Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2002
02/21/2002US20020020822 Electron beam illumination apparatus, electron beam exposure apparatus, and device manufacturing method
02/21/2002US20020020820 Electron beam exposure apparatus and device manufacturing method
02/21/2002US20020020767 Showerhead and liquid raw material supply apparatus using the same
02/21/2002US20020020763 Cleaning nozzle and substrate cleaning apparatus
02/21/2002US20020020751 Substrate transfer apparatus, semiconductor manufacturing apparatus, and semiconductor device manufacturing method
02/21/2002US20020020714 Precision liquid mixing apparatus and method
02/21/2002US20020020697 Temperature control apparatus
02/21/2002US20020020696 Thermal processing apparatus
02/21/2002US20020020690 Dewatered CMP polishing compostions and methods for using same
02/21/2002US20020020650 Wafer container box
02/21/2002US20020020629 Lead frame and method of manufacturing the lead frame
02/21/2002US20020020628 A mask is in spaced relation proximite to but does not contact the top surface of a workpiece, while moving relative to it
02/21/2002US20020020627 Filling a metal such as copper in fine interconnection pattern recesses on a semiconductor
02/21/2002US20020020622 Method and apparatus for executing plural processes on a microelectronic workpiece at a single processing station
02/21/2002US20020020621 Semiconductor workpiece proximity plating apparatus
02/21/2002US20020020551 Controlled-shaped solder reservoirs for increasing the volume of solder bumps
02/21/2002US20020020523 Radiator with thin fins
02/21/2002US20020020520 Hot plate cooling system
02/21/2002US20020020499 Inductively coupled RF plasma reactor and plasma chamber enclosure structure therefor
02/21/2002US20020020498 Plasma processing apparatus and plasma processing method
02/21/2002US20020020497 Plasma processing apparatus and plasma processing method
02/21/2002US20020020496 Substrate treatment apparatus
02/21/2002US20020020495 Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
02/21/2002US20020020494 Plasma processing system and method
02/21/2002US20020020436 Condensing steam on first surface to form a liquid boundary layer, to heat the surface, ozone diffuses through the boundary layer and reacts with material on the surface, maintaining condensation of steam; cleaning wafers
02/21/2002US20020020433 Oxidation apparatus and method of cleaning the same
02/21/2002US20020020432 Method of cleaning a wafer
02/21/2002US20020020431 By providing an active substance with a charge; and providing a voltage to the wafer to attract the active substance to the wafer surface and repulse the mobile ion to the surface, to react the two and form a material separable from the wafer
02/21/2002US20020020430 Reactor for processing a workpiece using sonic energy
02/21/2002US20020020360 Silicon wafer supporting device for supporting a silicon wafer subjected to an evaporation process on its underside
02/21/2002US20020020358 Method and apparatus for improving film deposition uniformity on a substrate
02/21/2002US20020020355 Processing apparatus
02/21/2002US20020020354 Electrostatic deflector for electron beam exposure apparatus
02/21/2002US20020020353 Gas panel
02/21/2002US20020020344 Semiconductor manufacturing method, substrate processing method, and semiconductor manufacturing apparatus
02/21/2002US20020020341 Semiconductor film with graded gallium nitride layer deposited on the substrate having a varying composition of a continuous grade from an initial to a final composition formed from a precursor without interruption in the supply
02/21/2002US20020020327 Hydrolysis and condensation of silane compound in presence of water and tetraalkylammonium hydroxides, alicyclic amines, and metal hydroxides in solvent for forming dielectric layer for semiconductors
02/21/2002US20020020220 Apparatus and method for measuring internal stress of reticle membrane
02/21/2002US20020020189 Temperature adjustment apparatus
02/21/2002EP1145329A3 Semiconductor pn-junction diode, method of making the same and electronic circuit comprising the same
02/21/2002DE19549554C2 Semiconductor device for dynamic random access memory
02/21/2002DE10134500A1 Verfahren zur Herstellung eines Kondensators in einem Halbleiterbauelement A method for manufacturing a capacitor in a semiconductor device
02/21/2002DE10132777A1 Halbleiterspeichervorrichtung A semiconductor memory device
02/21/2002DE10123879A1 Substratpotential-Erfassungsschaltung und Substratpotential-Erzeugungsschaltung Substrate potential detecting circuit and the substrate potential generating circuit
02/21/2002DE10118751A1 Method for drying a manufactured object, e.g. a wafer, after the object has been immersed in a cleaning fluid comprises feeding an inert gas and a liquid having a lower surface tension than the cleaning fluid over the cleaning fluid
02/21/2002DE10116529A1 Verfahren zur Herstellung von Kondensatoren mit tiefen Gräben für Drams mit verringerter Facettierung an der Substratkante, und zur Bereitstellung einer gleichförmigeren Anschlussflächenschicht aus SI¶3¶N¶4¶ über das Substrat A process for the production of capacitors with deep trenches for DRAM having reduced faceting at the substrate edge, and to provide a more uniform connector surface layer of the substrate over SI¶3¶N¶4¶
02/21/2002DE10111722A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation
02/21/2002DE10109174A1 Verfahren zum Strukturentwurf von integrierten Halbleiterschaltungen und Vorrichtung zur Durchführung desselben A method for the same structural design of integrated semiconductor circuits and apparatus for performing
02/21/2002DE10104082A1 Halbleiterspeichervorrichtung A semiconductor memory device
02/21/2002DE10065976A1 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device
02/21/2002DE10059777A1 Device for transporting elements to be processed through high temperature zone has elongated bearer elements of flexible material held under tension along their longitudinal axes
02/21/2002DE10039482A1 Handler zum Transportieren von flachen in der Halbleiterindustrie zur Anwendung kommenden Substraten Handler for transporting flat in the semiconductor industry for the next application substrates
02/21/2002DE10039004A1 Anordnung zum Testen eines integrierten Schaltkreises Arrangement for the testing of an integrated circuit
02/21/2002DE10038998A1 Halbleiterbauelement und Verfahren zur Identifizierung eines Halbleiterbauelementes A semiconductor device and method of identifying a semiconductor device
02/21/2002DE10038728A1 Halbleiterspeicher-Zellenanordnung und Verfahren zu deren Herstellung A semiconductor memory cell arrangement and method for their preparation
02/21/2002DE10038190A1 Semiconductor structure with locally thinned substrate for control of vertically flowing current through semiconductor
02/21/2002DE10038168A1 Handling and processing machine for use in semiconductor industry comprises two storage modules containing magazines whose height can be adjusted and which are mounted on turntables, allowing disk-shaped components to be transferred
02/21/2002DE10038165A1 Wafer holder for securing wafer supporting chuck with bottom coupled carrier plate
02/21/2002DE10037976A1 Anordnung zum verlustarmen Schreiben eines MRAMs Arrangement for low-loss writing an MRAM
02/21/2002DE10037821A1 Baugruppe, insbesondere Wafer-Baugruppe Assembly, in particular wafer assembly
02/21/2002DE10037566A1 Substratheizung zum gleichzeitig beidseitigen Beheizen eines Wafers Substrate heater to heat a wafer simultaneously on both sides
02/21/2002DE10037452A1 Nachführschaltung Readjustment
02/21/2002DE10037292A1 Verfahren zur Herstellung von Anschlußsubstraten für Halbleiterkomponenten A process for the production of substrates for semiconductor connection components
02/21/2002DE10037248A1 Method used for producing a source or drain region of a transistor in a semiconductor substrate comprises growing the source or drain region doped in situ with selective epitaxy
02/21/2002CA2419930A1 Directed assembly of nanometer-scale molecular devices
02/21/2002CA2416549A1 Abrasive pad for cmp
02/20/2002EP1180800A2 Semiconductor integrated circuit device and manufacturing method thereof
02/20/2002EP1180799A2 Semiconductor memory device and method of manufacturing the same
02/20/2002EP1180797A2 Method for making capacitor electrodes
02/20/2002EP1180796A2 Trench capacitor and method of making the same
02/20/2002EP1180795A2 Method for making a first electrode and a second electrode, electronic component and electronic memory element
02/20/2002EP1180794A2 Process control for making metal/metal contacts
02/20/2002EP1180793A2 Electrostatic chuck and manufacturing method thereof
02/20/2002EP1180792A1 Semiconductor packaging
02/20/2002EP1180791A1 Method for forming a nitride layer on a semiconductor substrate
02/20/2002EP1180790A1 Fabrication of a capacitor with metal electrodes
02/20/2002EP1180789A1 Manufactoring method of a capacitor in the center of a semiconductor device and corresponding semiconductor device
02/20/2002EP1180788A1 Method for wafer position data retrieval in semiconductor wafer manufacturing
02/20/2002EP1180785A2 Means for directing a flow of gas in a substrate processing chamber
02/20/2002EP1180784A2 Method and apparatus for charged particle beam exposure
02/20/2002EP1180770A1 MRAM memory
02/20/2002EP1180726A2 Illumination system for microlithography
02/20/2002EP1180725A2 Semiconductor substrate for improving pattern formation in photolithographic process
02/20/2002EP1180554A2 Method of depositing organosilicate layers
02/20/2002EP1180553A1 CVD process for depositing copper on a barrier layer
02/20/2002EP1180486A2 Contact free conveying apparatus for transporting items
02/20/2002EP1180251A1 Wafer alignment
02/20/2002EP1180237A2 Optical inspection of semi-conductor structures
02/20/2002EP1099007B1 Susceptor for barrel reactor
02/20/2002EP1095399B1 Method for handling a plurality of circuit chips
02/20/2002EP1084402B1 Process for monitoring the concentration of metallic impurities in a wafer cleaning solution
02/20/2002EP1076732B1 Injector for reactor
02/20/2002EP0950265B1 Uniform ballast resistance for a thermally balanced radio frequency power transistor
02/20/2002EP0944921B1 Semiconductor process for making an integrated circuit with differing gate oxide thickness
02/20/2002CN2478254Y Packing structure for conforming image sensor to scan control chip
02/20/2002CN1337068A Ferroelectric memory with perroelectric thin film and method of fabrication
02/20/2002CN1337067A Method for producing a semiconductor component with wiring partly extending in the substrate and semiconductor component produced to said method
02/20/2002CN1337066A Electronic component and use of a protective structure contained therein
02/20/2002CN1337065A Semiconductor device and method of mfg. the same
02/20/2002CN1337064A Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits