H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2001
11/28/2001	EP1157431A1 A hybrid electrical device with biological components
11/28/2001	EP1157425A1 Igbt with pn insulation
11/28/2001	EP1157422A1 Intelligent gate-level fill methods for reducing global pattern density effects
11/28/2001	EP1157421A1 Apparatuses and methods for forming assemblies
11/28/2001	EP1157419A1 Non-volatile memory cells and periphery
11/28/2001	EP1157418A1 Method for producing an integrated electrical circuit
11/28/2001	EP1157417A1 A method of manufacturing a semiconductor device
11/28/2001	EP1157416A1 Method for a tungsten silicide etch
11/28/2001	EP1157415A1 Silicon oxynitride film
11/28/2001	EP1157414A1 Method of achieving higher inversion layer mobility in silicon carbide semiconductor devices
11/28/2001	EP1157413A2 Method for producing highly doped semiconductor components
11/28/2001	EP1157412A1 Superior silicon carbide integrated circuits and method of fabricating
11/28/2001	EP1157411A1 Method for a consistent shallow trench etch profile
11/28/2001	EP1157410A1 MINIATURISED CAPACITOR WITH SOLID DIELECTRIC, ESPECIALLY FOR INTEGRATED SEMICONDUCTOR MEMORIES, E.G. DRAMs, AND METHOD FOR PRODUCING THE SAME
11/28/2001	EP1157409A1 Combination cmp-etch method for forming a thin planar layer over the surface of a device
11/28/2001	EP1157408A1 Device and method for thermally treating substrates
11/28/2001	EP1157388A1 Storage cell arrangement and method for producing the same
11/28/2001	EP1157307A1 Photoresist dispense method by compensation for substrate reflectivity
11/28/2001	EP1157253A1 Specimen topography reconstruction
11/28/2001	EP1157059A1 Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers
11/28/2001	EP1156903A1 Apparatus for performing chemical-mechanical planarization
11/28/2001	EP1156884A1 Device and method for applying adhesive material onto planar components and the use thereof
11/28/2001	EP1051738A4 Fabrication of organic semiconductor devices using ink jet printing
11/28/2001	EP0968631B1 Method for forming metal conductor models on electrically insulating supports
11/28/2001	EP0946973B1 Integrated circuit tray with flexural bearings
11/28/2001	EP0931338B1 Method of producing a mos transistor
11/28/2001	EP0904164B1 Device for treatment of substrates in a fluid container
11/28/2001	EP0898733B1 Method of producing a stencil mask
11/28/2001	EP0829035B1 Scanning-slit exposure device
11/28/2001	EP0784542B1 Stamp for a lithographic process
11/28/2001	EP0633997B1 A rapid thermal processing apparatus for processing semiconductor wafers
11/28/2001	CN2462421Y Improved display testing device
11/28/2001	CN2461712Y Fastening mounting tool
11/28/2001	CN2461710Y Fastening mounting tool
11/28/2001	CN1324496A Operating method and device
11/28/2001	CN1324495A Method for producing transistors
11/28/2001	CN1324486A Semiconductor device
11/28/2001	CN1324456A Photoresists and associated processes for microlitho graphy
11/28/2001	CN1324285A Monitoring system for dicing saws
11/28/2001	CN1324113A Self-alignment dual gate metal oxide semi-conductor field-effect transistor having separating gate
11/28/2001	CN1324111A Semi-conductor device
11/28/2001	CN1324110A IC packing stacked module
11/28/2001	CN1324108A Multiple line grid for application of packaging or testing
11/28/2001	CN1324107A Cooling system of aging device
11/28/2001	CN1324106A Method for making mask, semiconductor device and its mfg. method, method for mfg. recording medium
11/28/2001	CN1324093A Ion source operation method, and ion beam radiation device
11/28/2001	CN1323998A Electrooptical device assembling basic parts and its mfg. method, terminal connection method
11/28/2001	CN1323865A Hot removing and pressure sensitive type adhesive foil
11/28/2001	CN1323864A 抛光组合物 The polishing composition
11/28/2001	CN1323672A System and method for reducing welding program error for IC welding machine
11/28/2001	CN1075666C Method for fabricating field oxide layer in semiconductor device
11/28/2001	CN1075665C Conveying apparatus
11/28/2001	CN1075658C Membrane forming material and circuit layout forming method
11/28/2001	CN1075638C 正性光刻胶 Positive photoresist
11/28/2001	CN1075612C Gearshift apparatus for motor vehicle
11/28/2001	CN1075422C Automatic wafer lapping system
11/27/2001	US6324481 Method for the calculation of wafer probe yield limits from in-line defect monitor data
11/27/2001	US6324439 Method and apparatus for applying films using reduced deposition rates
11/27/2001	US6324298 Automated wafer defect inspection system and a process of performing such inspection
11/27/2001	US6324256 Liquid sprays as the target for a laser-plasma extreme ultraviolet light source
11/27/2001	US6324250 Exposure method
11/27/2001	US6324125 Pulse width detection
11/27/2001	US6324114 Semiconductor memory device using a plurality of semiconductor memory chips mounted in one system and a semiconductor memory system using a plurality of semiconductor memory devices
11/27/2001	US6324101 Storage method involving change of resistance state
11/27/2001	US6324100 Nonvolatile semiconductor memory device
11/27/2001	US6324099 2-bit/cell type nonvolatile semiconductor memory
11/27/2001	US6324097 Single poly non-volatile memory structure and its fabricating method
11/27/2001	US6324095 Low voltage flash EEPROM memory cell with improved data retention
11/27/2001	US6324088 256 meg dynamic random access memory
11/27/2001	US6324069 Chip package with molded underfill
11/27/2001	US6324068 Electronic component device, and main board for circuit boards
11/27/2001	US6324048 Ultra-small capacitor array
11/27/2001	US6324003 Calcium fluoride (CaF2) stress plate and method of making the same
11/27/2001	US6323951 Apparatus and method for determining the active dopant profile in a semiconductor wafer
11/27/2001	US6323937 Projection exposure apparatus, and device manufacturing method using the same
11/27/2001	US6323931 LCD with external circuit having anti-short-circuit pattern and particular structure
11/27/2001	US6323917 Thin film transistor for a liquid crystal display device and a fabrication process thereof
11/27/2001	US6323714 System and method for deskewing synchronous clocks in a very large scale integrated circuit
11/27/2001	US6323689 Semiconductor integrated circuit including output buffer circuit having high resistance to electro-static discharge
11/27/2001	US6323684 Voltage tolerant interface circuit
11/27/2001	US6323678 Integrated circuit device with programmable junctions and method of designing such integrated circuit device
11/27/2001	US6323667 Contact probe unit
11/27/2001	US6323666 Apparatus and method for testing test burn-in board and device under test, and test burn-in board handler
11/27/2001	US6323663 Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method
11/27/2001	US6323642 Detector for determining rotational speed and position for an internal combustion engine
11/27/2001	US6323616 Self teaching robotic wafer handling system
11/27/2001	US6323595 High frequency discharging method and apparatus, and high frequency processing apparatus
11/27/2001	US6323567 Circulating system for shaft-type linear motors
11/27/2001	US6323561 Spacer formation for precise salicide formation
11/27/2001	US6323560 Registration accuracy measurement mark, method of repairing defect of the mark, photomask having the mark, method of manufacturing the photo mask and method of exposure thereof
11/27/2001	US6323559 Hexagonal arrangements of bump pads in flip-chip integrated circuits
11/27/2001	US6323558 Method for fabricating a contact of a semiconductor device
11/27/2001	US6323557 Method and structure for improved alignment tolerance in multiple, singulated plugs
11/27/2001	US6323556 Interconnect structure of semiconductor device
11/27/2001	US6323554 Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD
11/27/2001	US6323553 Reduced temperature contact/via filling
11/27/2001	US6323552 Semiconductor device having bumps
11/27/2001	US6323551 Resin sealed-type semiconductor device and method of manufacturing the same
11/27/2001	US6323549 Ceramic composite wiring structures for semiconductor devices and method of manufacture
11/27/2001	US6323548 Semiconductor integrated circuit device

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