Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2002
01/24/2002US20020008295 Metal oxide semiconductor field effect transistor for reducing resistance between source and drain and method for fabricating the same
01/24/2002US20020008294 Semiconductor device and method for manufacturing same
01/24/2002US20020008293 Semiconductor device including inversely tapered gate electrode and manufacturing method thereof
01/24/2002US20020008292 Conductor layer nitridation
01/24/2002US20020008291 Mis transistor and method of fabricating the same
01/24/2002US20020008289 Mosfet with strained channel layer
01/24/2002US20020008288 Semiconductor memory device and method of manufacturing the same
01/24/2002US20020008286 Thin film transistors and semiconductor device
01/24/2002US20020008285 Semiconductor apparatus and process for manufacturing the same
01/24/2002US20020008284 Power mosfet and method for forming same using a self-aligned body implant
01/24/2002US20020008283 Heat removal by removal of buried oxide in isolation areas
01/24/2002US20020008282 Semiconductor device and a method of fabricating the same
01/24/2002US20020008281 Devices and methods for addressing optical edge effects in connection with etched trenches
01/24/2002US20020008280 High performance, low power vertical integrated CMOS devices
01/24/2002US20020008279 Semiconductor device
01/24/2002US20020008278 Semiconductor memory integrated circuit and its manufacturing method
01/24/2002US20020008277 Flash memory cell with contactless bit line, and process of fabrication
01/24/2002US20020008276 Non-volatile semiconductor memory device and manufacturing method thereof
01/24/2002US20020008275 Nonvolatile semiconductor memory device and its manufacture
01/24/2002US20020008274 Nonvolatile semiconductor memory and process for fabricating the same
01/24/2002US20020008273 Semiconductor device and a method of manufacturing the same
01/24/2002US20020008272 Method for fabricating a DRAM cell capacitor using hemispherical grain (HSG) silicon
01/24/2002US20020008271 Non-volatile memory system
01/24/2002US20020008270 Diffusion barrier layers and methods of forming same
01/24/2002US20020008269 Structure of a stacked memory cell, in particular a ferroelectric cell
01/24/2002US20020008268 RF voltage controlled capacitor on thick-film SOI
01/24/2002US20020008267 Deep trench semiconductor capacitors having reverse bias diodes for implantable medical devices
01/24/2002US20020008266 Semiconductor memory device
01/24/2002US20020008265 Methods for producing a structured metal layer
01/24/2002US20020008263 Ferroelectric memory device
01/24/2002US20020008262 Semiconductor integrated circuit
01/24/2002US20020008261 Transistor, semiconductor device and manufacturing method of semiconductor device
01/24/2002US20020008260 Insulated gate semiconductor device and method of manufacturing the same
01/24/2002US20020008259 Method of fabricating a semiconductor device with an open drain input/output terminal
01/24/2002US20020008258 Semiconductor device and manufacturing method thereof
01/24/2002US20020008257 Mosfet gate electrodes having performance tuned work functions and methods of making same
01/24/2002US20020008255 Semiconductor device
01/24/2002US20020008254 Semiconductor device
01/24/2002US20020008253 Semiconductor memory device and method for fabricating the same
01/24/2002US20020008252 Method of estimating lifetime of semiconductor device, and method of reliability simulation
01/24/2002US20020008249 Compound semiconductor device
01/24/2002US20020008248 Compound semiconductor device and method of manufacturing the same
01/24/2002US20020008247 Single-control monolithic component for a composite bridge
01/24/2002US20020008246 Fast recovery diode and method for its manufacture
01/24/2002US20020008245 Semiconductor devices with selectively doped iii-v nitride layers
01/24/2002US20020008241 Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlayer structure
01/24/2002US20020008240 Electro-optical device, method for making the same, and electronic apparatus
01/24/2002US20020008239 Substrate device, method of manufacturing the same, and electro-optical device
01/24/2002US20020008237 Schottky diode having increased forward current with improved reverse bias characteristics and method of fabrication
01/24/2002US20020008236 Electronic device, and method of patterning a first layer
01/24/2002US20020008235 Integrated circuit with test mode, and test configuration for testing an integrated circuit
01/24/2002US20020008234 Mixed-signal semiconductor structure, device including the structure, and methods of forming the device and the structure
01/24/2002US20020008227 Multilayer coating
01/24/2002US20020008224 Semiconductor device
01/24/2002US20020008222 Manufacturing process for the integration in a semiconductor chip of an integrated circuit including a high-density integrated circuit components portion and a high-performance logic integrated circuit components portion
01/24/2002US20020008209 Electron-beam sources exhibiting reduced spherical aberration, and microlithography apparatus comprising same
01/24/2002US20020008208 Ion beam apparatus and sample processing method
01/24/2002US20020008207 Charged-particle beam exposure apparatus, charged-particle beam exposure method, control data determination method, and device manufacturing method using this method
01/24/2002US20020008132 Bump joining method
01/24/2002US20020008131 Apparatus for making wire connections
01/24/2002US20020008099 Method and apparatus for reducing contamination in a wafer loadlock of a semiconductor wafer processing system
01/24/2002US20020008098 Process and device for the heat treatment of semiconductor wafers
01/24/2002US20020008088 Plasma processing apparatus having permeable window covered with light shielding film
01/24/2002US20020008083 Dry etching method
01/24/2002US20020008082 Local etching apparatus and local etching method
01/24/2002US20020008080 Etching method
01/24/2002US20020008079 Dry etching method for iridium electrode
01/24/2002US20020008036 Multilayer; substrates, barrier on anode rod in tube, cyliner walls
01/24/2002US20020008034 Using alkaline electrolyte bath; uniform overcoatings
01/24/2002US20020008026 Cathode cartridge of testing device for electroplating and testing device for electroplating
01/24/2002US20020008019 Method of manufacturing semiconductor device
01/24/2002US20020008015 Multilayer; uniform adhesion
01/24/2002US20020008005 Clean room having an escalator, and method of transporting a semiconductor device therein
01/24/2002US20020007986 Material delivery system for clean room-like environments
01/24/2002US20020007965 Module tape with modules for dual-mode data carriers
01/24/2002US20020007964 Printed circuit board and electronic package using same
01/24/2002US20020007957 Gold wire for semiconductor element connection and semiconductor element connection method
01/24/2002US20020007936 Folded-fin heatsink manufacturing method and apparatus
01/24/2002US20020007915 Plasma processing apparatus
01/24/2002US20020007914 Etching and cleaning apparatus
01/24/2002US20020007912 Coolant for plasma generator
01/24/2002US20020007911 Wafer holder for semiconductor manufacturing apparatus, method of manufacturing wafer holder; and semiconductor manufacturing apparatus
01/24/2002US20020007904 Transferable resilient element for packaging of a semiconductor chip and method therefor
01/24/2002US20020007844 Cleaning processing method and cleaning processing apparatus
01/24/2002US20020007840 Roller type; supplying cleaning liquid through nozzle; for semiconductor
01/24/2002US20020007803 Apparatus and method for controlling boiling conditions of hot phosphoric acid solution with pressure adjustment
01/24/2002US20020007802 Clog resistant injection valve
01/24/2002US20020007797 Heat lamps for zone heating
01/24/2002US20020007795 Temperature control system for plasma processing apparatus
01/24/2002US20020007793 Plasma deposition device for forming thin film
01/24/2002US20020007791 Evaporation of sugar streams; carboxyalkylfructans are an alternative for polyacrylates
01/24/2002US20020007790 Atomic layer deposition (ALD) thin film deposition equipment having cleaning apparatus and cleaning method
01/24/2002US20020007779 Low defect density, self-interstitial dominated silicon
01/24/2002US20020007567 Method and apparatus for heating and cooling substrates
01/24/2002EP1145079A3 Method for determining misalignment between a reticle and a wafer
01/24/2002DE4447804C2 Conducting structure prodn. on topography of substrate
01/24/2002DE19848861A1 Herstellungsprozeß einer Halbleitervorrichtung durch Elektronenstrahllithographie Manufacturing process of a semiconductor device by electron beam lithography
01/24/2002DE10134241A1 Pattern checking of a semiconductor wafer uses a master pattern automatically positioned above wafer
01/24/2002DE10134240A1 Evaluation of semiconductor wafer structure form uses CAD and SEM line segment data
01/24/2002DE10134184A1 Relative-displacement detecting unit has first metal film formed between substrate and transmitting coil, to serve as capacitor connected by wires to drive circuit