H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2001
10/23/2001	US6306709 Semiconductor device and manufacturing method thereof
10/23/2001	US6306708 Fabrication method for an electrically erasable programmable read only memory
10/23/2001	US6306707 Double layer hard mask process to improve oxide quality for non-volatile flash memory products
10/23/2001	US6306706 Method and system for fabricating a flash memory array
10/23/2001	US6306705 Methods of forming capacitors, DRAM arrays, and monolithic integrated circuits
10/23/2001	US6306704 Nonvolatile ferroelectric memory
10/23/2001	US6306703 Memory array having a digit line buried in an isolation region and method for forming same
10/23/2001	US6306702 Dual spacer method of forming CMOS transistors with substantially the same sub 0.25 micron gate length
10/23/2001	US6306701 Self-aligned contact process
10/23/2001	US6306700 Method for forming high voltage devices compatible with low voltages devices on semiconductor substrate
10/23/2001	US6306699 Semiconductor device having conducting material film formed in trench, manufacturing method thereof and method of forming resist pattern used therein
10/23/2001	US6306698 Semiconductor device having metal silicide regions of differing thicknesses above the gate electrode and the source/drain regions, and method of making same
10/23/2001	US6306697 Low temperature polysilicon manufacturing process
10/23/2001	US6306696 Methods of forming integrated circuitry methods of forming thin film transistors, integrated circuitry and thin film transistors
10/23/2001	US6306694 Process of fabricating a semiconductor device
10/23/2001	US6306693 Method of manufacturing semiconductor device, method of manufacturing active matrix substrate, and electrooptic device
10/23/2001	US6306692 Coplanar type polysilicon thin film transistor and method of manufacturing the same
10/23/2001	US6306691 Body driven SOI-MOS field effect transistor and method of forming the same
10/23/2001	US6306690 Process flow to integrate high and low voltage peripheral transistors with a floating gate array
10/23/2001	US6306689 Anti-fuse for programming redundancy cell, repair circuit having programming apparatus, and fabrication method of anti-fuse
10/23/2001	US6306688 Method of reworkably removing a fluorinated polymer encapsulant
10/23/2001	US6306685 Method of molding a bump chip carrier and structure made thereby
10/23/2001	US6306684 Stress reducing lead-frame for plastic encapsulation
10/23/2001	US6306683 Method of forming a flip chip assembly, and a flip chip assembly formed by the method
10/23/2001	US6306682 Method of fabricating a ball grid array integrated circuit package having an encapsulating body
10/23/2001	US6306680 Power overlay chip scale packages for discrete power devices
10/23/2001	US6306675 Method for forming a low-defect epitaxial layer in the fabrication of semiconductor devices
10/23/2001	US6306674 Method for etching multilayer compound semiconductor material
10/23/2001	US6306670 Tool for handling a workpiece
10/23/2001	US6306669 Method of manufacturing semiconductor device
10/23/2001	US6306668 Control method and system for use when growing thin-films on semiconductor-based materials
10/23/2001	US6306667 Method for forming a capacitor in a semiconductor device
10/23/2001	US6306666 Method for fabricating ferroelectric memory device
10/23/2001	US6306564 Removal of resist or residue from semiconductors using supercritical carbon dioxide
10/23/2001	US6306560 Ultra-thin resist and SiON/oxide hard mask for metal etch
10/23/2001	US6306554 Photoresist composition comprising photoactive component and polymer that comprises a photoacid-labile moiety and structure containing oxygen and/or sulfur alicyclic units and carbon alicyclic units
10/23/2001	US6306547 Photomask and manufacturing method thereof, and exposure method using the photomask
10/23/2001	US6306511 Substrate comprising compact of first powder comprising partially sintered glass, functional layer comprising compact of second powder comprising ceramic material having specified electrical property, diffusion bonded by substrate material
10/23/2001	US6306456 Filling conductive paste in slit of slit plate; making an external surface of electronic part come in contact with and press against surface of slit plate, wherein elastomer is on second surface; elastically deforming elastomer to protrude
10/23/2001	US6306455 Substrate processing method
10/23/2001	US6306348 Self-addressable, self-assembling microelectronic system for biological reactions e.g. nucleic acid hybridizations, antibody/antigen reactions clinical diagnostics, and biopolymer synthesis
10/23/2001	US6306331 Ultra mold for encapsulating very thin packages
10/23/2001	US6306312 Method for etching a gold metal layer using a titanium hardmask
10/23/2001	US6306274 Method for making electrodeposition blades
10/23/2001	US6306245 Plasma etching apparatus
10/23/2001	US6306244 Apparatus for reducing polymer deposition on substrate support
10/23/2001	US6306216 Apparatus for deposition of thin films on wafers through atomic layer epitaxial process
10/23/2001	US6306213 Electro-optical device and method for manufacturing the same
10/23/2001	US6306212 Gallium arsenide semiconductor devices fabricated with insulator layer
10/23/2001	US6306211 Method for growing semiconductor film and method for fabricating semiconductor device
10/23/2001	US6306189 Clean room
10/23/2001	US6306183 Method of forming manufacturing semiconductor device
10/23/2001	US6306021 Polishing pad, polishing method, and polishing machine for mirror-polishing semiconductor wafers
10/23/2001	US6306016 Wafer notch polishing machine and method of polishing an orientation notch in a wafer
10/23/2001	US6306012 Methods and apparatuses for planarizing microelectronic substrate assemblies
10/23/2001	US6306008 Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
10/23/2001	US6305921 Saw tooth mold
10/23/2001	US6305898 Wafer transfer mechanism
10/23/2001	US6305895 Transfer system for vacuum process equipment
10/23/2001	US6305677 Perimeter wafer lifting
10/23/2001	US6305657 Mechanism for tilting a microscope
10/23/2001	US6305594 Wire bonding method and apparatus
10/23/2001	US6305593 Lead penetrating clamping system
10/23/2001	US6305565 Transport chamber and method for making same
10/23/2001	US6305500 Material delivery system for clean room-like environments
10/23/2001	US6305464 Method for producing a cooling element, and a cooling element
10/23/2001	US6305392 Method and apparatus for removing processing liquid from a processing liquid delivery line
10/23/2001	US6305390 Stabilization; inert gas flow; varying pressure
10/23/2001	US6305316 Integrated power oscillator RF source of plasma immersion ion implantation system
10/23/2001	US6305314 Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition
10/23/2001	US6305235 Variable height sensor tree
10/23/2001	US6305230 Connector and probing system
10/23/2001	US6305097 Apparatus for in-situ reticle cleaning at photolithography tool
10/23/2001	US6305079 Methods of making plate-fin heat exchangers
10/23/2001	US6305074 Support for integrated circuit and process for mounting an integrated circuit on a support
10/23/2001	US6305062 Preventive maintenance apparatus for CMP top-ring's backing-film and the method thereof
10/23/2001	CA2219598C Field effect transistor and fabrication process thereof
10/23/2001	CA2113336C Compound semi-conductors and controlled doping thereof
10/23/2001	CA2067784C Method and device for hermetic encapsulation of electronic components
10/23/2001	CA2051686C Single transistor non-volatile electrically alterable semiconductor memory device with a re-crystallized floating gate
10/20/2001	CA2338479A1 Self referencing mark independent alignment sensor
10/18/2001	WO2001078456A1 Ceramic heater
10/18/2001	WO2001078455A1 Ceramic board
10/18/2001	WO2001078454A1 Ceramic heater
10/18/2001	WO2001078231A1 Structural element with an integrated high-frequency circuit
10/18/2001	WO2001078154A2 Preparation of cigs-based solar cells using a buffered electrodeposition bath
10/18/2001	WO2001078149A2 Interdigitated multilayer capacitor structure for deep sub-micron cmos
10/18/2001	WO2001078148A1 Electrostatic discharge (esd) protection circuit
10/18/2001	WO2001078146A2 Bonding pad in semiconductor device
10/18/2001	WO2001078145A2 Boding pad in semiconductor device
10/18/2001	WO2001078144A1 Vertical structure and process for semiconductor wafer-level chip scale packages
10/18/2001	WO2001078141A2 USE OF AlN AS COPPER PASSIVATION LAYER AND THERMAL CONDUCTOR
10/18/2001	WO2001078140A2 Chip carrier, relative manufacturing process, and electronic component incorporating such a carrier
10/18/2001	WO2001078139A1 Common electrode wire for plating
10/18/2001	WO2001078136A1 Fabricating a high coupling flash cell
10/18/2001	WO2001078135A2 Methods for repairing defects on a semiconductor substrate
10/18/2001	WO2001078134A1 Method of fabricating power rectifier device to vary operating parameters and resulting device
10/18/2001	WO2001078133A1 Method for evaluating impurity concentrations in semiconductor substrates
10/18/2001	WO2001078132A2 Method for transferring semiconductor device layers to different substrates
10/18/2001	WO2001078131A1 Process and assembly for applying an adhesive to a substrate

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