| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/05/2002 | US6343979 Modular machine for polishing and planing substrates |
| 02/05/2002 | US6343978 Method and apparatus for polishing workpiece |
| 02/05/2002 | US6343976 Abrasive, method of polishing wafer, and method of producing semiconductor device |
| 02/05/2002 | US6343975 Chemical-mechanical polishing apparatus with circular motion pads |
| 02/05/2002 | US6343973 Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
| 02/05/2002 | US6343940 Contact structure and assembly mechanism thereof |
| 02/05/2002 | US6343905 Edge gripped substrate lift mechanism |
| 02/05/2002 | US6343823 Vacuum pickup tool |
| 02/05/2002 | US6343793 Dual channel rotary union |
| 02/05/2002 | US6343784 Device allowing the treatment of a substrate in a machine provided for the treatment of bigger substrates and a system of mounting a substrate in this device |
| 02/05/2002 | US6343779 Water distribution piping of gas-dissolved cleaning water |
| 02/05/2002 | US6343733 Wire bonding method |
| 02/05/2002 | US6343617 System and method of operation of a digital mass flow controller |
| 02/05/2002 | US6343609 Impinging the surface of the substrate with the liquid stream to remove the contaminating particles from the substrate surface when the megasonically energized liquefied gas vaporizes upon contact with the substrate surface |
| 02/05/2002 | US6343565 Flat antenna having rounded slot openings and plasma processing apparatus using the flat antenna |
| 02/05/2002 | US6343503 Module appearance inspection apparatus |
| 02/05/2002 | CA2240589C Semiconductor device with an improved lead-chip adhesion structure and lead frame to be used therefor |
| 02/05/2002 | CA2193709C Method and apparatus for ion beam transport |
| 02/05/2002 | CA2191115C Method and apparatus for capturing and removing contaminant particles from an interior region of an ion implanter |
| 02/05/2002 | CA2070839C Method for removing organic film |
| 01/31/2002 | WO2002009485A2 Flip chip package, circuit board thereof and packaging method thereof |
| 01/31/2002 | WO2002009484A2 Electrical component assembly and method of fabrication |
| 01/31/2002 | WO2002009287A2 Architecture and method for partially reconfiguring an fpga |
| 01/31/2002 | WO2002009242A2 Optical structure on compliant substrate |
| 01/31/2002 | WO2002009237A1 Method and apparatus for protecting and strengthening electrical contact interfaces |
| 01/31/2002 | WO2002009203A2 Microelectronic piezoelectric structure |
| 01/31/2002 | WO2002009199A1 IMPROVED BUFFER FOR GROWTH OF GaN ON SAPPHIRE |
| 01/31/2002 | WO2002009198A1 Etching apparatus having a confinement and guide object for gas flow of plasma and method for using same |
| 01/31/2002 | WO2002009195A1 Semiconductor arrangement with covered island and contact regions |
| 01/31/2002 | WO2002009194A1 Method and system for bonding a semiconductor chip onto a carrier using micro-pins |
| 01/31/2002 | WO2002009192A1 Semiconductor device, liquid crystal display device, el display device, semiconductor film producing method, and semiconductor device producing method |
| 01/31/2002 | WO2002009191A2 Non-volatile memory element |
| 01/31/2002 | WO2002009190A1 Transistor gate insulator layer incorporating superfine ceramic particles |
| 01/31/2002 | WO2002009189A1 Method for manufacturing hetero junction bipolar transistor |
| 01/31/2002 | WO2002009188A1 Strain-engineered, self-assembled, semiconductor quantum dot lattices |
| 01/31/2002 | WO2002009187A2 Heterojunction tunneling diodes and process for fabricating same |
| 01/31/2002 | WO2002009186A2 Field effect transistor |
| 01/31/2002 | WO2002009184A2 Capacitively coupled dtmos on soi for multiple devices |
| 01/31/2002 | WO2002009183A1 Schottky diode having increased active surface area and method of fabrication |
| 01/31/2002 | WO2002009178A2 Semiconductor device and a process for forming the same |
| 01/31/2002 | WO2002009177A2 Power mosfet and method for forming same using a self-aligned body implant |
| 01/31/2002 | WO2002009176A2 Method for applying adjusting marks on a semiconductor disk |
| 01/31/2002 | WO2002009175A2 Self-assembled electrical networks |
| 01/31/2002 | WO2002009174A1 Schottky diode having increased active surface area with improved reverse bias characteristics and method of fabrication |
| 01/31/2002 | WO2002009173A2 Method of forming copper interconnect capping layers with improved interface and adhesion |
| 01/31/2002 | WO2002009172A1 Workpiece holding mechanism |
| 01/31/2002 | WO2002009171A1 Ceramic substrate for semiconductor manufacture/inspection apparatus, ceramic heater, electrostatic clampless holder, and substrate for wafer prober |
| 01/31/2002 | WO2002009170A2 Method and apparatus for performing final critical dimension control |
| 01/31/2002 | WO2002009168A1 Curved chip on rigid support to be mounted removable on an appliance |
| 01/31/2002 | WO2002009167A2 High dielectric constant metal silicates formed by controlled metal-surface reactions |
| 01/31/2002 | WO2002009166A1 Method for manufacturing semiconductor device, substrate treater, and substrate treatment system |
| 01/31/2002 | WO2002009165A1 Work polishing method |
| 01/31/2002 | WO2002009164A1 Method of determining heat treatment conditions |
| 01/31/2002 | WO2002009162A2 Heated substrate support assembly and method |
| 01/31/2002 | WO2002009161A2 Process for cleaning ceramic articles |
| 01/31/2002 | WO2002009159A2 Thin-film metallic oxide structure and process for fabricating same |
| 01/31/2002 | WO2002009157A2 Alkali earth metal oxide gate insulators |
| 01/31/2002 | WO2002009156A1 Temperature-controlled thermal platform for automated testing |
| 01/31/2002 | WO2002009155A2 Wafer chuck having with interleaved heating and cooling elements |
| 01/31/2002 | WO2002009154A1 Apparatus for controlling refrigerant temperature in coolers of semiconductor device manufacturing systems |
| 01/31/2002 | WO2002009153A2 Method of fabricating integrated circuits, providing improved so-called 'saw bow' conductive tracks |
| 01/31/2002 | WO2002009151A2 Magnetoresistive structure |
| 01/31/2002 | WO2002009150A2 Semiconductor structure for use with high-frequency signals |
| 01/31/2002 | WO2002009149A2 Post deposition sputtering |
| 01/31/2002 | WO2002009148A2 Integrated radiation emitting system and process for fabricating same |
| 01/31/2002 | WO2002009147A2 High pressure processing chamber for semiconductor substrate |
| 01/31/2002 | WO2002009135A2 Immersion lens with magnetic shield for charged particle beam system |
| 01/31/2002 | WO2002009131A2 Semiconductor element comprising a sequence of layers for converting acoustic or thermal signals and electrical voltage changes into each other and method for producing the same |
| 01/31/2002 | WO2002009126A2 Spin valve structure |
| 01/31/2002 | WO2002008836A2 Method and device for thermally treating a photoresist layer on a circuit substrate, especially a semiconductor wafer |
| 01/31/2002 | WO2002008835A2 High-resolution overlay alignment methods and systems for imprint lithography |
| 01/31/2002 | WO2002008834A1 Radiation sensitive compositions containing image quality and profile enhancement additives |
| 01/31/2002 | WO2002008833A1 Photoacid generators, photoresist compositions containing the same and patterning method with the use of the compositions |
| 01/31/2002 | WO2002008832A2 Method for an improved developing process in wafer photolithography |
| 01/31/2002 | WO2002008831A2 Reticle storage and retrieval system |
| 01/31/2002 | WO2002008824A1 Method for manufacturing tft array substrate of liquid crystal display device |
| 01/31/2002 | WO2002008774A1 Probe driving method, and probe apparatus |
| 01/31/2002 | WO2002008500A2 In situ regrowth and purification of crystalline thin films |
| 01/31/2002 | WO2002008487A1 Spatially programmable microelectronics process equipment using segmented gas injection showerhead with exhaust gas recirculation |
| 01/31/2002 | WO2002008485A2 Method for vapour deposition of a film onto a substrate |
| 01/31/2002 | WO2002008308A1 Compositions and methods for thermosetting molecules in organic compositions |
| 01/31/2002 | WO2002007962A1 Carrier tape |
| 01/31/2002 | WO2002007931A2 Multi-chamber carrier head with a flexible membrane |
| 01/31/2002 | WO2002007927A1 Laser cutting of semiconductor materials |
| 01/31/2002 | WO2002007926A1 Method and apparatus for removing minute particles from a surface |
| 01/31/2002 | WO2002007925A1 Method and apparatus for removal of minute particles from a surface using thermophoresis to prevent particle redeposition |
| 01/31/2002 | WO2001082470A3 Voltage limiting bias circuit for reduction of hot electron degradation effects in mos cascode circuits |
| 01/31/2002 | WO2001076071A3 High voltage cmos signal driver system and method |
| 01/31/2002 | WO2001075945A3 Ferroelectric integrated circuit having hydrogen barrier layer |
| 01/31/2002 | WO2001075891A3 Current conveyor and method for readout of mtj memories |
| 01/31/2002 | WO2001074533A3 Methods for performing wafer preparation operations on vertically oriented semiconductor wafers |
| 01/31/2002 | WO2001072473A3 Carrier head with controllable edge pressure |
| 01/31/2002 | WO2001071765A3 Plasma reactor with overhead rf electrode tuned to the plasma |
| 01/31/2002 | WO2001070873A3 Nanocylinder arrays |
| 01/31/2002 | WO2001070867A3 Flame retardant epoxy molding compositions |
| 01/31/2002 | WO2001069131A3 Chamber cleaning mechanism |
| 01/31/2002 | WO2001061745A3 Surface passivation method and arrangement for measuring the lifetime of minority carriers in semiconductors |
| 01/31/2002 | WO2001057914A3 Process of manufacturing a semiconductor device including a buried channel field effect transistor |
| 01/31/2002 | WO2001050505A3 A microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
| 01/31/2002 | WO2001050415A3 Flip-chip mounted integrated circuit card element |