Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2001
11/13/2001US20010006767 Aqueous solution of a photosensitive polyimide
11/13/2001CA2216083C High voltage integrated circuit diode with a charge injecting node
11/08/2001WO2001084888A1 Ceramic heater and method of controlling temperature of the ceramic heater
11/08/2001WO2001084887A1 Ceramic heater
11/08/2001WO2001084886A1 Ceramic heater
11/08/2001WO2001084885A1 Ceramic heater
11/08/2001WO2001084683A2 In-line gas ionizer and method
11/08/2001WO2001084681A1 Monolithically integrated switching circuit for regulating the luminous power of a laser diode
11/08/2001WO2001084635A1 Thin film transistor and method for fabricating the same, and liquid crystal display comprising the same
11/08/2001WO2001084634A1 Information processing structure
11/08/2001WO2001084633A1 Method and apparatus for producing bonded dielectric separation wafer
11/08/2001WO2001084632A1 One-time uv-programmable non-volatile semiconductor memory and method of programming such a semiconductor memory
11/08/2001WO2001084630A1 Single supply hfet with temperature compensation
11/08/2001WO2001084628A1 Method of forming spacers in cmos devices
11/08/2001WO2001084627A2 Electronic devices with diffusion barrier and process for making same
11/08/2001WO2001084626A1 Semiconductor device having a low dielectric film and fabrication process thereof
11/08/2001WO2001084625A1 Flash memory array and a method and system of fabrication thereof
11/08/2001WO2001084624A2 Semiconductor lift pin for dechucking substrates
11/08/2001WO2001084623A1 Hot plate unit and semiconductor manufacturing and inspecting device
11/08/2001WO2001084622A1 Wafer supporting device of semiconductor manufacturing device
11/08/2001WO2001084621A1 Rotation holding device and semiconductor substrate processing device
11/08/2001WO2001084620A1 Thickness measuring apparatus, thickness measuring method, and wet etching apparatus and wet etching method utilizing them
11/08/2001WO2001084619A2 Method of depositing low stress films
11/08/2001WO2001084618A2 Method and mould for encapsulating electronic circuit carriers by injection moulding
11/08/2001WO2001084617A1 Conductive structure for use in multi-level metallization and process
11/08/2001WO2001084616A2 Semiconductor device using a barrier layer
11/08/2001WO2001084615A1 Method for producing substrate for use in electronic parts and solvent for cleaning
11/08/2001WO2001084614A2 Method of low-selectivitiy etching of dissimilar materials
11/08/2001WO2001084613A1 Method of modifying the surface of a semiconductor wafer
11/08/2001WO2001084612A1 Interface control for film deposition by gas-cluster ion-beam processing
11/08/2001WO2001084611A1 Apparatus for treating the surface with neutral particle beams
11/08/2001WO2001084610A1 Method of manufacturing integrated circuit, and substrate with integrated circuit formed by the method of manufacturing integrated circuit
11/08/2001WO2001084609A1 Method for low temperature formation of stable ohmic contacts to silicon carbide
11/08/2001WO2001084607A1 Capacitor stack structure and method of fabricating
11/08/2001WO2001084606A1 Semiconductor wafer and device for semiconductor device manufacturing process
11/08/2001WO2001084605A1 Method for producing capacitor structures
11/08/2001WO2001084604A2 Method for producing an integrated capacitor
11/08/2001WO2001084603A1 System and method for illuminating a semiconductor processing system
11/08/2001WO2001084602A2 Method of forming a shallow and deep trench isolation (sdti) suitable for silicon on insulator (soi) substrates
11/08/2001WO2001084601A2 Implantation process using sub-stoichiometric, oxygen doses at different energies
11/08/2001WO2001084600A1 Process perturbation to measured-modeled method for semiconductor device technology modeling
11/08/2001WO2001084599A2 Uv-enhanced silylation process to increase etch resistance of ultra thin resists
11/08/2001WO2001084598A1 Method and device for treating slice-type substrates
11/08/2001WO2001084591A2 Pulsed rf power delivery for plasma processing
11/08/2001WO2001084570A2 Magnetic element with insulating veils and fabricating method thereof
11/08/2001WO2001084561A2 Tunable devices incorporating bicu3ti3feo¿12?
11/08/2001WO2001084556A1 Electrically-eraseable programmable read-only memory having reduced-page-size program and erase
11/08/2001WO2001084553A2 Three-dimensional memory array and method of fabrication
11/08/2001WO2001084552A2 Programming of nonvolatile memory cells
11/08/2001WO2001084469A1 Semi-physical modeling of hemt high frequency small-signal equivalent circuit models
11/08/2001WO2001084466A1 Hybrid, non linear, large signal microwave/millimeter wave model
11/08/2001WO2001084465A1 Semi-physical modeling of hemt dc-to-high frequency electrothermal characteristics
11/08/2001WO2001084397A1 Method and system for electrical commerce of semiconductor ip
11/08/2001WO2001084382A1 Methods and systems for lithography process control
11/08/2001WO2001084241A1 Non-contact seal using purge gas
11/08/2001WO2001084238A1 Nanostructures
11/08/2001WO2001084130A2 A nanotube-based electron emission device and systems using the same
11/08/2001WO2001084119A1 System and methods for classifying anomalies of sample surfaces
11/08/2001WO2001083852A1 Method and apparatus for distributing gas within high density plasma process chamber to ensure uniform plasma
11/08/2001WO2001083846A1 Method for producing ceramic and apparatus for producing the same, semiconductor device, and piezoelectric device
11/08/2001WO2001083844A2 Method for depositing metal and metal oxide films and patterned films
11/08/2001WO2001083843A1 Substrate processing system
11/08/2001WO2001083638A1 Polishing slurries for copper and associated materials
11/08/2001WO2001083607A1 Rheology-controlled epoxy-based compositions
11/08/2001WO2001083369A1 Water-repellent porous silica, method for preparation thereof and use thereof
11/08/2001WO2001083333A1 Throughput enhancement for single wafer reactor
11/08/2001WO2001083171A1 Self teaching robotic wafer handling system
11/08/2001WO2001083163A2 Method of polishing and cleaning glass
11/08/2001WO2001083152A1 Efficient energy transfer capillary
11/08/2001WO2001083084A1 Gas cabinet assembly comprising sorbent-based gas storage and delivery system
11/08/2001WO2001083082A1 Auto-switching gas delivery system utilizing sub-atmospheric pressure gas supply vessels
11/08/2001WO2001082745A1 Variable gap stop which can be used in a semiconductor processing device
11/08/2001WO2001061746A9 Test structure for metal cmp process control
11/08/2001WO2001043200B1 Controllable semiconductor switching element that blocks in both directions
11/08/2001WO2001041206A3 Manufacture of trench-gate semiconductor devices
11/08/2001WO2001033609A3 Apparatus for cleaning semiconductor wafers
11/08/2001WO2001029882A3 Method for in situ removal of a dielectric antireflective coating during a gate etch process
11/08/2001WO2001009900A8 High speed latch and flip-flop
11/08/2001WO2001009681A3 Multi mirror system for an illumination system
11/08/2001WO1999058733A3 Method and device for the heat treatment of substrates
11/08/2001US20010039647 Method for generating mask data, mask and computer readable recording media
11/08/2001US20010039645 Semiconductor integrated circuit having thereon on-chip capacitors
11/08/2001US20010039643 Design support apparatus for semiconductor devices
11/08/2001US20010039642 Design system for flip chip semiconductor device
11/08/2001US20010039641 Block based design methodology
11/08/2001US20010039601 Memory with large number of memory modules
11/08/2001US20010039485 Semiconductor device test system and test method
11/08/2001US20010039463 Device and method for supporting system development and computer-readable medium
11/08/2001US20010039251 For semiconductor packaging products
11/08/2001US20010039172 Polishing apparatus
11/08/2001US20010039171 In-situ pad conditoning apparatus for CMP polisher
11/08/2001US20010039170 Low temperature chemical mechanical polishing of dielectric materials
11/08/2001US20010039168 Method of transporting a semiconductor wafer in a wafer polishing system
11/08/2001US20010039167 Sample polishing apparatus and sample polishing method
11/08/2001US20010039165 Apparatus and methods for substantial planarization of solder bumps
11/08/2001US20010039164 Apparatus and methods for substantial planarization of solder bumps
11/08/2001US20010039161 Electron source, image display device manufacturing apparatus and method, and substrate processing apparatus and method
11/08/2001US20010039126 Supporting structure of optical element, exposure apparatus having the same, and manufacturing method of semiconductor device
11/08/2001US20010039125 Method for making an insulating film
11/08/2001US20010039124 Memory device and manufacturing method therefor