Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2001
10/04/2001US20010025601 Apparatus and method for forming a deposited film by means of plasma CVD
10/04/2001US20010025600 Substrate processing apparatus and substrate processing method
10/04/2001US20010025597 Low defect density, self-interstitial dominated silicon
10/04/2001US20010025574 Method and apparatus for screen printing
10/04/2001US20010025533 Buffer system for a wafer handling system
10/04/2001US20010025528 Method and apparatus for testing of sheet material
10/04/2001US20010025431 Substrate processing apparatus and substrate processing method
10/04/2001US20010025428 Wafer dryer comprising revolving spray nozzle and method for drying wafers using the same
10/04/2001US20010025411 Linear guide with an air bearing
10/04/2001EP1145309A3 Use of additional bonding finger rows to improve wire bond density
10/04/2001EP1139705A1 Printed wiring board and method of producing the same
10/04/2001EP1139694A2 Fluid heating apparatus
10/04/2001EP1139566A1 Semiconductor circuit with insulated gate device and associated control circuitry
10/04/2001EP1139437A2 Diamond semiconductor and diamond semiconductor light-emitting device
10/04/2001EP1139433A1 Semiconductor device having a Schottky barrier diode structure
10/04/2001EP1139432A2 Schottky diode
10/04/2001EP1139431A2 Reduction of reverse short channel effects
10/04/2001EP1139430A1 MOS transistor in integrated circuit and method of manufacturing the active zone
10/04/2001EP1139428A2 Solid state imaging device having a photodiode and a MOSFET and method of manufacturing the same
10/04/2001EP1139427A2 Semiconductor integrated circuit making use of standard cells
10/04/2001EP1139426A2 Nonvolatile semiconductor memory and method of manufacturing the same
10/04/2001EP1139425A2 DRAM memory array with n-channel and p-channel transistors
10/04/2001EP1139424A2 Semiconductor device and method of manufacturing the same
10/04/2001EP1139422A2 Fuse structure for semiconductor device
10/04/2001EP1139421A2 Insulated power multichip package
10/04/2001EP1139420A2 Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition
10/04/2001EP1139419A1 Method of manufacturing an electrically programmable, non-volatile memory with logic circuitry
10/04/2001EP1139418A2 Reduced fluorine contamination for tungsten cvd
10/04/2001EP1139417A2 Apparatus and method for protecting integrated circuit charge storage elements from photo-induced currents
10/04/2001EP1139416A1 Wafer support device in semiconductor manufacturing device
10/04/2001EP1139415A1 Water-permeable adhesive tape for semiconductor processing
10/04/2001EP1139414A2 Method for failure analysis during the manufacturing semiconductor devices
10/04/2001EP1139413A2 Wire bonding process
10/04/2001EP1139412A1 Flip-chip semiconductor device with backside contact
10/04/2001EP1139411A1 Flip-chip semiconductor assembly with backside contacts
10/04/2001EP1139410A2 Method of manufacturing bump-component mounted body and device for manufacturing the same
10/04/2001EP1139409A2 Selective laser anneal on semiconductor material
10/04/2001EP1139408A2 Method of producing a SiGe base heterojunction bipolar device
10/04/2001EP1139407A1 Process for fabricating a self aligned double polysilicon bipolar transistor with heterojunction base and transistor fabricated by this processs
10/04/2001EP1139406A2 Chemical mechanical polishing process for low dishing of metal lines in semiconductor wafer fabrication
10/04/2001EP1139405A2 Method for improving electrical properties of high dielectric constant films
10/04/2001EP1139404A1 Low thermal budget solution for PMD application using SACVD layer
10/04/2001EP1139403A1 Method for depositing a doped silicon oxide
10/04/2001EP1139402A1 Method and arrangement for depositing a dielectric layer
10/04/2001EP1139401A1 Composition for removing sidewall and method of removing sidewall
10/04/2001EP1139400A1 Method for machining/cleaning by hydroxide ion in ultrapure water
10/04/2001EP1139399A2 Film-forming surface reforming method and semiconductor device manufacturing method
10/04/2001EP1139398A1 Method and apparatus for surface treatment
10/04/2001EP1139397A1 Method of manufacturing semiconductor wafer
10/04/2001EP1139396A2 Fixture and method for uniform electroless metal deposition on integrated circuit bond pads
10/04/2001EP1139395A2 Apparatus and method for maintaining a dry atmosphere to prevent moisture absorption and allow demoisturization of electronic components
10/04/2001EP1139394A2 Method and device for electric field assisted anneal
10/04/2001EP1139393A2 Method and apparatus for substrate handling
10/04/2001EP1139392A2 Improved wafer boat support and method for twin tower wafer boat loader
10/04/2001EP1139391A1 Method and apparatus for annealing copper films
10/04/2001EP1139390A1 Semiconductor wafer pod
10/04/2001EP1139389A1 Arrangement for etching a semiconductor substrate and method for cleaning a filter in the arrangement
10/04/2001EP1139386A2 Monitoring an effluent from a chamber
10/04/2001EP1139384A2 Electron optical system array, method of fabricating the same, charged-particle beam exposure apparatus, and device manufacturing method
10/04/2001EP1139355A1 Electronic device of ceramic
10/04/2001EP1139280A2 Semiconductor integrated circuit device and contactless electronic device
10/04/2001EP1139175A2 Optical element holding device for exposure apparatus
10/04/2001EP1139174A2 Illuminance measurement apparatus and exposure apparatus
10/04/2001EP1139173A2 Microlithographic illumination system and microlithographic projection system with the same
10/04/2001EP1139090A2 Leaded integrated circuit inspection system
10/04/2001EP1138809A1 Silicon wafer and method for manufacturing the same
10/04/2001EP1138807A2 Perforated anode for uniform deposition of a metal layer
10/04/2001EP1138804A2 Component with at least two contiguous insulating layers and manufacturing method therefor
10/04/2001EP1138802A2 Fluorine process for cleaning semiconductor process chamber
10/04/2001EP1138801A1 Method of forming thin film onto semiconductor substrate
10/04/2001EP1138737A1 Anisotropically electroconductive adhesive material and connecting method
10/04/2001EP1138734A2 Aqueous dispersion for chemical mechanical polishing of metal films
10/04/2001EP1138733A2 Aqueous dispersion for chemical mechanical polishing of insulating films
10/04/2001EP1138726A1 Polymer remover
10/04/2001EP1138640A2 Method and apparatus for heat treatment of synthetic quartz glass
10/04/2001EP1138111A1 Electrostatic maintaining device
10/04/2001EP1138091A1 Conductive structure based on poly-3,4-alkenedioxythiophene (pedot) and polystyrenesulfonic acid (pss)
10/04/2001EP1138089A1 Organic electroluminescent device
10/04/2001EP1138088A1 Melt through contact formation method
10/04/2001EP1138085A2 Field effect-controlled transistor and method for producing the same
10/04/2001EP1138084A1 Ferroelectric transistor and method for the production thereof
10/04/2001EP1138082A1 Semiconductor device
10/04/2001EP1138078A1 Method for reducing die cracking in integrated circuits
10/04/2001EP1138077A1 Die pad crack absorption integrated circuit chip and fabrication process
10/04/2001EP1138076A1 Methods and compositions for improving interconnect metallization performance in integrated circuits
10/04/2001EP1138075A1 A method and device for improved salicide resistance on polysilicon gates
10/04/2001EP1138074A1 Integrated-circuit manufacturing using high interstitial-recombination-rate blocking layer for source/drain extension implant
10/04/2001EP1138073A1 Integrated circuit
10/04/2001EP1138072A1 System and method for repairing interconnect links
10/04/2001EP1138071A1 A method and system for polishing semiconductor wafers
10/04/2001EP1138070A1 Low alpha emissive solder bumps
10/04/2001EP1138069A2 Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
10/04/2001EP1138068A1 Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
10/04/2001EP1138067A1 Post deposition treatment of dielectric films for interface control
10/04/2001EP1138066A1 Plasma preclean with argon, helium, and hydrogen gases
10/04/2001EP1138065A1 Method for producing a structured layer containing metal oxide
10/04/2001EP1138064A1 Method for producing nanostructures in thin films
10/04/2001EP1138063A1 Fabrication of gallium nitride layers by lateral growth
10/04/2001EP1138062A1 Epitaxial aluminum-gallium-nitride semiconductor substrate
10/04/2001EP1138061A2 Carrier for cleaning silicon wafers
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