H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2001
11/08/2001	US20010038133 Full CMOS SRAM cell
11/08/2001	US20010038132 Porous silicon oxycarbide integrated circuit insulator
11/08/2001	US20010038131 Using an elevated silicide as diffusion source for deep sub-micron and beyond cmos
11/08/2001	US20010038130 CMOS device and method for fabricating the same
11/08/2001	US20010038129 CMOS transistor semiconductor device
11/08/2001	US20010038127 Semiconductor device and a method of manufacturing the same
11/08/2001	US20010038125 Insulated gate field effect transistor and semiconductor integrated circuit
11/08/2001	US20010038124 Method for manufacturing a semiconductor device
11/08/2001	US20010038123 Transistor with dynamic source/drain extensions
11/08/2001	US20010038122 Semiconductor device exhibiting a high breakdown voltage and the method of manufacturing the same
11/08/2001	US20010038121 TDMOS device and method of fabricating TDMOS device using self-align technique
11/08/2001	US20010038120 EEPROM cell using conventional process steps
11/08/2001	US20010038119 Semiconductor integrated circuit device having single-element type non-volatile memory elements
11/08/2001	US20010038118 Nonvolatile semiconductor memory and method of manufacturing the same
11/08/2001	US20010038117 Ferroelectric transistor, use thereof in a memory cell confuguration and method of producing the ferroelectric transistor
11/08/2001	US20010038116 Doped silicon structure with impression image on opposing roughened surfaces
11/08/2001	US20010038115 Semiconductor device having capacitive element structure and multilevel interconnection structure and method of fabricating the same
11/08/2001	US20010038114 Semiconductor integrated circuit device and the method of producing the same
11/08/2001	US20010038113 Process for manufacturing a crystal axis-aligned vertical side wall device
11/08/2001	US20010038112 Strap with intrinsically conductive barrier
11/08/2001	US20010038111 Oxide etching method and structures resulting from same
11/08/2001	US20010038110 Method of making high density semiconductor memory
11/08/2001	US20010038109 Resistive ferroelectric memory cell
11/08/2001	US20010038108 Field effect transistor and method of manufacturing the same
11/08/2001	US20010038107 Gate array and manufacturing method of semiconductor integrated circuit using gate array
11/08/2001	US20010038105 Polysilicon evaluating method, polysilicon inspection apparatus and method for preparation of thin film transistor
11/08/2001	US20010038100 Application-specific optoelectronic integrated circuit
11/08/2001	US20010038099 Thin film semiconductor device and method of manufacturing the same
11/08/2001	US20010038097 Thin film transistors, and liquid crystal display device and electronic apparatus using the same
11/08/2001	US20010038095 Solid-state image pickup element and driving method thereof, and camera system
11/08/2001	US20010038090 Etching semiconductor material comprising glass and a metal after pretreating metal with surfactant
11/08/2001	US20010038089 Process for ashing organic materials from substrates
11/08/2001	US20010038080 Charged-particle-beam projection-lens system exhibiting reduced blur and geometric distortion, and microlithography apparatus including same
11/08/2001	US20010038065 Close contact type sensor
11/08/2001	US20010038005 Optical radiation measurement apparatus
11/08/2001	US20010038002 Heating furnace including vertically spaced-apart double-sided far-infrared-radiation panel heaters defining multi-stage drying chambers
11/08/2001	US20010037995 Titanium-based etching a perovskite ferroelectric film
11/08/2001	US20010037994 Method of etching an object, method of repairing pattern, nitride pattern and semiconductor device
11/08/2001	US20010037993 Etching method and wiring board manufactured by the method
11/08/2001	US20010037986 Electronic device workpiece carriers
11/08/2001	US20010037945 Gap between contact and wafer surface being plated is small, reducing bubbles
11/08/2001	US20010037939 Impurity introducing apparatus and method
11/08/2001	US20010037892 Semiconductor package
11/08/2001	US20010037863 Semiconductor die de-processing using a die holder and chemical mechanical polishing
11/08/2001	US20010037862 Support-frame bonding apparatus
11/08/2001	US20010037860 Etching method and apparatus
11/08/2001	US20010037858 Processing apparatus, processing system and processing method
11/08/2001	US20010037856 Etching apparatus for manufacturing semiconductor devices
11/08/2001	US20010037822 Vapor drying system and method
11/08/2001	US20010037821 Integrated chemical-mechanical polishing
11/08/2001	US20010037820 Analyzing for purity
11/08/2001	US20010037819 Liquid feed nozzle, wet treatment apparatus and wet treatment method
11/08/2001	US20010037818 Sherbet-like cleaning composition and method and system for cleaning substrate
11/08/2001	US20010037816 Spraying
11/08/2001	US20010037771 Apparatus And Method For Aligning A Wafer
11/08/2001	US20010037769 Method of forming thin film onto semiconductor substrate
11/08/2001	US20010037768 Conveyor device and film formation apparatus for a flexible substrate
11/08/2001	US20010037767 Bell jar having integral gas distribution channeling
11/08/2001	US20010037764 Liquid treatment system and liquid treatment method
11/08/2001	US20010037763 Apparatus and method for applying process solution
11/08/2001	US20010037761 Epitaxial silicon wafer free from autodoping and backside halo and a method and apparatus for the preparation thereof
11/08/2001	US20010037760 Epitaxial film produced by sequential hydride vapor phase epitaxy
11/08/2001	US20010037716 Method and apparatus for removing one or more covers of an electronic module
11/08/2001	US20010037586 Method and apparatus for agitation of workpiece in high pressure environment
11/08/2001	US20010037585 Vacuum processing apparatus and operating method therefor
11/08/2001	US20010037571 Heat-dissipating device and method for manufacturing a housing of the heat-dissipating device
11/08/2001	US20010037565 Process for forming a multi-level thin-film electronic packaging structure
11/08/2001	EP1144706A3 Method and device for the heat treatment of substrates
11/08/2001	DE10120631A1 Cooling system for burn-in unit e.g. for manufacture of semiconductor chips, has component being tested mounted on burn-in board and positioned within burn-in chamber
11/08/2001	DE10120302A1 Halbleiter-Bauteil und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation
11/08/2001	DE10119766A1 Radio frequency plasma reactor has distribution chamber with wall opposite metal plate with gas inlet openings distributed along wall and connected to at least one gas feed line to reactor
11/08/2001	DE10115301A1 Linearführung mit einem Luftlager Linear guide with an air bearing
11/08/2001	DE10050487A1 Method for structuring wafers or substrates using UBM layer technology, involves adhering plastics strip to surface of wafer and punching holes using laser through plastic band, above UBM layer
11/08/2001	DE10041764A1 Semiconductor component, uses contact forming process based on filling a cavity with an electrical contact material formed from a conductive metallic paste
11/08/2001	DE10033817A1 Wafer support plate for supporting a wafer during the process of producing a semi-conductor identifies a wafer's position on the support plate during heat treatment while detecting the wafer's correct position on the plate.
11/08/2001	DE10022656A1 Removing structures from a substrate comprises preparing a substrate with the structures to be removed, applying a sacrificial layer, and removing the structures and the sacrificial layer by polishing
11/08/2001	DE10021666A1 Carrier for semiconductor wafers being processed, has several receptacle devices for receiving semiconductor wafers and arranged in parallel with one another
11/08/2001	DE10020541A1 Verfahren zur Herstellung einer Solarzelle und Solarzelle A process for producing a solar cell and solar cell
11/08/2001	DE10020531A1 Process for determining metallic impurities in a semiconductor wafer comprises subjecting the wafer to an oxidizing hydrogen fluoride-containing atmosphere, making it hydrophobic, applying an etching solution to the surface, and analyzing
11/08/2001	DE10020185A1 Vorrichtung und Verfahren zum Behandeln von Substraten Apparatus and method for processing substrates
11/08/2001	CA2407888A1 Electrically-eraseable programmable read-only memory having reduced-page-size program and erase
11/08/2001	CA2407358A1 Throughput enhancement for single wafer reactor
11/08/2001	CA2407300A1 Method of modifying the surface of a semiconductor wafer
11/08/2001	CA2405766A1 Method of cleaning glass
11/08/2001	CA2404377A1 Tunable devices incorporating bicu3ti3feo12
11/07/2001	EP1152646A1 Method and apparatus for plasma treatment
11/07/2001	EP1152539A1 Mixed-signal circuitry and integrated circuit devices
11/07/2001	EP1152538A1 Mixed-signal circuitry and integrated circuit devices
11/07/2001	EP1152534A1 Integrated CMOS semiconductor circuit
11/07/2001	EP1152505A1 Semiconductor laser
11/07/2001	EP1152470A2 Semiconductor device with LDD structure and process of manufacturing the same
11/07/2001	EP1152467A1 Monolithic component with unique command for a mixed bridge
11/07/2001	EP1152466A2 Semiconductor device fabrication using adhesives
11/07/2001	EP1152464A2 Chip size package semiconductor device and method of manufacturing the same
11/07/2001	EP1152463A1 Semiconductor device and its production method
11/07/2001	EP1152462A1 Method of manufacturing a bipolar transistor
11/07/2001	EP1152461A2 Oxidizing method and oxidation system
11/07/2001	EP1152460A2 Method of etching a contact by RIE using a low temperature carbon rich oxy-nitride layer for improving etching selectivity
11/07/2001	EP1152459A2 Method for forming a barrier layer in an electronic device
11/07/2001	EP1152458A1 Production method for silicon epitaxial wafer and silicon epitaxial wafer

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