boundary green layer in contact with thick base green layer
10/18/2001	DE10117719A1 Process for depositing a dielectric on a semiconductor substrate on a sub-structure used in the production of a capacitor comprises reactive sputtering a metal oxide layer from a target of the metal onto the substrate
10/18/2001	DE10116800A1 Semiconductor device and fabrication method has three-trough structure with imperfections having their distribution of concentration determined in downward direction according to required function
10/18/2001	DE10115937A1 Verdampfer zum Erzeugen von Speisegas für eine Lichtbogenkammer Evaporator for generating feed gas for an arc chamber
10/18/2001	DE10113675A1 Automatisch ausrichtende Pressvorrichtung Automatically aligning pressing device
10/18/2001	DE10064081A1 Production of a semiconductor wafer comprises rounding the edges of the wafer, mechanically treating the wafer, wet chemically treating the wafer to remove damaged crystal regions and polishing the wafer
10/18/2001	DE10059620A1 Halbleitervorrichtung,Verfahren zum Herstellen derselben und Verfahren zum Anordnen eines Dummybereiches A semiconductor device, method for manufacturing the same and methods for disposing a dummy area
10/18/2001	DE10054166A1 Method of machine polishing of semiconductor wafers, involves rotatably embedding the carriers for the wafers in recesses of a base plate with the carriers and base plate turning about own axes
10/18/2001	DE10054160A1 Device for testing the surface of a semiconductor wafer for protrusions, without the surface having first to be polished, by supporting the wafer side a smooth surface and measuring the reverse side topology to detect protrusions
10/18/2001	DE10052133A1 Semiconductor device based on transistors with low, high, breakdown voltages e.g. for controlling a motor-vehicle airbag, has breakdown voltage transistor formed with emitter zone of second conductivity type formed on the main surface
10/18/2001	DE10038120A1 System support used for packing semiconductor chips in electronic components has a number of component assembly regions lying over each other with component assembly region limits on the support
10/18/2001	DE10020128A1 MRAM-Speicher MRAM memory
10/18/2001	DE10018997A1 Mini inductances/multi inductances have inductive elements optimized so coils with ferromagnetic material for magnetic circuit are optimized and used as individual elements
10/18/2001	DE10018013A1 Integrierte Halbleiterschaltung, insbesondere Halbleiter-speicheranordnung und Verfahren zum Betrieb derselben A semiconductor integrated circuit, in particular semiconductor memory device and method of operating the same
10/18/2001	DE10017976A1 Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren Micro-mechanical device and manufacturing method thereof
10/18/2001	DE10017746A1 Elektronisches Bauteil mit mikroskopisch kleinen Kontaktflächen und Verfahren zu seiner Herstellung Electronic component with microscopically small contact surfaces and process for its preparation
10/18/2001	DE10017742A1 Vorrichtung zum Handling von Bauelementen Apparatus for handling of components
10/18/2001	DE10017010A1 Verfahren zum Be- und Entladen eines Behandlungsbeckens A method for loading and unloading a treatment basin
10/18/2001	DE10016726A1 Verfahren zum Betrieb einer ferroelektrischen Speicheranordnung A method for operating a ferroelectric memory arrangement
10/18/2001	DE10016135A1 Gehäusebaugruppe für ein elektronisches Bauteil A housing assembly for an electronic component
10/18/2001	DE10016132A1 Electronic component for electronic devices comprises electronic switch and conducting paths on surface of the component to electrically connect the switch with metal-coated protrusions made from rubber-elastic insulating material
10/18/2001	DE10016129A1 Verfahren zum Herstellen einer wärmeleitenden Verbindung zwischen zwei Werkstücken A method for producing a thermally conductive connection between the two workpieces
10/18/2001	DE10015964A1 Solder strip used for connecting a semiconductor element to a cooling body comprises a metal foil having a solder foil on both sides
10/18/2001	DE10015371A1 Production of an epitaxial layer on a single crystalline substrate comprises heating a purified substrate in an epitaxy device while introducing organometallic precursors and a nitrogen-containing gas at a specified flow rate
10/18/2001	DE10008243A1 Integrierter Speicher mit Plattenleitungssegmenten Built-in memory with the plate line segments
10/17/2001	EP1146640A1 Integrated resonant circuit comprising tuning capacitors
10/17/2001	EP1146637A1 Electronic component of a high frequency current suppression type and bonding wire for the same
10/17/2001	EP1146567A1 Diode and process for manufacturing it
10/17/2001	EP1146566A2 Semiconductor device having regions having a higher dielectric constant and manufacturing method thereof
10/17/2001	EP1146562A2 Cell array, operating method of the same and manufacturing method of the same
10/17/2001	EP1146561A1 Method of manufacturing a bipolar transistor
10/17/2001	EP1146558A2 Damascene wiring structure and semiconductor device with damascene wirings
10/17/2001	EP1146557A2 Trench capacitor and method of making the same
10/17/2001	EP1146556A1 A process for fabricating an integrated ciruit that has embedded dram and logic devices
10/17/2001	EP1146555A1 Semiconductor device and production method therefor
10/17/2001	EP1146554A1 Method for forming buried layers
10/17/2001	EP1146553A1 Device for testing wafer-transporting robot
10/17/2001	EP1146552A2 Interconnections to copper ICs
10/17/2001	EP1146551A1 Process for reclaiming a semiconductor wafer
10/17/2001	EP1146550A2 Method for making interconnections in an integrated circuit
10/17/2001	EP1146549A1 Method and device for ion implanting
10/17/2001	EP1146548A1 Vacuum processing system
10/17/2001	EP1146547A2 Substrate transportation container
10/17/2001	EP1146546A2 Electrostatic chuck for ion injector
10/17/2001	EP1146545A1 Wafer supporting device
10/17/2001	EP1146451A2 Fabrication system with extensible equipment sets
10/17/2001	EP1146445A2 Delay time calculating method for use in hierarchical design
10/17/2001	EP1146394A1 Photosensitive resin composition and method for improving dry etching resistance of photosensitive resin composition
10/17/2001	EP1146150A2 Low defect density, ideal oxygen precipitating silicon
10/17/2001	EP1146142A2 Process for forming fluorosilicate glass layers using high density plasma, for copper damascene integrated circuits
10/17/2001	EP1146141A2 Liquid precursor mixtures for deposition of multicomponent metal containing materials
10/17/2001	EP1146140A1 Process for deposition of oxides and nitrides with compositional gradients
10/17/2001	EP1146139A1 Sputtering apparatus
10/17/2001	EP1146092A2 Composition for film formation, method of film formation, and silica-based film
10/17/2001	EP1146065A1 Die attach adhesives for use in microelectronic devices
10/17/2001	EP1146014A2 Mesoporous silica films with mobile ion gettering and accelerated processing
10/17/2001	EP1145759A1 Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions
10/17/2001	EP1145436A2 A method of manufacturing a trench gated vdmos
10/17/2001	EP1145412A1 A coupling for active semi-conductor components
10/17/2001	EP1145339A1 Method of producing vertical interconnects between thin film microelectronic devices and products comprising such vertical interconnects
10/17/2001	EP1145329A2 Semiconductor pn-junction diode, method of making the same and electronic circuit comprising the same
10/17/2001	EP1145327A2 Power semiconductor devices having improved high frequency switching and breakdown characteristics
10/17/2001	EP1145326A2 Cellular trench-gate field-effect transistors
10/17/2001	EP1145325A2 Trench-gate field-effect transistors and their manufacture
10/17/2001	EP1145324A2 Mos-transistor structure with a trench-gate electrode and a reduced specific closing resistor and methods for producing an mos transistor structure
10/17/2001	EP1145321A1 Integrated circuit impedance device and method of manufacture therefor
10/17/2001	EP1145320A1 Dram cell arrangement and method for the production thereof
10/17/2001	EP1145319A1 Integrated circuit and method for the production thereof
10/17/2001	EP1145317A1 Coaxial type signal line and manufacturing method thereof
10/17/2001	EP1145313A1 Methods for forming co-axial interconnect lines in a cmos process
10/17/2001	EP1145312A1 Methods for forming co-axial interconnect lines in a cmos process
10/17/2001	EP1145311A1 Microelectronic structure
10/17/2001	EP1145310A1 Semiconductor device and method of manufacturing the same
10/17/2001	EP1145309A2 Use of additional bonding finger rows to improve wire bond density
10/17/2001	EP1145308A1 Semiconductor process flow for nand flash memory products
10/17/2001	EP1145307A1 A method of forming dual gate oxide layers of varying thickness on a single substrate
10/17/2001	EP1145306A1 Method for semiconductor manufacturing
10/17/2001	EP1145305A1 Method for suppressing narrow width effects in cmos technology
10/17/2001	EP1145304A1 Use of an insulating spacer to prevent threshold voltage roll-off in narrow devices
10/17/2001	EP1145303A1 Method and device for optically monitoring processes for manufacturing microstructured surfaces in the production of semiconductors
10/17/2001	EP1145302A1 Semiconductor device with bond pad and test pad
10/17/2001	EP1145300A1 Mos transistor and method for making same on a semiconductor substrate
10/17/2001	EP1145299A2 Manufacture of trench-gate semiconductor devices
10/17/2001	EP1145298A2 Method for producing schottky diodes
10/17/2001	EP1145297A1 Plasma treatment for polymer removal after via etch
10/17/2001	EP1145296A1 Semiconductor wafer manufacturing method
10/17/2001	EP1145295A1 Method for joining dissimilar semiconductor wafers
10/17/2001	EP1145294A1 Method for producing high quality heteroepitaxial growth using stress engineering and innovative substrates
10/17/2001	EP1145293A1 Method of fabrication of a ferro-electric capacitor and method of growing a pzt layer on a substrate
10/17/2001	EP1145292A1 Substrate carrier
10/17/2001	EP1145291A1 Device for processing substrates
10/17/2001	EP1145290A1 Device and method for processing substrates
10/17/2001	EP1145289A1 Device and method for processing substrates
10/17/2001	EP1145288A1 Wafer processing system
10/17/2001	EP1145287A1 Method and apparatus for cleaning a semiconductor wafer
10/17/2001	EP1145286A2 Method for structuring a metalliferous layer
10/17/2001	EP1145285A2 Hand tool for the assembly of small, notably electronic, components
10/17/2001	EP1145284A2 Method and device for drying photoresist coatings

1 ... 5240 5241 5242 5243 5244 5245 5246 5247 5248 5249 5250 5251 5252 5253 5254 5255 5256 5257 5258 5259 5260 ... 6590