| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/19/2002 | US6348385 Method for a short channel CMOS transistor with small overlay capacitance using in-situ doped spacers with a low dielectric constant |
| 02/19/2002 | US6348384 Forming patterned photoresist on semiconductor; shallow doping; covering with polymer; deep ion implantation of high dosage; forming poly gate |
| 02/19/2002 | US6348383 Method of forming poly gate and polycide gate with equal height |
| 02/19/2002 | US6348382 Integration process to increase high voltage breakdown performance |
| 02/19/2002 | US6348381 Method for forming a nonvolatile memory with optimum bias condition |
| 02/19/2002 | US6348380 Use of dilute steam ambient for improvement of flash devices |
| 02/19/2002 | US6348379 Method of forming self-aligned contacts using consumable spacers |
| 02/19/2002 | US6348378 Method of making a non-volatile semiconductor device with reduced program disturbance |
| 02/19/2002 | US6348377 Method of manufacturing storage electrode in semiconductor device |
| 02/19/2002 | US6348376 Method of forming metal nitride film by chemical vapor deposition and method of forming metal contact and capacitor of semiconductor device using the same |
| 02/19/2002 | US6348375 Method of fabricating a bit line structure for a semiconductor device |
| 02/19/2002 | US6348374 Process for 4F2 STC cell having vertical MOSFET and buried-bitline conductor structure |
| 02/19/2002 | US6348373 Method for improving electrical properties of high dielectric constant films |
| 02/19/2002 | US6348372 Method for reducing PN junction leakage |
| 02/19/2002 | US6348371 Method of forming self-aligned twin wells |
| 02/19/2002 | US6348370 Method to fabricate a self aligned source resistor in embedded flash memory applications |
| 02/19/2002 | US6348369 Method for manufacturing semiconductor devices |
| 02/19/2002 | US6348368 Introducing catalytic and gettering elements with a single mask when manufacturing a thin film semiconductor device |
| 02/19/2002 | US6348367 Method for manufacturing a semiconductor device |
| 02/19/2002 | US6348366 Method of forming conductive lines |
| 02/19/2002 | US6348365 PCRAM cell manufacturing |
| 02/19/2002 | US6348363 Method for manufacturing a semiconductor package |
| 02/19/2002 | US6348359 Cathode contact structures in organic electroluminescent devices |
| 02/19/2002 | US6348357 Exposure apparatus with a pulsed laser |
| 02/19/2002 | US6348303 Lithographic projection apparatus |
| 02/19/2002 | US6348296 Copolymer resin, preparation thereof, and photoresist using the same |
| 02/19/2002 | US6348295 Methods for manufacturing electronic and electromechanical elements and devices by thin-film deposition and imaging |
| 02/19/2002 | US6348289 System and method for controlling polysilicon feature critical dimension during processing |
| 02/19/2002 | US6348261 Silicon wafer |
| 02/19/2002 | US6348239 Depositing amorphous film of metal precursor complex on substrate, irradiating film to cause metal complex to undergo reaction which transforms metal complex into metal containing material adherent to substrate |
| 02/19/2002 | US6348238 Thin film fabrication method and thin film fabrication apparatus |
| 02/19/2002 | US6348234 Paste applying method |
| 02/19/2002 | US6348180 Surface is formed of only a n2 region which is neutral and in which the amount of precipitated oxygen (.delta.oi) is large and therefore a high gettering capability is provided. |
| 02/19/2002 | US6348159 Method and apparatus for etching coated substrates |
| 02/19/2002 | US6348158 Electron beam is injected into a plasma to a control an electron energy distribution; semiconductor etching |
| 02/19/2002 | US6348157 Semiconductor wet rinsing suppresses formation of surface oxide films, pure water containing ozone, second step uses hf, h2o and a surfactant while applying vibration |
| 02/19/2002 | US6348142 While minimizing the amount of surface area of the substrate which is occupied by tie bars and associated conductive elements, particular utility in the fabrication of ball grid array (bga) semiconductor device packages |
| 02/19/2002 | US6348125 Removal of copper oxides from integrated interconnects |
| 02/19/2002 | US6348122 Fire retarding polypropylene composition |
| 02/19/2002 | US6348099 Methods and apparatus for depositing premetal dielectric layer at sub-atmospheric and high temperature conditions |
| 02/19/2002 | US6348098 Flow controller |
| 02/19/2002 | US6348096 Method for manufacturing group III-V compound semiconductors |
| 02/19/2002 | US6348076 Oxidizing agent, copper corrosion inhibitor, abrasive particles, surface active agent, and polyelectrolyte for polishing or planarizing chip interconnect/wiring material such as al, w and especially cu. |
| 02/19/2002 | US6348073 Apparatus and method for positioning an object at multiple positions within an enclosure |
| 02/19/2002 | US6347990 Microelectronic fabrication system cleaning methods and systems that maintain higher air pressure in a process area than in a transfer area |
| 02/19/2002 | US6347982 Method for making a polishing apparatus utilizing brazed diamond technology and titanium nitride |
| 02/19/2002 | US6347981 Method and apparatus for conditioning polishing pads utilizing brazed diamond technology and titanium nitride |
| 02/19/2002 | US6347977 Method and system for chemical mechanical polishing |
| 02/19/2002 | US6347947 Method and apparatus for protecting and strengthening electrical contact interfaces |
| 02/19/2002 | US6347919 Wafer processing chamber having separable upper and lower halves |
| 02/19/2002 | US6347918 Inflatable slit/gate valve |
| 02/19/2002 | US6347901 Solder interconnect techniques |
| 02/19/2002 | US6347821 Gripper for picking apparatus of a module IC handler |
| 02/19/2002 | US6347661 Graphite substrate; amorphous carbon layer; fluorine resin-containing layer formed by heat-depositing a fluorine-containing resin onto said amorphous carbon layer without any adhesive. |
| 02/19/2002 | US6347655 Die bonding device and semiconductor device |
| 02/19/2002 | US6347636 Methods and apparatus for gettering fluorine from chamber material surfaces |
| 02/19/2002 | US6347602 Plasma processing apparatus |
| 02/19/2002 | US6347601 Film forming apparatus |
| 02/19/2002 | US6347521 Temperature control device and method for manufacturing the same |
| 02/19/2002 | US6347458 Displaceable X/Y coordinate measurement table |
| 02/19/2002 | CA2221245C Method of manufacturing semiconductor article |
| 02/19/2002 | CA2198453C Metalorganic compounds |
| 02/19/2002 | CA2130806C Semiconductor device |
| 02/19/2002 | CA2108559C Electroluminescent silicon device |
| 02/14/2002 | WO2002013342A2 Silicon wafer with embedded optoelectronic material for monolithic oeic |
| 02/14/2002 | WO2002013336A1 Laser system |
| 02/14/2002 | WO2002013284A2 Memory element and method for production of a memory element |
| 02/14/2002 | WO2002013279A2 Metal catalyst technique for texturing silicon solar cells |
| 02/14/2002 | WO2002013277A1 Method of producing tft array |
| 02/14/2002 | WO2002013275A1 Electronic component and method for producing an electronic component |
| 02/14/2002 | WO2002013273A1 Indium gallium nitride channel high electron mobility transistors, and method of making the same |
| 02/14/2002 | WO2002013271A2 Integrated electronic circuit with at least one inductor and method for producing the same |
| 02/14/2002 | WO2002013270A2 Semiconductor component and a method for identifying a semiconductor component |
| 02/14/2002 | WO2002013268A2 Module, especially a wafer module |
| 02/14/2002 | WO2002013262A2 Gate technology for strained surface channel and strained buried channel mosfet devices |
| 02/14/2002 | WO2002013259A2 Method and apparatus for measuring parameters of an electronic device |
| 02/14/2002 | WO2002013258A2 Backside contact for integrated circuit and method of forming same |
| 02/14/2002 | WO2002013256A1 Method of securing solder balls and any components fixed to one and the same side of a substrate |
| 02/14/2002 | WO2002013255A1 Dispenser nozzle for sealing semiconductor device and apparatus for sealing semiconductor device comprising it |
| 02/14/2002 | WO2002013254A2 Electroplating multi-trace circuit board substrates using single tie bar |
| 02/14/2002 | WO2002013252A1 Method for producing a bipolar transistor |
| 02/14/2002 | WO2002013251A1 Vapor phase deposition method for metal oxide dielectric film |
| 02/14/2002 | WO2002013250A1 Radial antenna and plasma device using it |
| 02/14/2002 | WO2002013249A1 Radial antenna and plasma processing apparatus comprising the same |
| 02/14/2002 | WO2002013247A1 A method of epitaxial-like wafer bonding at low temperature and bonded structure |
| 02/14/2002 | WO2002013246A1 Process for growing a magnesium oxide film on a silicon (100) substrate coated with a cubic silicon carbide buffer layer |
| 02/14/2002 | WO2002013245A1 Method of controlling stress in gallium nitride films deposited on substrates |
| 02/14/2002 | WO2002013244A2 Apparatus and method for handling and testing of wafers |
| 02/14/2002 | WO2002013242A2 Composition for cleaning chemical mechanical planarization apparatus |
| 02/14/2002 | WO2002013241A2 Method of etching titanium nitride |
| 02/14/2002 | WO2002013240A2 Method for forming aluminum lines over aluminum-filled vias in a semiconductor substrate |
| 02/14/2002 | WO2002013239A2 Heater for jmf type wafers |
| 02/14/2002 | WO2002013237A2 Method and apparatus for a wafer carrier having an insert |
| 02/14/2002 | WO2002013236A2 Method and apparatus for removing unwanted substance from semiconductor wafer |
| 02/14/2002 | WO2002013234A2 Stabilized surface between a fluorosilicate glass dielectric and a liner/barrier layer |
| 02/14/2002 | WO2002013233A2 Formation of self-aligned passivation for interconnect to minimize electromigration |
| 02/14/2002 | WO2002013226A2 Spatial light modulator driven photocathode source electron beam pattern generator |
| 02/14/2002 | WO2002012972A2 Direct temperature control for a component of a substrate processing chamber |
| 02/14/2002 | WO2002012970A1 Robot motion compensation system |
| 02/14/2002 | WO2002012962A1 Aqueous surfactant solution for developing coating film layer |