Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2001
11/01/2001US20010035519 Stripping using tetramethylammonium hydroxide
11/01/2001US20010035452 Wire bonding process for copper-metallized integrated circuits
11/01/2001US20010035451 Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies
11/01/2001US20010035450 Apparatus for mounting semiconductor chips on a substrate
11/01/2001US20010035403 Method and structure for producing flat wafer chucks
11/01/2001US20010035401 Dual laser cutting of wafers
11/01/2001US20010035400 Method for sundering semiconductor materials
11/01/2001US20010035355 Patterning photoresist
11/01/2001US20010035354 Applying potentials
11/01/2001US20010035346 Apparatus and method for electroplating
11/01/2001US20010035343 Fine pattern forming method, developing/washing device used for the same, plating method using the same, and manufacturing method of thin film magnetic head using the same
11/01/2001US20010035294 Chip size package and method of fabricating the same
11/01/2001US20010035241 Method for forming metal nitride film
11/01/2001US20010035238 Physical vapor deposition target
11/01/2001US20010035237 Copper, silver alloy
11/01/2001US20010035200 Scrub washing apparatus and scrub washing method
11/01/2001US20010035197 Scrubber operation
11/01/2001US20010035196 Removal deposits with air vibration
11/01/2001US20010035131 Single-substrate-heat-processing apparatus for semiconductor process
11/01/2001US20010035125 Coater having controllable pressurized process chamber for semiconductor processing
11/01/2001US20010035124 Substrate processing apparatus and semiconductor manufacturing method
11/01/2001US20010035065 Robot
11/01/2001CA2406958A1 Slurries of abrasive inorganic oxide particles and method for polishing copper containing surfaces
11/01/2001CA2402082A1 Method of forming an integrated circuit package at a wafer level
11/01/2001CA2375073A1 Voltage limiting bias circuit for reduction of hot electron degradation effects in mos cascode circuits
10/2001
10/31/2001EP1150552A2 Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof
10/31/2001EP1150401A2 Laser device management system
10/31/2001EP1150360A2 Method of fabricating compound semiconductor device and apparatus for fabricating compound semiconductor device
10/31/2001EP1150354A1 Capacitor and method of its manufacture
10/31/2001EP1150353A2 Using lightly doped resistor for output stage electrostatic discharge protection
10/31/2001EP1150351A2 Semiconductor package and semiconductor package fabrication method
10/31/2001EP1150350A2 Manufacturing a trench capacitor
10/31/2001EP1150349A2 Process for reduction of orientation-dependent oxidation in trench structures and semiconductor memory device produced thereby
10/31/2001EP1150348A1 A process for fabricating an integrated circuit that has embedded dram and logic devices
10/31/2001EP1150347A2 Semiconductor device and manufacturing method of the same
10/31/2001EP1150346A2 A process for preparing insulating material having low dielectric constant
10/31/2001EP1150345A2 Fluorine-containing materials and processes
10/31/2001EP1150344A2 Semiconductor device having ferroelectric thin film and fabricating method therefor
10/31/2001EP1150343A2 Aperture fill
10/31/2001EP1150342A1 Etching solution, etched article and method for etched article
10/31/2001EP1150341A1 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
10/31/2001EP1150340A1 Semiconductor device producing method and semiconducor device
10/31/2001EP1150339A1 Compound semiconductor wafer
10/31/2001EP1150332A2 Integration of remote plasma generator with semiconductor processing chamber
10/31/2001EP1150331A2 Gas distribution plate assembly for providing laminar gas flow across the surface of a substrate
10/31/2001EP1150330A2 Actively-cooled distribution plate for reducing reactive gas temperature in a plasma processing system
10/31/2001EP1150302A1 Semiconductor integrated circuit and nonvolatile memory element
10/31/2001EP1150255A2 Method of generating mesh and storage medium storing mesh generating program
10/31/2001EP1150222A2 Integrated circuit design
10/31/2001EP1150221A2 Semiconductor device simulation apparatus as well as method and storage medium storing simulation program thereof
10/31/2001EP1150187A2 Wafer fabrication data acquisition and management systems
10/31/2001EP1150172A2 Method of removing antireflective compositions
10/31/2001EP1150169A2 Gas jet nozzle for extreme ultraviolet light source
10/31/2001EP1150168A2 Film formation method, semiconductor element and method thereof, and method of manufacturing a disk-shaped storage medium
10/31/2001EP1150162A2 Exposure method and exposure apparatus using near-field light and exposure mask
10/31/2001EP1150158A1 Iris diaphragm
10/31/2001EP1149936A2 Plating system
10/31/2001EP1149934A2 CVD synthesis of silicon nitride materials
10/31/2001EP1149933A1 Deposition method of dielectric films having a low dielectric constant
10/31/2001EP1149826A2 Ester compounds having alicyclic structure, and methods for preparing the same
10/31/2001EP1149423A1 Method for printing of transistor arrays on plastic substrates
10/31/2001EP1149421A1 Femfet device and method for producing same
10/31/2001EP1149420A1 Integrated circuit
10/31/2001EP1149417A1 Method for producing three-dimensional circuits
10/31/2001EP1149416A1 Method of depositing a copper seed layer which promotes improved feature surface coverage
10/31/2001EP1149415A1 Centrifugal gripper mechanism for dynamic force compensation
10/31/2001EP1149414A1 Method for improving the sidewall stoichiometry of thin film capacitors
10/31/2001EP1149413A1 Low temperature process for fabricating layered superlattice materials and making electronic devices including same
10/31/2001EP1149412A1 Dielectric films from organohydridosiloxane resins
10/31/2001EP1149411A1 Method and apparatus for wet-etching semiconductor wafers
10/31/2001EP1149410A1 Method of processing semiconductor wafers to build in back surface damage
10/31/2001EP1149409A2 Method for forming a silicide region on a silicon body
10/31/2001EP1149408A1 Microelectronic structure
10/31/2001EP1149407A2 High aspect ratio sub-micron contact etch process in an inductively-coupled plasma processing system
10/31/2001EP1149403A1 Perforated plasma confinement ring in plasma reactors
10/31/2001EP1149385A1 Ic test software system for mapping logical functional test data of logic integrated circuits to physical representation
10/31/2001EP1149329A1 Aligning device for assembling microsystems
10/31/2001EP1149297A1 A scan test point observation system and method
10/31/2001EP1149283A1 Method and device for detecting spatial structure characteristics of a crystal
10/31/2001EP1149184A1 Method and system for producing semiconductor crystals using temperature management
10/31/2001EP1149061A1 High purity, siliconized silicon carbide having high thermal shock resistance
10/31/2001EP1149060A1 Melted alumina-zirconia ceramic grains, abrasive tools and refractory parts produced from said grains
10/31/2001EP1148983A2 Method and device for shaping surfaces of semiconductors
10/31/2001EP1148976A1 Method and apparatus for deposition on and polishing of a semiconductor surface
10/31/2001EP1148968A1 Method and apparatus for removal of mold flash
10/31/2001EP1110054A4 Methods and apparatus for measuring the thickness of a film, particularly of a photoresist film on a semiconductor substrate
10/31/2001EP0944920B1 Process for dividing a semiconductor wafer
10/31/2001EP0917732B1 Wafer frame
10/31/2001EP0878020B1 Electromagnetic high-frequency or microwave apparatus
10/31/2001EP0838088B1 Process for manufacturing an integrated cmos circuit
10/31/2001EP0820638B1 PROCESS FOR PRODUCING AN ELECTRICAL CONTACT ON A SiC SURFACE
10/31/2001EP0755571B1 Process and device for chemically treating substrates
10/31/2001EP0721657B1 Method of manufacturing high performance bipolar transistors in a bicmos process
10/31/2001EP0715353B1 Board for a semiconductor chip
10/31/2001EP0654168B1 Fault-tolerant hierarchical bus system
10/31/2001DE10117923A1 Halbleiterwaferschneidmaschine Semiconductor wafer cutting machine
10/31/2001DE10105071A1 CMOS-image sensor arrangement e.g. for digital camera of personal computer (PC), has photo-diode formed on the lower face of the active zone and the transistors for transmission
10/31/2001DE10049397A1 Aufbau von Leistungshalbleitern mit einer textilen Ausgleichsschicht zum Kühlkörper Construction of power semiconductors with a textile balancing layer to the heatsink
10/31/2001DE10021095A1 Forming dielectric on semiconductor substrate
10/31/2001DE10020103A1 Verfahren und Vorrichtung zum nasschemischen Entfernen von Schichten und zur Reinigung von scheibenförmigen Einzelsubstraten Method and apparatus for wet-chemical removal of layers and for cleaning the disk-shaped single substrates
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