Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2002
02/14/2002US20020019090 Method of manufacturing semiconductor device including a step of forming a silicide layer, and semiconductor device manufactured thereby
02/14/2002US20020019089 Method of manufacturing a semiconductor device
02/14/2002US20020019088 Forming a film or layer having at least two phases, at least one of which is electroconductive, and removing one of the phases that is not conductive; ruthenium oxide, annealing to form ruthenium phases, removing ruthenium phases
02/14/2002US20020019087 Method of forming a stack of refractory metal nitride over refractory metal silicide over silicon
02/14/2002US20020019086 Method for fabricating a semiconductor device
02/14/2002US20020019085 Method of forming a gate oxide layer with an improved ability to resist the process damage
02/14/2002US20020019084 Process for forming power MOSFET device in float zone, non-epitaxial silicon
02/14/2002US20020019083 Method of fabricating a silicon-on-insulator system with thin semiconductor islets surrounded by an insulative material
02/14/2002US20020019082 Method for fabricating a thin film transistor display
02/14/2002US20020019081 Comprises depositing on the substrate at least one layer of semiconductor material, wherein the substrate comprises a polyphenylene polyimide, derived from biphenyl-3,3',4,4'-tetracarboxylic acid and 1,6-hexanediamine
02/14/2002US20020019080 Method and apparatus for reducing BGA warpage caused by encapsulation
02/14/2002US20020019075 Methods of forming a circuit and methods of preparing an integrated circuit
02/14/2002US20020019074 Chip pickup device and method of manufacturing semiconductor device
02/14/2002US20020019073 Method for manufacturing a dual chip package
02/14/2002US20020019072 Electronic device, method of manufacturing the same, and apparatus for manufacturing the same
02/14/2002US20020019070 Manufacturing process of integrated semiconductor light sensor device
02/14/2002US20020019069 Optical element and method of manufacturing the same, and electronic instrument
02/14/2002US20020019067 Method and apparatus for endpointing a chemical-mechanical planarization process
02/14/2002US20020019066 Semiconductor device manufacturing method
02/14/2002US20020019063 Capable of suppressing the electric charge in a semiconductor layer of a silicon on insulator(SOI) substrate at time of ion implantation, preventing gate oxide or buried oxide(BOX) layer from damage
02/14/2002US20020019050 Hybrid microorganism for use in gene therapy
02/14/2002US20020018965 Methods for reducing profile variation in photoresist trimming
02/14/2002US20020018960 High etching resistance, heat resistance and adhesiveness; low ultraviolet light absorbance; can be developed in aqueous tetramethylammonium hydroxide solution; for fabricating circuits for high integration semiconductors
02/14/2002US20020018941 Lithography; thin film covering pattern of absorptive material
02/14/2002US20020018904 Ferroelectric
02/14/2002US20020018896 Composite metallic ultrafine particles and process for producing the same
02/14/2002US20020018881 Substrate for use in display element, method of manufacturing the same, and apparatus for manufacturing the same
02/14/2002US20020018862 Method of annealing large area glass substrates
02/14/2002US20020018861 Methods for the lithographic deposition of materials containing nanoparticles
02/14/2002US20020018859 Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas
02/14/2002US20020018755 Dental acid etchant composition and method of use
02/14/2002US20020018703 Semiconductor manufacturing apparatus with an improved wafer cassette
02/14/2002US20020018599 Mask data correction apparatus, fourier transformation apparatus, up sampling apparatus, down sampling apparatus, method of manufacturing transfer mask, and method of manufacturing device having pattern structure
02/14/2002US20020018591 Bump inspection apparatus and method
02/14/2002US20020018377 Method for increasing the trench capacitance
02/14/2002US20020018364 Non-volatile semiconductor memory device and fabricating method thereof
02/14/2002US20020018361 Method for nondestructively reading memory cells of an mram memory
02/14/2002US20020018360 Integrated memory having memory cells with a magnetoresistive storage effect
02/14/2002US20020018357 Ferroelectric memory device and method of manufacturing the same
02/14/2002US20020018356 Memory configuration including a plurality of resistive ferroelectric memory cells
02/14/2002US20020018338 Insert molded heat sink assembly
02/14/2002US20020018328 Protection circuit of field effect transistor and semiconductor device
02/14/2002US20020018309 Mirror projection system for a scanning lithographic projection apparatus, and lithographic apparatus comprising such a system
02/14/2002US20020018217 Optical critical dimension metrology system integrated into semiconductor wafer process tool
02/14/2002US20020018207 Alignment method, alignment apparatus, profiler, exposure apparatus, exposure apparatus maintenance method, semiconductor device manufacturing method, and semiconductor manufacturing factory
02/14/2002US20020018206 Semiconductor structures and manufacturing methods
02/14/2002US20020018197 Illumination system and scanning exposure apparatus using the same
02/14/2002US20020018195 Moving mechanism in exposure apparatus, and exposure apparatus having the same
02/14/2002US20020018194 Lithographic projection apparatus and device manufacturing method
02/14/2002US20020018192 Stage apparatus, scanning type exposure apparatus, and device produced with the same
02/14/2002US20020018191 Exposure apparatus and method of controlling the same
02/14/2002US20020018190 Exposure apparatus and device manufacturing method
02/14/2002US20020018189 Lithographic apparatus, device manufacturing method, and device manufactured thereby
02/14/2002US20020018025 Power supply antenna and power supply method
02/14/2002US20020017941 Semiconductor integrated circuit
02/14/2002US20020017916 Termperature-controlled semiconductor wafer chuck system
02/14/2002US20020017915 Probe card, probe card restoring method, and probe card manufacturing method
02/14/2002US20020017913 Electro-optic sampling probe
02/14/2002US20020017911 Shape accuracy improvement using a novel calibration approach
02/14/2002US20020017910 Substrate processing device and method
02/14/2002US20020017889 Exposure apparatus and method utilizing isolated reaction frame
02/14/2002US20020017738 Resin sealing method and resin sealing apparatus
02/14/2002US20020017730 Semiconductor device
02/14/2002US20020017728 Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials
02/14/2002US20020017727 Method for manufacturing semiconductor device using group III nitride compound
02/14/2002US20020017726 Metal deposition process for metal lines over topography
02/14/2002US20020017725 Semiconductor device and method of forming the same
02/14/2002US20020017724 Chemical vapor deposition of titanium
02/14/2002US20020017723 Semiconductor memory device and method for the manufacture thereof
02/14/2002US20020017721 Array structure of solder balls able to control collapse
02/14/2002US20020017718 Semiconductor device and semiconductor chip for use therein
02/14/2002US20020017716 Tab tape with stiffener and semiconductor device using same
02/14/2002US20020017712 Method for fabricating a semiconductor package with a semiconductor device attached to a multilayered substrate
02/14/2002US20020017710 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
02/14/2002US20020017709 Assembly jig and manufacturing method of multilayer semiconductor device
02/14/2002US20020017708 Method for manufacturing multi-kind and small quantity semiconductor products in a mass-production line and system thereof
02/14/2002US20020017706 Lead frame, semiconductor device and manufacturing method therefor, circuit board and electronic equipment
02/14/2002US20020017704 Semiconductor device and method of manufacture
02/14/2002US20020017703 Complementary bipolar transistors and manufacturing methods thereof
02/14/2002US20020017702 Methods for manufacturing resistors using a sacrificial layer
02/14/2002US20020017701 Electrically programmable memory element with raised pore
02/14/2002US20020017698 Monolithic low dielectric constant platform for passive components and method
02/14/2002US20020017697 Semiconductor device and manufacturing method thereof
02/14/2002US20020017696 Semiconductor device with schottky electrode having high schottky barrier
02/14/2002US20020017694 Electrostatic attraction mechanism, surface processing method and surface processing device
02/14/2002US20020017692 Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration
02/14/2002US20020017691 Semiconductor device having gate electrode and method of fabricating the same
02/14/2002US20020017690 Semiconductor integrated circuit
02/14/2002US20020017689 Semiconductor device and method of manufacturing same
02/14/2002US20020017687 Semiconductor device and method for forming the same
02/14/2002US20020017686 Semiconductor integrated circuit device and manufacturing method thereof
02/14/2002US20020017685 Semiconductor device and method of fabricating thereof
02/14/2002US20020017683 High voltage semiconductor device having high breakdown voltage isolation region
02/14/2002US20020017681 Semiconductor device and method of manufacture
02/14/2002US20020017680 Non-volatile memory device and fabrication method
02/14/2002US20020017679 Semiconductor device including nonvolatile semiconductor memory devices
02/14/2002US20020017677 Semiconductor device having laminated gate structure and method for manufacturing the semiconductor device
02/14/2002US20020017676 Microelectronic structure
02/14/2002US20020017675 Nonvolatile semiconductor storage device
02/14/2002US20020017674 Capacitor structure