Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2001
11/22/2001US20010042744 Heating apparatus
11/22/2001US20010042742 Thermal processing apparatus having a coolant passage
11/22/2001US20010042734 Methods of planarizing structures on wafers and substrates by polishing
11/22/2001US20010042726 Cassette carrier for wafer cleaning processes
11/22/2001US20010042705 Method for classifying defects and device for the same
11/22/2001US20010042697 Support device for a wafer shipping container
11/22/2001US20010042690 Method and apparatus for electroplating and electropolishing
11/22/2001US20010042689 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
11/22/2001US20010042639 Semiconductor element-mounting board and semiconductor device
11/22/2001US20010042596 Method and apparatus for endpointing a chemical-mechanical planarization process
11/22/2001US20010042594 Process chamber having improved temperature control
11/22/2001US20010042559 Rotating substrate, supplying liquid and supplying a gaseous substance partially miscible with the liquid to the surface of the substrate so that when mixed it lowers the surface tension of the liquid; for integrated circuits, displays
11/22/2001US20010042555 Contacting workpiece such as semiconductor having a thin aqueous liquid boundary layer on the surface thereof with ozone, so the ozone reacts with surface at a diffusion-controlled rate, at elevated temperature
11/22/2001US20010042554 Used in semiconductor manufacturing, a plate-shaped protector made of dielectric and having similar electrical properties as the deposited film; removing thin film deposited on inner face of vacuum vessel
11/22/2001US20010042523 Method and apparatus for feeding gas phase reactant into a reaction chamber
11/22/2001US20010042514 CVD apparatus
11/22/2001US20010042513 Apparatus for improved remote microwave plasma source for use with substrate processing systems
11/22/2001US20010042512 CVD apparatus
11/22/2001US20010042511 Reduction of plasma edge effect on plasma enhanced CVD processes
11/22/2001US20010042509 Method and apparatus for controlling the thickness of a gate oxide in a semiconductor manufacturing process
11/22/2001US20010042505 Precursor mixtures for use in preparing layers on substrates
11/22/2001US20010042503 Method for design of epitaxial layer and substrate structures for high-quality epitaxial growth on lattice-mismatched substrates
11/22/2001US20010042502 Method of self-assembly silicon quantum dots
11/22/2001US20010042439 Permits purging a standard mechanical interface (SMIF) box or pod to isolate and control the environment in semiconductor manufacture, quickly to desired levels of relative humidity, oxygen and particulates; inlet port, check valve and filter
11/22/2001US20010042414 Sensor device for non-intrusive diagnosis of a semiconductor processing system
11/22/2001DE10123514A1 Semiconductor memory component, such as multiport SRAM cell with two word lines and CMOS structure
11/22/2001DE10121459A1 Semiconductor device, such as fusible link semiconductor memory device, has fusible link circuit with its fusible link in series with an assessment transistor having a controlled impedance path
11/22/2001DE10109929A1 Wavefront detector has wavefront source with two-dimensional structure and locally varying transmission, diffraction grid and position resolving detector
11/22/2001DE10100939A1 Non-volatile semiconductor arrangement used as an EEPROM comprises storage cells for the electrical programming by transferring charges between a charge receiving layer and a semiconductor substrate and arranged in the form a matrix
11/22/2001DE10050488A1 Substrate assembly strip for semiconductor casing carrier
11/22/2001DE10035423C1 Semiconductor element used as a bulk acoustic wave resonator or as a filter has an auxiliary layer arranged between a lower electrode and a piezoelectric or pyroelectric layer
11/22/2001DE10023956A1 Power semiconductor component with reduced surface field (RESURF) region between HV and LV sides
11/22/2001DE10022655A1 Verfahren zur Herstellung von Kondensatorstrukturen A method of fabricating capacitor structures
11/22/2001CA2409755A1 Method and apparatus for end-point detection
11/21/2001EP1156703A1 Ceramic heater
11/21/2001EP1156533A1 Peripheral structure for a vertical component
11/21/2001EP1156532A2 Electrode contact section of semiconductor device
11/21/2001EP1156531A1 Method for recycled separated wafer and recycled separated wafer
11/21/2001EP1156530A2 Compound semiconductor switching device for high frequency switching
11/21/2001EP1156526A2 Heat sink having bonded cooling fins
11/21/2001EP1156524A1 Manufacturing process of an integrated circuit including high-density and logic components portion
11/21/2001EP1156522A2 Electrostatic chuck with an insulating layer
11/21/2001EP1156521A2 Low cost electroless plating process for single chips and wafer parts and products obtained thereof
11/21/2001EP1156520A1 Electronic parts mounting method and device therefor
11/21/2001EP1156519A1 Gate etch process for 12 inch wafers
11/21/2001EP1156518A1 Heat treating device and heat treating method
11/21/2001EP1156517A1 Method for forming tungsten silicide film and method for fabricating metal-insulator-semiconductor transistor
11/21/2001EP1156516A1 Method and apparatus for plasma processing
11/21/2001EP1156515A1 Arrangement for shipping and transporting disc-like objects
11/21/2001EP1156511A1 Remote plasma CVD apparatus
11/21/2001EP1156510A2 Ion implanter and its use for manufacturing a MOSFET
11/21/2001EP1156431A2 System of manufacturing semiconductor integrated circuit
11/21/2001EP1156321A1 Method for checking a surface to be analysed and scanning surface-analyser
11/21/2001EP1156140A1 A method for the heat treatment of a ZnSe crystal substrate, heat treated substrate and light emission device
11/21/2001EP1156135A2 Vacuum processing apparatus
11/21/2001EP1156134A2 Method and apparatus of depositing a layer of nitrogen-doped fluorinated silicate glass
11/21/2001EP1156133A2 Method of manufacturing a multilayered dielectric film and semiconductor device
11/21/2001EP1156130A1 Plasma processing container internal member and production method therefor
11/21/2001EP1156093A2 Heat-peelable pressure-sensitive adhesive sheet
11/21/2001EP1156091A1 Polishing liquid and process of structuring metals and metal oxides
11/21/2001EP1156034A2 Curable electron donor compounds
11/21/2001EP1155784A1 Storage case for a rotary tool including a cutting blade and cutting apparatus using it
11/21/2001EP1155778A2 Polishing apparatus
11/21/2001EP1155458A1 Field effect transistor arrangement with a trench gate electrode and an additional highly doped layer in the body region
11/21/2001EP1155457A1 Bi-directional esd diode structure
11/21/2001EP1155456A1 Improved esd diode structure
11/21/2001EP1155451A1 An integrated circuit with a serpentine conductor track for circuit selection
11/21/2001EP1155447A2 Semiconductor structure with a strip conductor
11/21/2001EP1155446A1 Method for producing a dram cell with a trench capacitor
11/21/2001EP1155445A1 Method for producing electrically conductive connections
11/21/2001EP1155444A1 Process for forming thin dielectric layers in semiconductor devices
11/21/2001EP1155443A1 Heteroepitaxial growth with thermal expansion and lattice mismatch
11/21/2001EP1155442A1 Multilayer structure with controlled internal stresses and method for making same
11/21/2001EP1155441A1 Passivated silicon carbide devices with low leakage current and method of fabricating
11/21/2001EP1155440A1 Methods of fabricating etched structures
11/21/2001EP1155439A1 Single wafer annealing oven
11/21/2001EP1155438A1 Device for transporting objects
11/21/2001EP1155437A1 Cooled showerhead for rapid thermal processing (rtp) system
11/21/2001EP1155331A1 Text probe interface assembly and manufacture method
11/21/2001EP1155170A1 Method for producing nitride monocrystals
11/21/2001EP1155164A1 In situ chemical generator and method
11/21/2001EP1155092A1 Slurries of abrasive inorganic oxide particles and method for adjusting the abrasiveness of the particles
11/21/2001EP1154929A1 Passively activated valve for carrier purging
11/21/2001EP1154880A1 Substrate transport apparatus with multiple arms on a common axis of rotation
11/21/2001EP1154868A1 Non-corrosive cleaning composition and method for removing plasma etching residues
11/21/2001EP1129145A4 Non-corrosive stripping and cleaning composition
11/21/2001EP1062679B1 Plasma etching installation
11/21/2001EP0909406B1 Photomask blanks
11/21/2001EP0864175B1 Novel metallization sidewall passivation technology for deep sub-half micrometer ic applications
11/21/2001EP0822995B1 Modification of surfaces of polymers
11/21/2001EP0812475B1 Method of manufacturing a semiconductor device comprising a silicon body with bipolar and MOS transistors
11/21/2001EP0809596B1 Method and apparatus for transporting lead frame, and in-line system using them
11/21/2001EP0789387B1 Laminate and process for forming ohmic electrode
11/21/2001EP0774163B1 Reduced leakage antifuse structure and fabrication method
11/21/2001EP0723704B1 Layout for radio frequency power transistors
11/21/2001EP0721658B1 Counter-implantation method of manufacturing a semiconductor device with self-aligned anti-punchthrough pockets
11/21/2001CN2461241Y Stacked structure of integrated circuit device
11/21/2001CN2461227Y Image sensor
11/21/2001CN2461145Y Chip packing device
11/21/2001CN1323506A Fabrication process for flex circuit application