Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2002
08/15/2002WO2002063388A1 Display and its manufacturing method
08/15/2002WO2002063346A2 Method of mounting optoelectronic devices on an optical element and article
08/15/2002WO2002063322A1 Member exchanger, method of controlling member exchanger, ic inspection method, ic handler, and ic inspector
08/15/2002WO2002063321A2 Test circuitry of an integrated circuit comprising only one selection element for each signal path
08/15/2002WO2002063314A1 Probe
08/15/2002WO2002063256A2 Optoelectronic device with wavelength filtering by cavity coupling
08/15/2002WO2002063075A2 Methods for growth of relatively large step-free sic crystal surfaces
08/15/2002WO2002063074A1 Susceptorless reactor for growing epitaxial layers on wafers by chemical vapor deposition
08/15/2002WO2002063072A1 Method and apparatus for controlling thickness uniformity of electroplated layer
08/15/2002WO2002063069A2 Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features
08/15/2002WO2002063067A1 Method of electroless plating and apparatus for electroless plating
08/15/2002WO2002063066A1 Processing materials inside an atmospheric-pressure radiofrequency nonthermal plasma discharge
08/15/2002WO2002063065A1 Film forming device
08/15/2002WO2002063063A1 Film forming method and film forming device
08/15/2002WO2002062917A1 Cerium based abrasive material and method for preparation thereof
08/15/2002WO2002062681A1 System for safeguarding integrated intrabay pod delivery and storage system
08/15/2002WO2002062680A2 Conveyorized storage and transportation system
08/15/2002WO2002062593A1 Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition
08/15/2002WO2002062527A1 Abrasive article suitable for modifying a semiconductor wafer
08/15/2002WO2002062520A1 A method of soldering and a preform therefor
08/15/2002WO2002062494A1 Controlled fluid flow and fluid mix system for treating objects
08/15/2002WO2002051715A3 Dual lane conveying apparatus
08/15/2002WO2002049080A3 Method and apparatus for inspecting a substrate
08/15/2002WO2002048432A3 Method for patterning metal using nanoparticle containing precursors
08/15/2002WO2002046363A3 Improved methods for gene expression monitoring on electronic microarrays
08/15/2002WO2002042754A3 Measurement of surface defects
08/15/2002WO2002041399A3 Method for producing an integrated semiconductor component
08/15/2002WO2002035217A3 Methods for continuous embedded process monitoring and optical inspection of substrates using specular signature analysis
08/15/2002WO2002033737A3 Multiprobe detection system for chemical-mechanical planarization tool
08/15/2002WO2002029875A3 Plating system with remote secondary anode for semiconductor manufacturing
08/15/2002WO2002025696A3 Reducing deposition of process residues on a surface in a chamber
08/15/2002WO2002023845A3 Method for improving image quality and for increasing writing speed during exposure of light-sensitive layers
08/15/2002WO2002023582A3 Faraday system for ion implanters
08/15/2002WO2002021581A3 Method for uniform polish microelectronic device
08/15/2002WO2002019398A3 Planarization of metal container structures
08/15/2002WO2002019389A3 Epitaxial template and barrier for the integration of functional thin film heterostructures on silicon
08/15/2002WO2002016075A3 Cmp apparatus with an oscillating polishing pad rotating in the opposite direction of the wafer
08/15/2002WO2002015254A3 Method of manufacturing a trench-gate semiconductor device and corresponding device
08/15/2002WO2002014840A3 Database interpolation method for optical measurement of diffractive microstructures
08/15/2002WO2002013943A3 Ensemble manifold, system and method for monitoring particles in clean environments
08/15/2002WO2002003433A3 Wheel and conveyor system for transporting semiconductor wafers and method for transferring wafers
08/15/2002WO2002003141A3 Network-based photomask data entry interface and instruction generator for manufacturing photomasks
08/15/2002WO2002001609A3 Cleaning method and solution for cleaning a wafer in a single wafer process
08/15/2002WO2001097290A3 Buried inverted gate field-effect transistor (bigfet)
08/15/2002WO2001097266A9 Method of manufacturing thin-film semiconductor device
08/15/2002WO2001079936A9 Mitigation of photoresist outgassing in vacuum lithography
08/15/2002WO2001052307A9 Semiconductor workpiece proximity plating methods and apparatus
08/15/2002WO2001045258A3 Method for implementing a physical design for a dynamically reconfigurable logic circuit
08/15/2002WO2001045135A9 Plasma reactor cooled ceiling with an array of thermally isolated plasma heated mini-gas distribution plates
08/15/2002WO2001042820A9 Method of making optoelectronic devices using sacrificial devices
08/15/2002WO2001041973A9 Chemical-mechanical polishing method
08/15/2002WO2001040692A9 Compact gate valve
08/15/2002WO2001039220A9 Inductor for integrated circuit and methods of manufacture
08/15/2002WO2001026145A9 Seed layers for interconnects and methods and apparatus for their fabrication
08/15/2002WO2001024235A9 Methods and apparatuses for trench depth detection and control
08/15/2002WO2001023636A9 Method and apparatus for controlling chamber surfaces in a semiconductor processing reactor
08/15/2002WO2001013431A9 Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies
08/15/2002WO2001004376A9 A method of forming a silicon nitride layer on a semiconductor wafer
08/15/2002US20020112220 Interweaved integrated circuit interconnects
08/15/2002US20020112218 Delay time calculating method by delay equivalent circuit
08/15/2002US20020112140 Semiconductor device, semiconductor device design system, and semiconductor device manufacturing method
08/15/2002US20020112137 Partial trench body ties in sram cell
08/15/2002US20020112064 Customer support network
08/15/2002US20020111821 Information provider device, information provider system and advertising method
08/15/2002US20020111759 Failure analysis device and failure analysis method
08/15/2002US20020111710 Method and apparatus for orienting substrates
08/15/2002US20020111708 System for supplying semiconductor manufacturing system control programs
08/15/2002US20020111423 Method for manufacturing conductive adhesive for high frequency flip chip package application
08/15/2002US20020111420 Core-shell polymers; encapsulation
08/15/2002US20020111125 Flattening and machining method and apparatus
08/15/2002US20020111124 Method and apparatus for uniformly planarizing a microelectronic substrate
08/15/2002US20020111123 Method and apparatus for uniformly planarizing a microelectronic substrate
08/15/2002US20020111122 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
08/15/2002US20020111121 Method and apparatus for electrochemical-mechanical planarization
08/15/2002US20020111120 Fixed abrasive article for use in modifying a semiconductor wafer
08/15/2002US20020111053 Interconnection structure of semiconductor element
08/15/2002US20020111051 Bare chip carrier and method for manufacturing semiconductor device using the bare chip carrier
08/15/2002US20020111046 Semiconductor device fabricating method
08/15/2002US20020111044 Gallium nitride semiconductor structures fabricated by pendeoepitaxial methods of fabricating gallium nitride semiconductor layers on weak posts
08/15/2002US20020111043 Ultra fast rapid thermal processing chamber and method of use
08/15/2002US20020111042 Method of depositing a low K dielectric with organo silane
08/15/2002US20020111041 Post-etch photoresist strip with O2 and NH3 for organosilicate glass low-K dielectric etch applications
08/15/2002US20020111040 Method and apparatus for manufacturing a semiconductor device
08/15/2002US20020111039 Method of forming low dielectric silicon oxynitride spacer films highly selective to etchants
08/15/2002US20020111038 Measurements are taken in-situ and monitor the erosion rate
08/15/2002US20020111037 Pre-pattern surface modification for low-k dielectrics
08/15/2002US20020111036 Unique process chemistry for etching organic low-k materials
08/15/2002US20020111035 System and methods for manufacturing and using a mask
08/15/2002US20020111034 Process of manufacturing a semiconductor device
08/15/2002US20020111033 Post metal etch cleaning method
08/15/2002US20020111032 Methods of forming spin on glass layers by curing remaining portions thereof
08/15/2002US20020111030 Stepped photoresist profile and opening formed using the profile
08/15/2002US20020111028 Method of manufacturing semiconductor device as well as reticle and wafer used therein
08/15/2002US20020111027 Polishing compositions for noble metals
08/15/2002US20020111026 Polishing uisng ozone and abrasives
08/15/2002US20020111025 Modified gate processing for optimized difinition of array and logic devices on same chip
08/15/2002US20020111024 Chemical mechanical polishing compositions
08/15/2002US20020111023 Method for removing surface contamination on semiconductor substrates
08/15/2002US20020111022 Method of forming embedded copper interconnections and embedded copper interconnection structure
08/15/2002US20020111021 Ozone oxide as a mediating layer in nickel silicide formation