Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2001
11/20/2001US6319785 Method for forming a contact in a semiconductor device
11/20/2001US6319784 Using high temperature H2 anneal to recrystallize S/D and remove native oxide simultaneously
11/20/2001US6319783 Process to fabricate a novel source-drain extension
11/20/2001US6319782 Semiconductor device and method of fabricating the same
11/20/2001US6319781 Method of fabricating self-aligned multilevel mask ROM
11/20/2001US6319780 Process for the fabrication of an integrated circuit comprising MOS transistors for low voltage, EPROM cells and MOS transistors for high voltage
11/20/2001US6319779 Semiconductor transistor devices and methods for forming semiconductor transistor devices
11/20/2001US6319777 Trench semiconductor device manufacture with a thicker upper insulating layer
11/20/2001US6319776 Forming high voltage complementary semiconductor device (HV-CMOS) with gradient doping electrodes
11/20/2001US6319775 Nitridation process for fabricating an ONO floating-gate electrode in a two-bit EEPROM device
11/20/2001US6319774 Method for forming a memory cell
11/20/2001US6319773 Construction and application for non-volatile, reprogrammable switches
11/20/2001US6319772 Method for making low-leakage DRAM structures using selective silicon epitaxial growth (SEG) on an insulating layer
11/20/2001US6319771 Fabrication process for a lower electrode of a memory capacitor
11/20/2001US6319770 Method for fabricating a bottom electrode of a dynamic random access memory capacitor
11/20/2001US6319769 Capacitor in a semiconductor device and a fabricating method thereof
11/20/2001US6319768 Method for fabricating capacitor in dram cell
11/20/2001US6319767 Method to eliminate top metal corner shaping during bottom metal patterning for MIM capacitors via plasma ashing and hard masking technique
11/20/2001US6319766 Method of tantalum nitride deposition by tantalum oxide densification
11/20/2001US6319765 Method for fabricating a memory device with a high dielectric capacitor
11/20/2001US6319764 Method of forming haze-free BST films
11/20/2001US6319763 Manufacturing method for semiconductor device
11/20/2001US6319762 Method for fabricating poly-spacers
11/20/2001US6319761 Method of fabricating a thin film transistor
11/20/2001US6319759 Method for making oxide
11/20/2001US6319757 Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates
11/20/2001US6319754 Wafer-dicing process
11/20/2001US6319753 Semiconductor device having lead terminals bent in J-shape
11/20/2001US6319752 Single-layer autorouter
11/20/2001US6319751 Bumpless flip chip assembly with solder via
11/20/2001US6319746 Optical semiconductor device and method for fabricating the same
11/20/2001US6319745 Formation of charge-coupled-device with image pick-up array
11/20/2001US6319742 Method of forming nitride based semiconductor layer
11/20/2001US6319741 Method for fabricating metal interconnections and wiring board having the metal interconnections
11/20/2001US6319740 Multilayer protective coating for integrated circuits and multichip modules and method of applying same
11/20/2001US6319739 Mold compound selection for TSOP post mold cure processing
11/20/2001US6319738 Two-dimensionally arrayed quantum device fabrication method
11/20/2001US6319737 Method and apparatus for characterizing a semiconductor device
11/20/2001US6319735 Photoresist dispense method by compensation for substrate reflectivity
11/20/2001US6319734 Method for establishing differential injection conditions in mosfet source/drain regions based on determining the permitted amount of energy contamination with respect to desired junction depth
11/20/2001US6319733 Method of manufacturing semiconductor device, semiconductor equipment and manufacturing system
11/20/2001US6319732 Method for controlling the temperature of a layer growing on a wafer
11/20/2001US6319731 Method for manufacturing a non-volatile memory device
11/20/2001US6319730 Method of fabricating a semiconductor structure including a metal oxide interface
11/20/2001US6319728 Decreasing chemical resistance of copper on surface; deposit copper containing moisture upon substrate, plasma treat copper and monitor chemical resistance
11/20/2001US6319727 Method for manufacturing low stress metallic interconnect lines for use in integrated circuits
11/20/2001US6319656 Photosensitive polyimide precursor and its use for pattern formation
11/20/2001US6319655 Modification of 193 nm sensitive photoresist materials by electron beam exposure
11/20/2001US6319654 Preparing a chemical amplification photoresist; coating on a substrate of a semiconductor element to form photoresist film; exposing film to light; silylation; developing to form pattern; etching substrate
11/20/2001US6319650 High resolution crosslinkable photoresist composition, compatable with high base concentration aqueous developers method and for use thereof
11/20/2001US6319649 Photosensitive resin composition and method of forming resist images
11/20/2001US6319644 Methods of reducing proximity effects in lithographic processes
11/20/2001US6319642 Analyzing pattern data to determine stripes of pattern to be successively lithographed; successively, for each determined stripe: extracting part of pattern data corresponding to stripe; dividing extracted part of pattern data; distribution
11/20/2001US6319641 Scanning exposure method utilizing alignment marks based on scanning direction
11/20/2001US6319638 Semiconductor device manufacturing method of accurately performing alignment of patterning, mask for exposure
11/20/2001US6319637 Forming patterns and masking to form opaque films
11/20/2001US6319636 Frames with membranes over them, absorbers and electron beams
11/20/2001US6319635 Mitigation of substrate defects in reticles using multilayer buffer layers
11/20/2001US6319634 Projection lithography photomasks and methods of making
11/20/2001US6319616 Conductive line structures, substrates, metal oxides and outer metal blanket layer
11/20/2001US6319566 Method of molecular-scale pattern imprinting at surfaces
11/20/2001US6319565 Applying metal such as antimony from metal hydride and metal hydride mixtures
11/20/2001US6319564 Multilayer element with coating a nonconductive organic heavy metal complex to a microporous surface, breaking up the complex and metallization the conductor tracks
11/20/2001US6319556 Reflective surface for CVD reactor walls
11/20/2001US6319553 Isolation of incompatible processes in a multi-station processing chamber
11/20/2001US6319551 Methods and compositions for forming silica, germanosilicate and metal silicate films, patterns and multilayers
11/20/2001US6319542 Forming a thin-film microelectronic capacitor on an integrated circuit by forming an buffer layer, a lanthanum doped barium strontium titanate layer, a barium strontium titanate dielectric layer and an upper electrode
11/20/2001US6319472 Stacked, multilayer, electronically reconfigurable; for the transport and/or analysis of biological materials like nucleic acids, biological pathogens and toxins
11/20/2001US6319450 Encapsulated circuit using vented mold
11/20/2001US6319427 Fast luminescent silicon
11/20/2001US6319420 Method and apparatus for electrically endpointing a chemical-mechanical planarization process
11/20/2001US6319419 Method of manufacturing member for thin-film formation apparatus and the member for the apparatus
11/20/2001US6319387 Copper alloy electroplating bath for microelectronic applications
11/20/2001US6319386 Submerged array megasonic plating
11/20/2001US6319384 Immersion substrate and counterelectrode in electroplating bath; electrolysis with modulated reversing electric current of cathodic pulses; free of brighteners; filling, leveling
11/20/2001US6319373 Substrate transfer apparatus of substrate processing system
11/20/2001US6319370 Apparatus for photoelectrochemical polishing of silicon wafers
11/20/2001US6319355 Plasma processor with coil responsive to variable amplitude rf envelope
11/20/2001US6319354 System and method for dicing semiconductor components
11/20/2001US6319333 Structure fully undercut, electrically isolated from substrate defining a vertical gap fully separating silicon island and supporting surface; integrated-circuit-processing structure
11/20/2001US6319331 Method for processing semiconductor substrate
11/20/2001US6319330 Applying surfactant solution to the semiconductor substrate surface, scrubbing the surface; spin-rinsing surface of the substrate using de-ionized water to complete a removal of any contaminants from surface
11/20/2001US6319329 Method of cleaning objects to be processed
11/20/2001US6319327 MOCVD system
11/20/2001US6319324 Method and apparatus for elimination of TEOS/ozone silicon oxide surface sensitivity
11/20/2001US6319322 Substrate processing apparatus
11/20/2001US6319317 Coating film forming method and coating apparatus
11/20/2001US6319316 System and method for performing low contamination extrusion for microelectronics applications
11/20/2001US6319297 Modular SMIF pod breather, adsorbent, and purge cartridges
11/20/2001US6319106 Wafer polishing apparatus
11/20/2001US6319105 Polishing apparatus
11/20/2001US6319102 Capacitor coupled chuck for carbon dioxide snow cleaning system
11/20/2001US6319099 Apparatus and method for feeding slurry
11/20/2001US6319096 Fumed metal oxide liquid carrier for generating uniformed, layered surfaces with minimal defects
11/20/2001US6319095 Colloidal suspension of abrasive particles containing magnesium as CMP slurry
11/20/2001US6319093 Chemical-mechanical polishing system and method for integrated spin dry-film thickness measurement
11/20/2001US6319065 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
11/20/2001US6319019 Selectively reinforced flexible tape carrier packages for liquid crystal display modules
11/20/2001US6318957 Method for handling of wafers with minimal contact
11/20/2001US6318953 SMIF-compatible open cassette enclosure