| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/07/2002 | WO2002011187A2 Method and apparatus for depositing a tantalum-containing layer on a substrate |
| 02/07/2002 | WO2002011186A2 Change kit-insert or socket-insert for ic packages |
| 02/07/2002 | WO2002011185A2 Method of polishing a semiconductor wafer |
| 02/07/2002 | WO2002011184A1 Mobile holder for a wafer |
| 02/07/2002 | WO2002011183A2 Shape accuracy improvement using a novel calibration approach |
| 02/07/2002 | WO2002011182A2 Fine pattern drawing method |
| 02/07/2002 | WO2002011175A1 Methods to predict and correct resist heating during lithography |
| 02/07/2002 | WO2002011166A2 Quartz glass jig for processing apparatus using plasma |
| 02/07/2002 | WO2002011149A1 Defect analysis method, defect analyzer, and computer program product |
| 02/07/2002 | WO2002011147A2 Integrated circuit with a temperature sensor |
| 02/07/2002 | WO2002011145A2 Method for producing a multi-bit memory cell |
| 02/07/2002 | WO2002010995A2 Module for generating circuits for analysing bit strings inside data cells, method for generating this type of circuit and relative circuit |
| 02/07/2002 | WO2002010858A2 Process for manufacturing a microelectronic device |
| 02/07/2002 | WO2002010785A2 Hierarchical design and test method and system, program product embodying the method and integrated circuit produced thereby |
| 02/07/2002 | WO2002010729A1 In-situ method and apparatus for end point detection in chemical mechanical polishing |
| 02/07/2002 | WO2002010721A2 Methods for high-precision gap and orientation sensing between a transparent template and substrate for imprint lithography |
| 02/07/2002 | WO2002010651A1 Pull-up chamber |
| 02/07/2002 | WO2002010480A2 Etching composition and use thereof with feedback control of hf in beol clean |
| 02/07/2002 | WO2002010475A1 Ring-shaped high-density plasma source and method |
| 02/07/2002 | WO2002010472A1 Method for forming film |
| 02/07/2002 | WO2002010420A2 Silicatein-mediated synthesis of amorphous silicates and siloxanes and use thereof |
| 02/07/2002 | WO2002009936A1 Lead-free alloys with improved wetting properties |
| 02/07/2002 | WO2002009907A1 Method of chemical mechanical polishing |
| 02/07/2002 | WO2002009906A1 Apparatus and method for chemical mechanical polishing of substrates |
| 02/07/2002 | WO2002009884A2 Methods for the lithographic deposition of materials containing nanoparticles |
| 02/07/2002 | WO2001084683A3 In-line gas ionizer and method |
| 02/07/2002 | WO2001084618A3 Method and mould for encapsulating electronic circuit carriers by injection moulding |
| 02/07/2002 | WO2001084469A8 Semi-physical modeling of hemt high frequency small-signal equivalent circuit models |
| 02/07/2002 | WO2001082329A3 Highly efficient compact capacitance coupled plasma reactor/generator and method |
| 02/07/2002 | WO2001080308A3 Method for cutting out at least a thin layer in a substrate or ingot, in particular made of semiconductor material(s) |
| 02/07/2002 | WO2001080286A3 Deposited thin films and their use in separation and sarcrificial layer applications |
| 02/07/2002 | WO2001078140A3 Chip carrier, relative manufacturing process, and electronic component incorporating such a carrier |
| 02/07/2002 | WO2001078128A3 Abrasive-free metal cmp in passivation domain |
| 02/07/2002 | WO2001075961A8 Chip scale surface mounted device and process of manufacture |
| 02/07/2002 | WO2001075189A3 Cleaning of a plasma processing system silicon roof |
| 02/07/2002 | WO2001074536A3 Carrier head providing uniform upward and downward force on a wafer |
| 02/07/2002 | WO2001074534A3 A workpiece carrier with adjustable pressure zones and barriers |
| 02/07/2002 | WO2001071802A3 Use of organic spin on materials as a stop-layer for local interconnect, contact and via layers |
| 02/07/2002 | WO2001067511A3 Method of forming a stacked-die integrated circuit chip package on a wafer level |
| 02/07/2002 | WO2001065895A3 Electrically controlled plasma uniformity in a high density plasma source |
| 02/07/2002 | WO2001063654A3 Methods of forming a plurality of semiconductor layers using trench arrays |
| 02/07/2002 | WO2001062062A3 Component mounting apparatus and component mounting method, and recognition apparatus for component mount panel, component mounting apparatus for liquid crystal panel, and component mounting method for liquid crystal panel |
| 02/07/2002 | WO2001050535A3 Field effect transistor structure with partially isolated source/drain junctions and methods of making same |
| 02/07/2002 | WO2001047002A3 Pendeoepitaxial gallium nitride layers grown on weak posts |
| 02/07/2002 | WO2001047000A3 Thin capacitive structures and methods for making the same |
| 02/07/2002 | WO2001045134A3 Method and apparatus for producing uniform process rates |
| 02/07/2002 | WO2001037621A3 Method for producing a support element for an integrated circuit (ic) component |
| 02/07/2002 | WO2001001454A9 Atmospheric wafer transfer module with nest for wafer transport robot and method of implementing same |
| 02/07/2002 | WO2000062335A9 Multi-layer wafer fabrication |
| 02/07/2002 | US20020016952 Block based design methodology |
| 02/07/2002 | US20020016951 Method of designing DRAM macro-cell and arrangement template therefor |
| 02/07/2002 | US20020016950 Signal delay time calculation method of semiconductor integrated circuit and computer program product for executing the method |
| 02/07/2002 | US20020016948 Method and configuration for verifying a layout of an integrated circuit and application thereof for fabricating the integrated circuit |
| 02/07/2002 | US20020016932 Semiconductor integrated circuit and semiconductor apparatus system |
| 02/07/2002 | US20020016894 Processing apparatus, integrated circuit and integrated circuit package |
| 02/07/2002 | US20020016693 Method for fabricating and checking structures of electronic circuits in a semiconductor substrate |
| 02/07/2002 | US20020016650 Robot alignment system and method |
| 02/07/2002 | US20020016646 Method of aligning dies of wafer(s) with exposure equipment in the fabricating of semiconductor devices |
| 02/07/2002 | US20020016477 Novel lactone compounds having alicyclic structure and their manufacturing method |
| 02/07/2002 | US20020016414 Low dielectric constant organic dielectrics based on cage-like structures |
| 02/07/2002 | US20020016408 Polyimide silicone resin, its solution composition, and polyimide silicone resin film |
| 02/07/2002 | US20020016306 Coupling arrays of metal, alloy, semiconductor or magnetic clusters scaffold comprising, for example, polynucleotides and/or polypeptides |
| 02/07/2002 | US20020016275 Aqueous dispersion for chemical mechanical polishing used for polishing of copper |
| 02/07/2002 | US20020016273 Dilute cleaning composition and method for using same |
| 02/07/2002 | US20020016272 Cleaning agent for a semi-conductor substrate |
| 02/07/2002 | US20020016145 Polishing pad and method for manufacturing the same |
| 02/07/2002 | US20020016139 Polishing tool and manufacturing method therefor |
| 02/07/2002 | US20020016135 Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers |
| 02/07/2002 | US20020016085 Method and apparatus for treating low k dielectric layers to reduce diffusion |
| 02/07/2002 | US20020016084 Chemical vapor deposition of a precursor comprised of one or more N-Si chemical bonds such as trisilylamine, or a mixture comprised of a N-containing chemical precursor and a Si-containing chemical precursor |
| 02/07/2002 | US20020016083 Method for manufacturing a field effect transistor |
| 02/07/2002 | US20020016082 Method and apparatus for liquid-treating and drying a substrate |
| 02/07/2002 | US20020016081 Methods for fabricating a semiconductor chip having CMOS devices and fieldless array |
| 02/07/2002 | US20020016080 Two etchant etch method |
| 02/07/2002 | US20020016079 Enhanced etching/smoothing of dielectric surfaces |
| 02/07/2002 | US20020016078 Exposing said surface to a gaseous plasma, containing only argon, for a period of time, thereby reducing said thickness and removing said micro-scratches; depositing a layer of a second material to a thickness whereby layer is restored |
| 02/07/2002 | US20020016077 Method of manufacturing a contact hole of a semiconductor device |
| 02/07/2002 | US20020016076 Method of cleaning substrate and method of manufacturing semiconductor device |
| 02/07/2002 | US20020016074 Apparatus and method for polishing substrate |
| 02/07/2002 | US20020016073 Methods of polishing, interconnect-fabrication, and producing semiconductor devices |
| 02/07/2002 | US20020016072 Method of manufacturing semiconductor wafer |
| 02/07/2002 | US20020016071 Metal layer; an inorganic dielectric antireflection coating (ARC) layer (especially silicon oxynitride) disposed on the metal layer; and a photoresist layer disposed on the ARC layer opposite the metal layer. |
| 02/07/2002 | US20020016070 Power pads for application of high current per bond pad in silicon technology |
| 02/07/2002 | US20020016069 Method of forming substrate |
| 02/07/2002 | US20020016068 Method and its apparatus for detecting floating particles in a plasma processing chamber and an apparatus for processing a semiconductor device |
| 02/07/2002 | US20020016067 Method of cleaning porous body, and process for producing porous body, non-porous film or bonded substrate |
| 02/07/2002 | US20020016066 Method and apparatus for detecting polishing endpoint with optical monitoring |
| 02/07/2002 | US20020016064 Method of manufactuing a semiconductor device |
| 02/07/2002 | US20020016063 Second barrier layer has a denser structure and is less water absorptive compared to the first barrier; titanium nitride |
| 02/07/2002 | US20020016062 Semiconductor device with improved UMOS-structure |
| 02/07/2002 | US20020016061 Method of forming a metal line in a semiconductor device |
| 02/07/2002 | US20020016059 Method of manufacturing a semiconductor device, and a semiconductor device manufactured thereby |
| 02/07/2002 | US20020016058 Microelectronic air-gap structures and methods of forming the same |
| 02/07/2002 | US20020016057 Fill composition including a polymer binder and a solvent system; is least 70% removed from the base material when subjected to a pre-bake thermal stability test; less than about 15% shrinkage; applying to bottom and sidewalls |
| 02/07/2002 | US20020016053 Methods of forming contacts,methods of contacting lines,methods of operating integrated circuitry , and integrated circuits |
| 02/07/2002 | US20020016052 Method of forming a conductive coating on a semiconductor device |
| 02/07/2002 | US20020016051 Method for manufacturing semiconductor device, substrate treatment method, and semiconductor manufacturing apparatus |
| 02/07/2002 | US20020016050 Heat-up time reduction before metal deposition |
| 02/07/2002 | US20020016049 Process for producing a doped semiconductor substrate |
| 02/07/2002 | US20020016048 Method for manufacturing semiconductor thin film, and magnetoelectric conversion element provided with semiconductor thin film thereby manufactured |