| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 10/30/2001 | US6309798 Forming films; exposure to electron beams; washing; annealing |
| 10/30/2001 | US6309790 Organic anti-reflective coating material and its preparation |
| 10/30/2001 | US6309789 Mixture of perfluoroalkylsulfonic acid, amine, water soluble polymer, perfluorosulfonamide and water |
| 10/30/2001 | US6309781 Photomask provided with an ESD-precluding envelope |
| 10/30/2001 | US6309766 Integrated circuits |
| 10/30/2001 | US6309713 Deposition of tungsten nitride by plasma enhanced chemical vapor deposition |
| 10/30/2001 | US6309698 Manufacturing process for a lead-frame forming material |
| 10/30/2001 | US6309602 Stacked, reconfigurable system for electrophoretic transport of charged materials |
| 10/30/2001 | US6309601 Scanning optical detection system |
| 10/30/2001 | US6309575 Transfer molding method for forming integrated circuit package |
| 10/30/2001 | US6309560 Chemical mechanical polishing slurry useful for copper substrates |
| 10/30/2001 | US6309555 Method for determining thickness of material layer and chemical mechanical polishing endpoint |
| 10/30/2001 | US6309524 Methods and apparatus for processing the surface of a microelectronic workpiece |
| 10/30/2001 | US6309515 Sputtering apparatus for sputtering high melting point metal and method for manufacturing semiconductor device having high melting point metal |
| 10/30/2001 | US6309505 Substrate processing apparatus and method |
| 10/30/2001 | US6309467 Method for producing a semiconductor material |
| 10/30/2001 | US6309459 Compound semiconductor element and its manufacturing method |
| 10/30/2001 | US6309458 Method for fabricating silicon thin film |
| 10/30/2001 | US6309433 Polishing pad conditioner for semiconductor substrate |
| 10/30/2001 | US6309280 Method of grinding semiconductor articles |
| 10/30/2001 | US6309279 Arrangements for wafer polishing |
| 10/30/2001 | US6309276 Endpoint monitoring with polishing rate change |
| 10/30/2001 | US6309212 Substrate conveying system and device manufacturing method using the same |
| 10/30/2001 | US6309166 Wafer transfer device |
| 10/30/2001 | US6309163 Wafer positioning device with storage capability |
| 10/30/2001 | US6309161 Load lock with vertically movable support |
| 10/30/2001 | US6309116 Substrate processing system |
| 10/30/2001 | US6308881 Quality control method |
| 10/30/2001 | US6308818 Transport system with integrated transport carrier and directors |
| 10/30/2001 | US6308776 Temperature control apparatus with recirculated coolant |
| 10/30/2001 | US6308654 Inductively coupled parallel-plate plasma reactor with a conical dome |
| 10/30/2001 | US6308369 Wafer cleaning system |
| 10/30/2001 | US6308361 Cleaning apparatus |
| 10/30/2001 | CA2227233C Plasma treatment apparatus for large area substrates |
| 10/30/2001 | CA2098919C Semiconductor device |
| 10/27/2001 | CA2342560A1 Method of fabricating compound semiconductor device and apparatus for fabricating compound semiconductor device |
| 10/26/2001 | CA2345175A1 High-frequency circuit and its module for communication devices |
| 10/25/2001 | WO2001080609A1 Double-sided wiring board and its manufacture method |
| 10/25/2001 | WO2001080601A1 Ceramic heater |
| 10/25/2001 | WO2001080370A1 Semiconductor process carrier and bridge clip assembly |
| 10/25/2001 | WO2001080320A1 Diode and method for producing the same |
| 10/25/2001 | WO2001080318A1 Semiconductor device and method of manufacturing thereof |
| 10/25/2001 | WO2001080315A2 Shaped springs and methods of fabricating and using shaped springs |
| 10/25/2001 | WO2001080313A1 Material of heat-dissipating plate on which semiconductor is mounted, method for fabricating the same, and ceramic package produced by using the same |
| 10/25/2001 | WO2001080312A1 Pre-application of die attach material to wafer back |
| 10/25/2001 | WO2001080311A1 Defect reduction in gan and related materials |
| 10/25/2001 | WO2001080310A1 Method of manufacturing a semiconductor device |
| 10/25/2001 | WO2001080309A2 A method to enhance the adhesion of silicon nitride to low-k fluorinated amorphous carbon using a silicon carbide adhesion promoter layer |
| 10/25/2001 | WO2001080308A2 Method for cutting out at least a thin layer in a substrate or ingot, in particular made of semiconductor material(s) |
| 10/25/2001 | WO2001080307A1 Ceramic substrate |
| 10/25/2001 | WO2001080306A2 Automated process monitoring and analysis system for semiconductor processing |
| 10/25/2001 | WO2001080304A2 Improved test structures and methods for inspecting and utilizing the same |
| 10/25/2001 | WO2001080303A2 Method and apparatus for manufacturing an interconnect structure |
| 10/25/2001 | WO2001080302A1 Flip chip mounting method |
| 10/25/2001 | WO2001080301A1 A module card and a method for manufacturing the same |
| 10/25/2001 | WO2001080300A1 High-speed semiconductor transistor and selective absorption process for forming same |
| 10/25/2001 | WO2001080299A1 Semiconductor device and fabrication method therefor |
| 10/25/2001 | WO2001080298A1 Uv pretreatment process for ultra-thin oxynitride for formation of silicon nitride films |
| 10/25/2001 | WO2001080297A1 Plasma processing apparatus |
| 10/25/2001 | WO2001080296A1 Polishing compound for polishing semiconductor device and method for manufacturing semiconductor device using the same |
| 10/25/2001 | WO2001080295A1 Methods for forming ultrashallow junctions in semiconductor wafers using nitrogen implantation |
| 10/25/2001 | WO2001080294A2 Mocvd-grown buffer for enhancement mode higfet |
| 10/25/2001 | WO2001080293A1 Method of crystallising a semiconductor film |
| 10/25/2001 | WO2001080292A1 Pattern drawing apparatus and pattern drawing method |
| 10/25/2001 | WO2001080291A1 Methods and apparatus for thermally processing wafers |
| 10/25/2001 | WO2001080290A2 A method of operating a dual chamber reactor with neutral density decoupled from ion density |
| 10/25/2001 | WO2001080289A1 Modular substrate measurement system |
| 10/25/2001 | WO2001080287A2 Process for fabricating thin film transistors |
| 10/25/2001 | WO2001080286A2 Deposited thin films and their use in separation and sarcrificial layer applications |
| 10/25/2001 | WO2001080281A2 Stand alone plasma vacuum pump |
| 10/25/2001 | WO2001080247A1 Semiconductor device |
| 10/25/2001 | WO2001080182A1 Two-dimensional scatter plot technique for defect inspection |
| 10/25/2001 | WO2001079936A1 Mitigation of photoresist outgassing in vacuum lithography |
| 10/25/2001 | WO2001079934A1 Chemically amplified resist and a resist composition |
| 10/25/2001 | WO2001079933A1 A substrate for and a process in connection with the product of structures |
| 10/25/2001 | WO2001079932A1 Method for measuring diffusion of photogenerated catalyst in chemically amplified resists |
| 10/25/2001 | WO2001079865A1 Probe card device and probe for use therein |
| 10/25/2001 | WO2001079863A2 Method and apparatus for testing signal paths between an integrated circuit wafer and a wafer tester |
| 10/25/2001 | WO2001079593A1 Silicon wafer, silicon epitaxial wafer, anneal wafer and method for producing them |
| 10/25/2001 | WO2001079584A1 Methods for chemical vapor deposition of titanium-silicon-nitrogen films |
| 10/25/2001 | WO2001079578A1 Silicon reagents and low temperature cvd method of forming silicon-containing gate dielectric materials using same |
| 10/25/2001 | WO2001079091A1 System for parallel processing of workpieces |
| 10/25/2001 | WO2001079090A1 Modular sorter |
| 10/25/2001 | WO2001078911A1 Supercritical fluid delivery and recovery system for semiconductor wafer processing |
| 10/25/2001 | WO2001041189A3 Cobalt silicide etch process and apparatus |
| 10/25/2001 | WO2001038597A3 Method for regulating sputtering processes |
| 10/25/2001 | WO2001031683A8 Plasma doping system comprising a hollow cathode |
| 10/25/2001 | WO2001026141A3 Surface structure and method of making, and electrostatic wafer clamp incorporating surface structure |
| 10/25/2001 | WO2001024231A3 Apparatus and method for providing mechanically pre-formed conductive leads |
| 10/25/2001 | WO2001024230A3 Techniques for improving etching in a plasma processing chamber |
| 10/25/2001 | WO2001017013A3 A method and an apparatus for forming an under bump metallization structure |
| 10/25/2001 | WO2001006765A8 E-film cartridge with sensor avoidance feature |
| 10/25/2001 | WO2000052420A9 Method and system of measuring waviness in silicon wafers |
| 10/25/2001 | WO2000042231A9 Polycrystalline silicon germanium films for forming micro-electromechanical systems |
| 10/25/2001 | US20010034595 Timing verifying method |
| 10/25/2001 | US20010034427 Organic anti-reflective coating polymer and preparation thereof |
| 10/25/2001 | US20010034382 Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith |
| 10/25/2001 | US20010034313 Solvent, alkanolamine, carboxylic acid, water; for photoresist |
| 10/25/2001 | US20010034199 Polishing head of a chemical and mechanical polishing apparatus for polishing a wafer |
| 10/25/2001 | US20010034198 Polishing apparatus |