Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2002
01/22/2002US6340326 System and method for controlled polishing and planarization of semiconductor wafers
01/22/2002US6340325 Polishing pad grooving method and apparatus
01/22/2002US6340281 Method and apparatus for positioning a disk-shaped object
01/22/2002US6340253 Resist peeling system and control method of a resist peeling solution
01/22/2002US6340112 Stepwise autorotation of wire bonding capilliary
01/22/2002US6340109 Solder bump measuring method and apparatus
01/22/2002US6340098 Chemical delivery systems and methods of delivery
01/22/2002US6340090 Substrate fixturing device
01/22/2002US6339997 Plasma processing apparatus
01/22/2002US6339955 Thickness measurement using AFM for next generation lithography
01/22/2002US6339875 Method for removing heat from an integrated circuit
01/22/2002CA2232796C Thin film forming process
01/22/2002CA2077720C Process of forming electrical connections between conductive layers using thermosonic wire bonded bump vias and thick film techniques
01/21/2002CA2353338A1 Folded-fin heat sink manufacturing method and apparatus
01/21/2002CA2352088A1 High numerical aperture catadioptric lens
01/17/2002WO2002005470A2 Magnetoresistive trimming of gmr circuits
01/17/2002WO2002005360A1 Method for the production and configuration of organic field-effect transistors (ofet)
01/17/2002WO2002005353A1 Semiconductor non-volatile memory device
01/17/2002WO2002005352A2 Partially transparent photovoltaic modules
01/17/2002WO2002005349A1 Electrical passivation of silicon-containing surfaces using organic layers
01/17/2002WO2002005347A2 Electronic component and method of manufacture
01/17/2002WO2002005344A1 Method for cutting a block of material and for forming a thin film
01/17/2002WO2002005343A2 System and method for comparing electronics manufacturing data
01/17/2002WO2002005341A1 Method of manufacturing power silicon transistor
01/17/2002WO2002005340A1 Crosslinked resin and method for making oxides using same
01/17/2002WO2002005339A1 Plasma processing apparatus
01/17/2002WO2002005338A1 Cleaning gas and etching gas
01/17/2002WO2002005337A1 Mirror chamfered wafer, mirror chamfering polishing cloth, and mirror chamfering polishing machine and method
01/17/2002WO2002005336A1 Method for producing a gate for a cmos transistor structure having a channel of reduced length
01/17/2002WO2002005335A1 Single crystal wafer and solar battery cell
01/17/2002WO2002005334A1 Method for maintaining processor, method of automatically inspecting processor and method of automatically resetting processor, method for self-diagnosing software for driving processor
01/17/2002WO2002005333A2 Dual post centrifugal wafer clip for spin rinse dry unit
01/17/2002WO2002005332A2 Loadlock chamber
01/17/2002WO2002005331A2 Removable gripper pads
01/17/2002WO2002005330A2 Door assembly for sealing an opening of a chamber
01/17/2002WO2002005329A2 Chemical vapor deposition of barrier layers
01/17/2002WO2002005328A2 Pod load interface equipment adapted for implementation in a fims system
01/17/2002WO2002005327A2 Semiconductor substrate processing tool and fabrications facilities integration plate
01/17/2002WO2002005326A2 Robotic end effector provided with wafer supporting pads elastically mounted
01/17/2002WO2002005325A2 Chuck with heat exchanger and temperature control fluid
01/17/2002WO2002005323A2 Thermally processing a substrate
01/17/2002WO2002005322A2 Automatic slit/gate valve
01/17/2002WO2002005321A2 Method to isolate multi zone heater from atmosphere
01/17/2002WO2002005320A1 Storage device, especially for the intermediate storage of test wafers
01/17/2002WO2002005319A2 Component source interchange gantry
01/17/2002WO2002005318A2 High density giant magnetoresistive memory cell
01/17/2002WO2002005317A2 Method of etching tungsten or tungsten nitride electrode gates in semiconductor structures
01/17/2002WO2002005316A2 Wafer container washing apparatus
01/17/2002WO2002005315A2 System and method for improving thin films by gas cluster ion be am processing
01/17/2002WO2002005314A2 Apparatus for processing a microelectronic workpiece including a workpiece cassette inventory assembly
01/17/2002WO2002005313A2 Automated processing system
01/17/2002WO2002005312A2 Automated semiconductor immersion processing system
01/17/2002WO2002005308A2 A plasma reactor having a symmetric parallel conductor coil antenna
01/17/2002WO2002005305A1 Hot electron emission array for e-beam photolithography and display screens
01/17/2002WO2002005300A2 Feedback control of strip time to reduce post strip critical dimension variation in a transistor gate electrode
01/17/2002WO2002005298A2 Semiconductor inductor and methods for making the same
01/17/2002WO2002005286A1 Magnetic memory
01/17/2002WO2002005268A2 All metal giant magnetoresistive memory
01/17/2002WO2002005145A1 Convergence technique for model-based optical and proximity correction
01/17/2002WO2002005051A2 Apparatus and method for controlling temperature in a wafer and a device under test using integrated temperature sensitive diode
01/17/2002WO2002005034A1 Resist resin, chemical amplification type resist, and method of forming pattern with the same
01/17/2002WO2002005033A1 Method of reducing metal ion content of film-forming resins using a liquid/liquid centrifuge
01/17/2002WO2002005032A1 Method of manufacturing integrated circuit
01/17/2002WO2002005030A1 Control technique for microlithography lasers
01/17/2002WO2002005029A1 A method of illuminating a photomask using chevron illumination
01/17/2002WO2002004961A2 Self-retained spring probe
01/17/2002WO2002004887A1 Methods and apparatus for processing microelectronic workpieces using metrology
01/17/2002WO2002004886A1 Apparatus and method for processing a microelectronic workpiece using metrology
01/17/2002WO2002004774A2 Automatic door opener
01/17/2002WO2002004715A2 Deposition uniformity control for electroplating apparatus, and associated method
01/17/2002WO2002004712A2 Flow diffuser to be used in electro-chemical plating system
01/17/2002WO2002004711A2 Method and associated apparatus for tilting a substrate upon entry for metal deposition
01/17/2002WO2002004704A2 Method and apparatus for patching electrochemically deposited layers using electroless deposited materials
01/17/2002WO2002004573A2 Ready-to-use stable chemical-mechanical polishing slurries
01/17/2002WO2002004541A2 No-flow flux adhesive compositions
01/17/2002WO2002004322A2 Smif container latch mechanism
01/17/2002WO2002004311A1 Smif container including an electrostatic dissipative reticle support structure
01/17/2002WO2002004233A1 Compositions for cleaning organic and plasma etched residues for semiconductor devices
01/17/2002WO2002004176A1 Robot having independent end effector linkage motion
01/17/2002WO2002004171A1 Method and apparatus for heating a polishing block
01/17/2002WO2002004136A1 Dual cassette centrifugal processor
01/17/2002WO2002004134A1 Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices
01/17/2002WO2001078127A3 A method of improving adhesion of a cap layer to a porous material layer on a wafer
01/17/2002WO2001052320A3 A method for requesting trace data reports from fault detection controlled semiconductor fabrication processes
01/17/2002WO2001050198A3 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows
01/17/2002WO2001043170A3 Dynamic brake for non-contact wafer holder
01/17/2002WO2001040943A3 A system, method and apparatus pertaining to flexible selection scan test
01/17/2002WO2001039256A3 Method for producing an insulation collar in a trench capacitor
01/17/2002WO2001033240A3 High resolution skew detection apparatus and method
01/17/2002WO2001032951A3 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates
01/17/2002WO2001024234A3 A method for cleaning and treating a semiconductor wafer after chemical mechanical polishing
01/17/2002WO2001020647A3 Novel chip interconnect and packaging deposition methods and structures
01/17/2002WO2001018860A3 Improved apparatus and methods for integrated circuit planarization
01/17/2002WO2000060645A3 Dual cmp pad conditioner
01/17/2002WO2000051168A3 Slurry delivery control apparatus and method
01/17/2002US20020007481 Apparatus and method of correcting layout pattern data, method of manufacturing semiconductor devices and recording medium
01/17/2002US20020007259 Method of creating reference data table
01/17/2002US20020007258 Semi-physical modeling of HEMT high frequency small signal equivalent circuit models
01/17/2002US20020007227 Multiple head dispensing system and method
01/17/2002US20020007042 Die attach adhesives for use in microelectronic devices