H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2001
11/20/2001	US6318951 Robots for microelectronic workpiece handling
11/20/2001	US6318948 Substrate transfer apparatus and substrate processing apparatus
11/20/2001	US6318946 Interlock system for semiconductor wafer transport apparatus
11/20/2001	US6318945 Substrate processing apparatus with vertically stacked load lock and substrate transport robot
11/20/2001	US6318944 Semiconductor fabricating apparatus, method for modifying positional displacement of a wafer in a wafer cassette within the semiconductor fabricating apparatus and method for transferring the wafer cassette
11/20/2001	US6318913 Semiconductor wafer manufacturing method and apparatus for an improved heat exchanger for a photoresist developer
11/20/2001	US6318911 Gated clock design supporting method, gated clock design supporting apparatus, and computer readable memory storing gated clock design supporting program
11/20/2001	US6318777 Suction mechanism and method, for IC and horizontal conveyer type handler
11/20/2001	US6318622 High power hybrid modules assembly using vacuum oven for permanent electrical connections
11/20/2001	US6318621 Method and apparatus for sealing a chip carrier and lid
11/20/2001	US6318538 Device for treatment of a substrate
11/20/2001	US6318389 Apparatus for cleaning semiconductor wafers
11/20/2001	US6318386 Treatment apparatus
11/20/2001	US6318385 Micro-environment chamber and system for rinsing and drying a semiconductor workpiece
11/20/2001	US6318384 Self cleaning method of forming deep trenches in silicon substrates
11/20/2001	US6318355 Case for storing a grinding wheel
11/20/2001	US6318354 Singulation system for a BGA product
11/20/2001	US6318177 Micromechanical component and method for producing the micromechanical component
11/20/2001	US6318124 Nanoporous silica treated with siloxane polymers for ULSI applications
11/19/2001	CA2348124A1 A method for the heat treatment of a znse crystal substrate, heat treated substrate and light emission device
11/19/2001	CA2343694A1 A method for locally modifying the effective bandgap energy in indium gallium arsenide phosphide (ingaasp) quantum well structures
11/18/2001	CA2347902A1 Curable electron donor compounds
11/18/2001	CA2347901A1 Curable hybrid electron donor compounds containing vinyl ether
11/15/2001	WO2001087018A1 Hot plate unit
11/15/2001	WO2001086732A1 Low area metal contacts for photovoltaic devices
11/15/2001	WO2001086727A2 Silicon carbide metal-semiconductor field effect transistors and methods of fabricating silicon carbide metal-semiconductor field effect transistors
11/15/2001	WO2001086726A1 A semiconductor device
11/15/2001	WO2001086717A1 Electrostatic chuck
11/15/2001	WO2001086716A1 Semiconductor device mounting circuit board, method of producing the same, and method of producing mounting structure using the same
11/15/2001	WO2001086715A2 Method for soldering a first metal layer, which has a thickness of less than 5 $g(m)m, to a second metal layer, and a corresponding soldering device and semiconductor chip assembly device
11/15/2001	WO2001086714A1 Method for soldering a first metal element and a second metal element using a soldering material and a semiconductor assembly device
11/15/2001	WO2001086712A1 Hydrogen implant for buffer zone of punch-through non epi igbt
11/15/2001	WO2001086711A1 Method for producing a bipolar transistor
11/15/2001	WO2001086710A1 Method of producing silicon epitaxial wafers
11/15/2001	WO2001086709A2 Simplified method to produce nanoporous silicon-based films
11/15/2001	WO2001086708A2 Amorphous metal oxide gate dielectric structure
11/15/2001	WO2001086707A1 LOW RELATIVE PERMITTIVITY SIOx FILM, PRODUCTION METHOD, SEMICONDUCTOR DEVICE COMPRISING THE FILM
11/15/2001	WO2001086706A1 Method for substrate noise distribution
11/15/2001	WO2001086705A1 Thin film processing method and thin film processing apparatus
11/15/2001	WO2001086704A1 Semiconductor manufacturing system and control method thereof
11/15/2001	WO2001086703A2 Method and apparatus for sorting semiconductor devices
11/15/2001	WO2001086702A1 Lamp based scanning rapid thermal processing
11/15/2001	WO2001086701A2 Method of high selectivity sac etching
11/15/2001	WO2001086700A1 Longitudinal conveyor
11/15/2001	WO2001086698A2 Method and system for detecting metal contamination on a semiconductor wafer
11/15/2001	WO2001086697A2 Inductive plasma loop enhancing magnetron sputtering
11/15/2001	WO2001086361A2 Method and system for self-replicating manufacturing stations
11/15/2001	WO2001086353A1 Polymers containing oxygen and sulfur alicyclic units and photoresist compositions comprising same
11/15/2001	WO2001086352A2 Polymers for photoresist compositions for microlithography
11/15/2001	WO2001086314A2 Method and circuit for testing dc parameters of circuit input and output nodes
11/15/2001	WO2001086035A1 Epitaxial silicon wafer free from autodoping and backside halo
11/15/2001	WO2001086034A2 Modified susceptor for use in chemical vapor deposition process
11/15/2001	WO2001086031A1 Anode assembly for plating and planarizing a conductive layer
11/15/2001	WO2001086019A1 Susceptorless semiconductor wafer support and reactor system for epitaxial layer growth
11/15/2001	WO2001085868A1 Polishing composition
11/15/2001	WO2001085415A1 Method and apparatus for distributing mold material in a mold for packaging microelectronic devices
11/15/2001	WO2001085392A2 Metal chemical mechanical polishing process for minimizing dishing during semiconductor wafer fabrication
11/15/2001	WO2001085391A2 Method and apparatus for agitation of workpiece in high pressure environment
11/15/2001	WO2001085377A1 Production method of radiators
11/15/2001	WO2001085367A1 Singulation and sorting system for electronic devices
11/15/2001	WO2001059821A8 A process for forming a semiconductor structure
11/15/2001	WO2001059820A8 Semiconductor structure
11/15/2001	WO2001047006B1 Tunnel nitride for improved polysilicon emitter
11/15/2001	WO2001041963A8 Systems and methods for application of atmospheric plasma surface treatment to various electronic component packaging and assembly methods
11/15/2001	WO2001011431A3 Method and apparatus of holding semiconductor wafers for lithography and other wafer processes
11/15/2001	WO2001009952A3 Interconnect assemblies and methods
11/15/2001	WO2000079568A3 Plasma reactor with multiple small internal inductive antennas
11/15/2001	WO2000072361A3 Apparatus and method for testing of sheet material
11/15/2001	WO2000072185A3 Behavioral-synthesis electronic design automation tool and business-to-business application service provider
11/15/2001	WO2000000663A9 Method and device for displacing wafers in a deposition reactor
11/15/2001	US20010042238 Semiconductor apparatus including bypass capacitor having structure for making automatic design easy, and semiconductor apparatus layout method
11/15/2001	US20010042237 Block based design methodology
11/15/2001	US20010042068 Methods and apparatus for data classification, signal processing, position detection, image processing, and exposure
11/15/2001	US20010042065 Appearance inspection apparatus and appearance inspection method
11/15/2001	US20010041971 Method of generating mesh and storage medium storing mesh generating program
11/15/2001	US20010041664 Exposing surface to dilute mixture of phosphoric acid and acetic acid; for semiconductors
11/15/2001	US20010041530 Local clean method and local clean processing and treating apparatus
11/15/2001	US20010041526 Carrier head with a flexible membrane for a chemical mechanical polishing system
11/15/2001	US20010041522 Fluid-pressure regulated wafer polishing head
11/15/2001	US20010041521 Adjustable and extended guide rings
11/15/2001	US20010041520 Polishing pad conditioning apparatus in chemical mechanical polishing apparatus
11/15/2001	US20010041518 Apparatus and methods for substantial planarization of solder bumps
11/15/2001	US20010041516 Apparatus and methods for substantial planarization of solder bumps
11/15/2001	US20010041515 Apparatus and methods for substantial planarization of solder bumps
11/15/2001	US20010041513 Method for chamfering a wafer
11/15/2001	US20010041508 Method and apparatuses for planarizing microelectronic substrate assemblies
11/15/2001	US20010041507 Chemical mechanical polishing slurry useful for copper/tantalum substrates
11/15/2001	US20010041506 Apparatus and methods for substantial planarization of solder bumps
11/15/2001	US20010041505 Apparatus and methods for substantial planarization of solder bumps
11/15/2001	US20010041504 Apparatus and methods for substantial planarization of solder bumps
11/15/2001	US20010041503 Apparatus and methods for substantial planarization of solder bumps
11/15/2001	US20010041500 Method for conserving a resource by flow interruption
11/15/2001	US20010041463 Electo-optical apparatus and method for fabricating a film, semiconductor device and memory device
11/15/2001	US20010041462 Apparatus for forming silicon oxide film and method of forming silicon oxide film
11/15/2001	US20010041461 Process for forming high voltage junction termination extension oxide
11/15/2001	US20010041460 Method of depositing dielectric
11/15/2001	US20010041459 Polyol-based method for forming thin film aerogels on semiconductor substrates
11/15/2001	US20010041458 Forming silicon-containing insulating film on substrate by plasmanizing and reacting reaction gas that contains hydrogen, an oxidizing gas, and a compound having siloxane bond and silicon-alkyl bond
11/15/2001	US20010041457 Structural integrity enhancement of dielectric films
11/15/2001	US20010041456 Semiconductor device production method

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