Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2001
12/06/2001US20010048124 Solid-state image pickup device and a method of producing the same
12/06/2001US20010048120 Heterojunction bipolar transistor composed of emitter layer which includes orderly structured layer and disorderly structured layer
12/06/2001US20010048119 Semiconductor device and method of manufacturing the same
12/06/2001US20010048118 Semiconductor photodetection device and fabrication process thereof
12/06/2001US20010048117 Differential negative resistance element and process for fabricating the same
12/06/2001US20010048116 Chip scale surface mounted device and process of manufacture
12/06/2001US20010048115 Semiconductor device and method of manufacturing the same
12/06/2001US20010048109 Electro-optical device, method for fabricating the same, and electronic apparatus
12/06/2001US20010048108 Thin-film semiconductor integrated circuit device and picture display device with using thereof and manufacturing method thereof
12/06/2001US20010048106 Electronic device and method of driving the same
12/06/2001US20010048105 Semiconductor device
12/06/2001US20010048104 Semiconductor device and method of manufacturing the same
12/06/2001US20010048095 Method for improving thermal stability of fluorinated amorphous carbon low dielectric constant materials
12/06/2001US20010048084 Exposure apparatus, device manufacturing method, semiconductor manufacturing plant and method of maintaining exposure apparatus
12/06/2001US20010048064 Electronic device and production process of same
12/06/2001US20010048017 Continuous mode solder jet apparatus
12/06/2001US20010048014 Method of producing a semiconductor device
12/06/2001US20010047990 Flash anneal
12/06/2001US20010047979 Method and apparatus for increased workpiece throughput
12/06/2001US20010047978 Using plates which rotate in opposite directions and are covered with polishing cloth, so that at least 2 mu m of semiconductor material is removed; accuracy
12/06/2001US20010047944 Means for holding plurality of wafers and rotating each wafer at constant speed and synchronous within the plurality for electroless plating of bondable metal caps onto bond pads of integrated corcuits having copper metallization
12/06/2001US20010047943 Soluble copper salt, electrolyte, one or more brightener compounds that are present in a concentration of at least about 1.5 mg per liter of electroplating composition; increased brightener levels
12/06/2001US20010047932 Depositing barrier, wetting layer, vapor depositing conformal metal layer over surface, filling apertures with metals; void-free
12/06/2001US20010047880 Double sided flexible circuit for integrated circuit packages and method of manufacture
12/06/2001US20010047864 Temperature control apparatus and method with recirculated coolant
12/06/2001US20010047849 Apparatus and method for fabricating semiconductor device
12/06/2001US20010047821 Apparatus for supplying chemical
12/06/2001US20010047817 Wafer cleaning device and tray for use in wafer cleaning device
12/06/2001US20010047815 Method for treating substrates
12/06/2001US20010047812 Spraying nozzles
12/06/2001US20010047810 For semiconductor wafers
12/06/2001US20010047764 Method and apparatus for improved chemical vapor deposition processes using tunable temperature controlled gas injectors
12/06/2001US20010047762 Processing apparatus
12/06/2001US20010047761 Vertical oven with a boat for the uniform treatment of wafers
12/06/2001US20010047760 Apparatus and method for multi-zone high-density inductively-coupled plasma generation
12/06/2001US20010047759 Plasma CVD apparatus
12/06/2001US20010047757 System for processing a workpiece
12/06/2001US20010047756 Gas distribution system
12/06/2001US20010047753 Treatment solution discharge apparatus
12/06/2001US20010047752 System for processing a workpiece
12/06/2001US20010047751 Method of producing device quality (a1) ingap alloys on lattice-mismatched substrates
12/06/2001US20010047750 Apparatus and method for depositing semiconductor film
12/06/2001US20010047749 Apparatus and method of growing single crystal of semiconductor
12/06/2001US20010047595 Apparatus and method for drying a substrate using hydrophobic and polar organic compounds
12/06/2001US20010047590 Method of manufacturing a heat pipe construction
12/06/2001EP1145299A3 Manufacture of trench-gate semiconductor devices
12/06/2001DE19907276C2 Verfahren zur Herstellung einer Lötverbindung zwischen einem elektrischen Bauelement und einem Trägersubstrat A process for producing a solder connection between an electrical component and a carrier substrate
12/06/2001DE10125339A1 Semiconductor device used as a bipolar transistor comprises a silicon substrate, a first silicon film, a silicon-germanium, a second silicon film, a third silicon film, and electrodes
12/06/2001DE10125035A1 Halbleiterbauteil Semiconductor device
12/06/2001DE10124741A1 Slurry used for the chemical-mechanical polishing of semiconductor components comprises water, grinding grains and a polymer additive having hydrophilic as well as hydrophobic groups
12/06/2001DE10119490A1 Substrat-Prozessierverfahren und Substrat-Prozessiervorrichtung Prozessierverfahren substrate and substrate-Prozessiervorrichtung
12/06/2001DE10107472A1 Bauelement für die Optoelektronik und Verfahren zu dessen Herstellung Device for optoelectronics and process for its preparation
12/06/2001DE10058737A1 Programming flash memory module such as EEPROM by removing electrons caught in insulating layer but not in floating gate electrode of memory cells
12/06/2001DE10057412A1 Halbleitergeräteeinkapselungsanordnung und Verfahren zu deren Hertellung Halbleitergeräteeinkapselungsanordnung and methods for their Hertel Lung
12/06/2001DE10055280A1 Phasenverschiebungs-Photomaskenrohling, Phasenverschiebungs-Photomaske und Verfahren zur Herstellung von Halbleitervorrichtung Phase shift photomask blank and phase shift photomask process for producing semiconductor device
12/06/2001DE10026243A1 Verfahren zum Auslesen von elektrischen Fuses/Antifuses A method for reading out electrical fuses / antifuses
12/06/2001DE10026180A1 Apparatus for coating a semiconductor wafer in the production of microelectronics has a gas inlet system for introducing process gases into the process chamber via inlets
12/06/2001DE10025871A1 Epitaxierte Halbleiterscheibe und Verfahren zu ihrer Herstellung Epitaxially coated semiconductor wafer, and processes for their preparation
12/06/2001DE10025567A1 Production of deep-doped regions of one conductivity type in a semiconductor body with conductivity of the opposite type comprises inserting protons or hydrogen atoms in the direction of the current flow between the electrodes
12/06/2001DE10025214A1 Littrow-Gitter sowie Verwendungen eines Littrow-Gitters Littrow grating, as well as uses of a Littrow grating
12/06/2001DE10016340C1 Fabrication of deep trench in semiconductor substrate during e.g., fabrication of deep-trench type capacitor utilizes plasma etching composition comprising hydrogen bromide, nitrogen fluoride, chlorine gas, and helium/oxygen gas mixture
12/06/2001DE10006378C2 Verfahren zur Herstellung Ohmscher Kontakte auf Siliziumkarbid-Halbleiterbereichen A process for producing ohmic contacts on silicon carbide semiconductor regions
12/06/2001CA2409156A1 Method for depositing a selected thickness of an interlevel dielectric material to achieve optimum global planarity on a semiconductor wafer
12/05/2001EP1160882A2 A photonic device, a substrate for fabricating a photonic device, a method for fabricating the photonic device and a method for manufacturing the photonic device-fabricating substrate
12/05/2001EP1160880A2 Apparatus and processes for the mass production of photovoltaic modules
12/05/2001EP1160879A2 Method of forming silicon-based thin film, silicon-based thin film and photovoltaic element
12/05/2001EP1160877A2 Photovoltaic element and method of manufacturing the same
12/05/2001EP1160872A2 Trenched semiconductor device
12/05/2001EP1160871A2 Charge compensation semiconductor device and method of making the same
12/05/2001EP1160870A2 Oriented rhombohedral composition of PbZr1-xTix03 thin films for low voltage operation ferroelectric ram
12/05/2001EP1160864A2 Semiconductor device with a corrosion resistant bonding pad and manufacturing method thereof
12/05/2001EP1160860A1 Heat sink material and method of manufacturing the heat sink material
12/05/2001EP1160858A2 A board for manufacturing a bga and method of manufacturing semiconductor device using thereof
12/05/2001EP1160857A2 Epoxy-based adhesive for mounting a semiconductor device on a substrate
12/05/2001EP1160856A2 Flip chip type semiconductor device and method of manufacturing the same
12/05/2001EP1160855A2 Memory cell with a trench capacitor and method for its manufacture
12/05/2001EP1160854A1 Method of electrically contacting the reverse side of a semiconductor substrate during processing
12/05/2001EP1160853A2 Method of producing a semiconductor device
12/05/2001EP1160852A2 Method of fabricating a trenched semiconductor device
12/05/2001EP1160851A2 Method for fabricating a multilayer semiconductor device
12/05/2001EP1160850A2 Bipolar transistor and method for manufacturing same
12/05/2001EP1160849A2 Method of anisotropic plasma etching using non-chlorofluorocarbon, fluorine-based chemistry
12/05/2001EP1160848A2 Composition for silica-based film formation
12/05/2001EP1160847A2 Method of forming oxynitride film and system for carrying out the same
12/05/2001EP1160846A2 Method of application of electrical biasing to enhance metal deposition
12/05/2001EP1160845A2 Method for fabricating a silicon carbide semiconductor device
12/05/2001EP1160844A2 Memory cell arrangement
12/05/2001EP1160843A1 Planarizing anti-reflective coating layer with improved light absorption
12/05/2001EP1160842A2 Integrated radio frequency circuits
12/05/2001EP1160841A2 Integrated inductive circuits
12/05/2001EP1160840A2 Container for conveying flat objects
12/05/2001EP1160839A2 Exposure apparatus, coating/developing apparatus, method of transferring a substrate, method of producing a device, semiconductor production factory, and method of maintaining an exposure apparatus
12/05/2001EP1160838A2 Heat treatment system and method
12/05/2001EP1160837A2 Substrate processing apparatus and substrate plating apparatus
12/05/2001EP1160826A2 Coating, modification and etching of substrate surface with particle beam irradiation
12/05/2001EP1160824A2 Illumination system for charged-particle lithography apparatus
12/05/2001EP1160629A2 Interferometric measurement of stage position
12/05/2001EP1160626A1 Method of detecting aberrations of an optical imaging system
12/05/2001EP1160576A2 Contact probe and fabrication method thereof
12/05/2001EP1160361A1 Method of manufacturing silicon carbide, silicon carbide, composite material, and semiconductor element