Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2002
01/17/2002US20020004980 Assembly apparatus and assembly method of electronic appliances and display devices
01/17/2002US20020004962 Substrate cleaning apparatus and cleaning member
01/17/2002DE10132368A1 Wafer-Poliervorrichtung The wafer polishing apparatus
01/17/2002DE10127382A1 Solarzelle und Verfahren zu deren Herstellung Solar cell and process for their preparation
01/17/2002DE10121502A1 Verfahren zum Teilen eines Halbleiterwafers A method for dividing a semiconductor wafer
01/17/2002DE10111200A1 Halbleiterbauelement Semiconductor device
01/17/2002DE10103307A1 Semiconductor integrated circuit includes sub and main reset signal generator system
01/17/2002DE10032792A1 Verfahren zur Herstellung einer Verdrahtung für Kontaktlöcher A process for producing a wiring for contact holes
01/17/2002DE10032389A1 Radio or television signal receiver has high frequency circuit comprising discrete semiconductor device with planar varicap diode and integrated pre-resistor
01/17/2002DE10032322A1 Method for finding combination of operation/tool causing integrated failure in semiconductor manufacturing device, involves generating a candidate-operation/tool list
01/17/2002DE10032283A1 Separating device for work piece carrier e.g. for semiconductor wafers, influences adhesive properties of connecting layer to carrier for release of work piece
01/17/2002DE10032279A1 Device for chemically passivating edge defects in silicon solar cells comprises applying a suitable etching solution containing alkaline components, and allowing the reaction to slowly take its course on the edge of the cell
01/17/2002DE10031781A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation
01/17/2002DE10031524A1 Method for separating semiconductor chips from wafer, involves initially scribing separation lines on wafer by laser beam
01/17/2002DE10031204A1 Systemträger für Halbleiterchips und elektronische Bauteile sowie Herstellungsverfahren für einen Systemträger und für elektronische Bauteile Support system for semiconductor chips and electronic components and manufacturing method for a system and support for electronic components
01/17/2002DE10031139A1 Method for mounting and demounting semiconductor plates, e.g. for polishing, involves forming easily breakable joint using filler-containing resin-based cement with temperature-dependent adhesive-brittle properties
01/17/2002DE10030443A1 Production of a heat deviating surface of a component used in the production of a semiconductor element comprises inserting trenches into the component using an etching process
01/17/2002DE10030391A1 Anschlussfläche für sublithographische Halbleiterstrukturen und Verfahren zu deren Herstellung Sublithographic pad for semiconductor structures and methods for their preparation
01/17/2002DE10030234A1 Integrierter Speicher mit Speicherzellen mit magnetoresistivem Speichereffekt Integrated memory having memory cells with a magnetoresistive memory effect
01/17/2002DE10029269A1 Electronic component used as semiconductor component comprises a housing and a first substrate having at least one integrated circuit with contact surfaces connected to electrodes of the parts of the component via conducting pathways
01/17/2002DE10029072A1 Halbleiterbauelement und entsprechendes Herstellungsverfahren Semiconductor component and corresponding production method
01/16/2002EP1172867A2 Method for producing P-Type Gallium Nitride-Based compound semiconductor, method for producing Gallium Nitride-Based compound semiconductor light-emitting device, and gallium nitride-based compound semiconductor light-emitting device
01/16/2002EP1172862A1 Power diode and method of maufacturing a power diode
01/16/2002EP1172861A2 Nonvolatile semiconductor memory device and method for fabricating the same
01/16/2002EP1172860A2 Hemt device with a buffer to channel insert layer
01/16/2002EP1172859A2 Partially relaxed channel HEMT device
01/16/2002EP1172858A1 Semiconductor device
01/16/2002EP1172856A1 Nonvolatile semiconductor memory device and method for fabricating the same
01/16/2002EP1172855A2 Integrated semiconductor memory with memory cells in a plurality of memory cell arrays and method of repairing said memory
01/16/2002EP1172854A2 Semiconductor memory with random access
01/16/2002EP1172851A2 Semiconductor device having heat spreader attached thereto and method of manufacturing the same
01/16/2002EP1172849A2 Method of manufacturing a plurality of chips comprising semiconductor devices which include a layer of defined electrical polarization
01/16/2002EP1172848A1 Integrated semiconductor structure
01/16/2002EP1172847A2 A method to produce a porous oxygen-silicon layer
01/16/2002EP1172846A2 Method of plasma depositing a low dielecric constant insulating film on a copper surface
01/16/2002EP1172845A2 Method for treating dielectric layers with low dielectric constant to reduce oxygen diffusion
01/16/2002EP1172844A2 Substrate cleaning method and substrate cleaning apparatus
01/16/2002EP1172843A2 Material handling system and methods for a multichamber plasma treatment system
01/16/2002EP1172842A2 Coating station for disk-type workpieces
01/16/2002EP1172838A2 Biased shield in a magnetron sputter reactor
01/16/2002EP1172837A2 Electron beam lithography method and electron-optical lithography device
01/16/2002EP1172823A1 Porous materials
01/16/2002EP1172742A2 Method of creating reference data table
01/16/2002EP1172695A1 Barrier layer
01/16/2002EP1172694A1 Polymeric compound for photoresist and resin composition for photoresist
01/16/2002EP1172692A2 Phase shift mask blank, phase shift mask, and methods of manufacture
01/16/2002EP1172680A2 Method for coating micro-electromechanical systems (MEMS)
01/16/2002EP1172464A1 Method of producing a single crystal gallium nitride substrate and single crystal gallium nitride substrate
01/16/2002EP1172458A2 Components peripheral to the pedestal in the gas flow path within a chemical vapor deposition chamber
01/16/2002EP1172457A1 Thin film formation method
01/16/2002EP1172182A2 Traction drive speed reducer, conveyance apparatus using traction drive speed reducer, and arrangement of two axis output encoder in conveyance apparatus
01/16/2002EP1171920A1 Electrically programmable memory element with improved contacts
01/16/2002EP1171917A1 Integrated circuit comprising an inductor which prevents latch-up and a method for its manufacture
01/16/2002EP1171916A1 Integrated circuit with removable esd protection
01/16/2002EP1171913A1 Damascene structure and method for forming a damascene structure
01/16/2002EP1171912A1 Method for the vertical integration of electric components by
01/16/2002EP1171911A1 Lead frame moisture barrier for molded plastic electronic packages
01/16/2002EP1171910A2 Manufacture of trench-gate semiconductor devices
01/16/2002EP1171909A1 Method and pressure jetting machine for processing a semiconductor wafer
01/16/2002EP1171908A1 Method for removing residues with reduced etching of oxide
01/16/2002EP1171907A1 Method of performing plasma warm-up on semiconductor wafers
01/16/2002EP1171906A1 Method for cmp of low dielectric constant polymer layers
01/16/2002EP1171905A1 Silicon fixtures for wafer processing and method of fabrication
01/16/2002EP1171839A1 Assistance method and apparatus
01/16/2002EP1171802A1 Novel photosensitive resin compositions
01/16/2002EP1171801A1 Novel photosensitive polybenzoxazole precursor compositions
01/16/2002EP1171800A1 Stamp for use in a lithographic process, method of manufacturing a stamp, and method of manufacturing a patterned layer on a substrate
01/16/2002EP1171774A2 Interface independent test system
01/16/2002EP1171653A1 Slicing of single-crystal films using ion implantation
01/16/2002EP1171644A1 Method and apparatus for controlling polymerized teos build-up in vacuum pump lines
01/16/2002EP1171379A2 Method for producing high-purity solutions using gaseous hydrogen fluoride
01/16/2002EP1171376A1 Chemical delivery systems and methods of delivery
01/16/2002EP1171264A1 Method of conditioning wafer polishing pads
01/16/2002EP1171211A1 Efg crystal growth apparatus
01/16/2002EP1082884B1 Method for producing wirings having solder bumps
01/16/2002EP1066416A4 Passivating etchants for metallic particles
01/16/2002EP1064560B1 Compensating for the effects of round-trip delay in automatic test equipment
01/16/2002EP0946977B1 Multiple local oxidation for surface micromachining
01/16/2002EP0946780B1 Vacuum treatment equipment
01/16/2002EP0823977B1 Lithopraphic apparatus for step-and-scan imaging of a mask pattern
01/16/2002EP0821987B1 Method of controlling crystallisation of organic compounds and use of solid-state component in said method
01/16/2002EP0733269B1 Porous semiconductor material
01/16/2002EP0686308B1 High saturation current, low leakage current fermi threshold field effect transistor
01/16/2002CN2472455Y Packing device for image sensor
01/16/2002CN2472342Y Tray for carrying spherical grating arrays
01/16/2002CN1331840A Method of making semiconductor device including asymmetrical field-effect transistor
01/16/2002CN1331839A Device for processing substrates
01/16/2002CN1331838A Method for storing carrier for polishing wafer
01/16/2002CN1331837A Combination CMP-etch method for forming thin planar layer over surface of device
01/16/2002CN1331835A Method for precise molding and alignment of structures on substrate using stretchable mold
01/16/2002CN1331813A Method and appts. for controlling system using hierarchical state machines
01/16/2002CN1331733A Slurries of abrasive inorganic oxide particles and method for adjusting abrasiveness of particles
01/16/2002CN1331512A Mfg. method of electronic components
01/16/2002CN1331495A Horizontal semiconductor device
01/16/2002CN1331493A Ultra-small integrated circuit of inductive component including high quality factor
01/16/2002CN1331492A Semiconductor device protecting layer having reinforced adhesion force to polymeric material
01/16/2002CN1331491A Semiconductor integrated circuit and distributing of semiconductor integrated circuit
01/16/2002CN1331490A Substrate, displaying device, mounting of substrate and IC chip and mounting bonding method
01/16/2002CN1331489A Mfg. for 5F2 unit of gate conductor having vertical transistor and alignment burying strip
01/16/2002CN1331487A Mfg. method of semiconductor device and semiconductor device