| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 11/06/2001 | US6312998 Field effect transistor with spacers that are removable with preservation of the gate dielectric |
| 11/06/2001 | US6312997 Low voltage high performance semiconductor devices and methods |
| 11/06/2001 | US6312996 Semiconductor device and method for fabricating the same |
| 11/06/2001 | US6312995 MOS transistor with assisted-gates and ultra-shallow “Psuedo” source and drain extensions for ultra-large-scale integration |
| 11/06/2001 | US6312994 Semiconductor device and method for fabricating the same |
| 11/06/2001 | US6312993 High speed trench DMOS |
| 11/06/2001 | US6312992 Thin film transistor and method for fabricating the same |
| 11/06/2001 | US6312991 Elimination of poly cap easy poly 1 contact for NAND product |
| 11/06/2001 | US6312990 Structure nonvolatile semiconductor memory cell array and method for fabricating same |
| 11/06/2001 | US6312989 Structure with protruding source in split-gate flash |
| 11/06/2001 | US6312988 Methods of forming capacitors, methods of forming capacitor-over-bit line memory circuitry, and related integrated circuitry constructions |
| 11/06/2001 | US6312987 Method for manufacturing semiconductor device having hemispherical grain polysilicon film |
| 11/06/2001 | US6312986 Concentric container fin capacitor and method |
| 11/06/2001 | US6312985 Method of fabricating a bottom electrode |
| 11/06/2001 | US6312984 Semiconductor processing method of forming a contact pedestal of forming a storage node of a capacitor and integrated circuitry |
| 11/06/2001 | US6312983 Etching method for reducing bit line coupling in a DRAM |
| 11/06/2001 | US6312982 Method of fabricating a trench capacitor |
| 11/06/2001 | US6312981 Method for manufacturing semiconductor device |
| 11/06/2001 | US6312979 Method of crystallizing an amorphous silicon layer |
| 11/06/2001 | US6312978 Method for leadless die interconnect without substrate cavity |
| 11/06/2001 | US6312977 Method of attaching a leadframe to singulated semiconductor dice |
| 11/06/2001 | US6312976 Method for manufacturing leadless semiconductor chip package |
| 11/06/2001 | US6312974 Simultaneous bumping/bonding process utilizing edge-type conductive pads and device fabricated |
| 11/06/2001 | US6312973 IC die power connection using canted coil spring |
| 11/06/2001 | US6312972 Pre-bond encapsulation of area array terminated chip and wafer scale packages |
| 11/06/2001 | US6312968 Method for fabricating an electrically addressable silicon-on-sapphire light valve |
| 11/06/2001 | US6312967 Semiconductor device and manufacture method thereof, as well as light emitting semiconductor device |
| 11/06/2001 | US6312962 Method for COB mounting of electronic chips on a circuit board |
| 11/06/2001 | US6312874 Method for forming a dual damascene trench and underlying borderless via in low dielectric constant materials |
| 11/06/2001 | US6312870 t-butyl cinnamate polymers and their use in photoresist compositions |
| 11/06/2001 | US6312863 Alkali-soluble resin; photosensitizer comprising an ester of a 1,2-naphthoquinonediazidesulfonyl compound with a substituted m-bis(hydroxybenzyl)phenol |
| 11/06/2001 | US6312854 Method of patterning sub-0.25 lambda line features with high transmission, “attenuated” phase shift masks |
| 11/06/2001 | US6312846 Fuel cell and power chip technology |
| 11/06/2001 | US6312833 Multilayered wiring layer |
| 11/06/2001 | US6312830 Refractory hydride layer formed from a portion of the underbump metalization layer. |
| 11/06/2001 | US6312819 Oriented conductive oxide electrodes on SiO2/Si and glass |
| 11/06/2001 | US6312816 A-site- and/or B-site-modified PbZrTiO3 materials and (Pb, Sr, Ca, Ba, Mg) (Zr, Ti, Nb, Ta)O3 films having utility in ferroelectric random access memories and high performance thin film microactuators |
| 11/06/2001 | US6312800 Pressure sensitive adhesive sheet for producing a chip |
| 11/06/2001 | US6312797 Method for manufacturing bonded wafer and bonded wafer |
| 11/06/2001 | US6312793 Multiphase low dielectric constant material |
| 11/06/2001 | US6312766 Article comprising fluorinated diamond-like carbon and method for fabricating article |
| 11/06/2001 | US6312761 Film forming method for processing tungsten nitride film |
| 11/06/2001 | US6312616 Plasma etching of polysilicon using fluorinated gas mixtures |
| 11/06/2001 | US6312614 Method for production of interposer for mounting semiconductor element |
| 11/06/2001 | US6312597 Apparatus for delivering ultra-low particle counts in semiconductor manufacturing |
| 11/06/2001 | US6312569 Chemical vapor deposition apparatus and cleaning method thereof |
| 11/06/2001 | US6312568 Two-step AIN-PVD for improved film properties |
| 11/06/2001 | US6312567 Depositing platinum on an insulating oxide layer under an oxygen or ozone containing atmosphere, and annealing the oxygen containing platinum layer to convert the layer into a platinum layer that is substantially free of oxygen |
| 11/06/2001 | US6312558 Method and apparatus for planarization of a substrate |
| 11/06/2001 | US6312557 Method and apparatus for using photoemission to determine the endpoint of an etch process |
| 11/06/2001 | US6312555 Thin film electrostatic shield for inductive plasma processing |
| 11/06/2001 | US6312554 Apparatus and method for controlling the ratio of reactive to non-reactive ions in a semiconductor wafer processing chamber |
| 11/06/2001 | US6312551 Method for mounting semiconductor chip onto circuit board |
| 11/06/2001 | US6312527 Non-corrosive cleaning method for use in the manufacture of microelectronic device |
| 11/06/2001 | US6312526 Chemical vapor deposition apparatus and a method of manufacturing a semiconductor device |
| 11/06/2001 | US6312525 Modular architecture for semiconductor wafer fabrication equipment |
| 11/06/2001 | US6312487 Polishing compound and an edge polishing method thereby |
| 11/06/2001 | US6312486 Slurry with chelating agent for chemical-mechanical polishing of a semiconductor wafer and methods related thereto |
| 11/06/2001 | US6312328 System and method for producing and supplying highly clean dry air |
| 11/06/2001 | US6312321 Polishing apparatus |
| 11/06/2001 | US6312171 Developing apparatus and method thereof |
| 11/06/2001 | US6311966 Workpiece absorption carrier unit and absorption head |
| 11/06/2001 | US6311959 Method and apparatus for generating controlled mixture of organic vapor and inert gas |
| 11/06/2001 | US6311890 Concave face wire bond capillary |
| 11/06/2001 | US6311888 Resin film and a method for connecting electronic parts by the use thereof |
| 11/06/2001 | US6311702 Apparatus adjusted to clean semiconductor substrates |
| 11/06/2001 | US6311638 Plasma processing method and apparatus |
| 11/06/2001 | US6311460 Method of using a packing insert as an assembly fixture |
| 11/06/2001 | US6311391 Flip-chip bonding apparatus |
| 11/06/2001 | CA2225844C Field effect transistor |
| 11/01/2001 | WO2001082674A1 Chip mounting device and method of adjusting parallelism in the chip mounting device |
| 11/01/2001 | WO2001082470A2 Voltage limiting bias circuit for reduction of hot electron degradation effects in mos cascode circuits |
| 11/01/2001 | WO2001082383A1 Method for producing a solar cell, and solar cell |
| 11/01/2001 | WO2001082382A1 Fabrication of low leakage-current backside illuminated photodiodes |
| 11/01/2001 | WO2001082380A2 Power semiconductor device having a trench gate electrode and method of making the same |
| 11/01/2001 | WO2001082372A1 Polymer stud grid array having feedthroughs and method for producing a substrate for a polymer stud grid array of this type |
| 11/01/2001 | WO2001082370A1 Method for adjusting structures on a semiconductor substrate |
| 11/01/2001 | WO2001082369A1 Method for thinning a substrate |
| 11/01/2001 | WO2001082368A2 Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module |
| 11/01/2001 | WO2001082367A1 Integrated circuit and method of manufacture thereof |
| 11/01/2001 | WO2001082366A1 Ceramic substrate for semiconductor fabricating device |
| 11/01/2001 | WO2001082365A1 Method and apparatus for control of critical dimension using feedback etch control |
| 11/01/2001 | WO2001082364A1 Semiconductor device inspection system |
| 11/01/2001 | WO2001082363A1 Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure |
| 11/01/2001 | WO2001082362A2 Process for forming electrical/mechanical connections |
| 11/01/2001 | WO2001082361A2 Method of forming an integrated circuit package at a wafer level |
| 11/01/2001 | WO2001082360A1 Technique for suppression of edge current in semiconductor devices |
| 11/01/2001 | WO2001082359A2 Method of making a semiconductor device having a recessed insulating layer of varying thickness |
| 11/01/2001 | WO2001082358A1 Production method of silicon mirror wafer |
| 11/01/2001 | WO2001082357A1 Method for sealing fine groove with siliceous material and substrate having siliceous coating formed thereon |
| 11/01/2001 | WO2001082356A2 Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates |
| 11/01/2001 | WO2001082355A2 Method and apparatus for plasma cleaning of workpieces |
| 11/01/2001 | WO2001082352A1 Reinforcement material for silicon wafer and method of manufacturing ic chip using the reinforcement material |
| 11/01/2001 | WO2001082351A1 A method of forming a conductive coating on a semiconductor device |
| 11/01/2001 | WO2001082350A1 A method and apparatus for selectively oxidizing a silicon/metal composite film stack |
| 11/01/2001 | WO2001082349A1 Thermal processing system and thermal processing method |
| 11/01/2001 | WO2001082348A1 Thermal processing system |
| 11/01/2001 | WO2001082347A1 Method of manufacturing group-iii nitride compound semiconductor device |
| 11/01/2001 | WO2001082346A1 Method for fabricating silicon-on-insulator |
| 11/01/2001 | WO2001082345A1 System and method for illuminating a semiconductor processing system |