| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/14/2002 | EP1229990A1 Auto-switching gas delivery system utilizing sub-atmospheric pressure gas supply vessels |
| 08/14/2002 | EP1124666B1 Use of zeta potential during chemical mechanical polishing for end point detection |
| 08/14/2002 | EP1116314B1 Protective circuit on an integrated circuit |
| 08/14/2002 | EP1090083B1 Chemical mechanical polishing slurry useful for copper/tantalum substrates |
| 08/14/2002 | EP0897557B1 Lithographical process for production of nanostructures on surfaces |
| 08/14/2002 | DE10210021A1 Verfahren zur Herstellung von Halbleiterscheiben durch Abtrennen der Halbleiterscheiben von mindestens einem Kristallstück A process for producing semiconductor wafers by cutting the semiconductor wafers by at least one crystal piece |
| 08/14/2002 | DE10206057A1 Non-volatile memory device, e.g. electrically-erasable programmable read only memory cell, comprises gate insulating films, tunnel insulating film, memory transistor gate, select transistor gate, and three doped regions |
| 08/14/2002 | DE10205324A1 Halbleiterbauelement Semiconductor device |
| 08/14/2002 | DE10205323A1 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device |
| 08/14/2002 | DE10151209A1 Halbleiterelement und Verfahren zu dessen Ansteuerung Semiconductor element and method for its control |
| 08/14/2002 | DE10145151A1 Fotomaske mit einem Film, der aus einem Halbtonmaterial gebildet ist, Verfahren zur Herstellung einer Fotomaske, und Verfahren zur Herstellung einer Halbleitervorrichtung Photomask with a film which is formed from a halftone material, method for manufacturing a photomask, and method of manufacturing a semiconductor device |
| 08/14/2002 | DE10117929A1 Verfahren zum Verbinden eines Chips mit einem Substrat unter Verwendung einer isotropen Verbindungsschicht und Verbundsystem aus Chip und Substrat A method for connecting a chip to a substrate using an isotropic tie layer and the composite system of the chip and substrate |
| 08/14/2002 | DE10104267A1 Elektronisches Bauteil mit mindestens einer Isolationslage Electronic component with at least one layer of insulation |
| 08/14/2002 | DE10102129A1 Schaltungsanordnung zur Erzeugung einer Referenzspannung Circuit arrangement for generating a reference voltage |
| 08/14/2002 | DE10100670A1 Zuführvorrichtung für eine CVD-Anlage Feeding apparatus for a CVD system |
| 08/14/2002 | CN1364317A Semiconductor element with tungsten oxide layer and method for its production |
| 08/14/2002 | CN1364316A Lateral DMOS improved brookdown structure and method |
| 08/14/2002 | CN1364314A Semiconductor device and method of manufacturing the same |
| 08/14/2002 | CN1364313A Rapid ramping anneal method for fabricating superlattice materials |
| 08/14/2002 | CN1364312A Method of making buried strap for trench capacitor |
| 08/14/2002 | CN1364311A Reduced electromigration and stress induced migration of Cu wires by surface coating |
| 08/14/2002 | CN1364310A Method and system for providing continuous motion sequential lateral solidification |
| 08/14/2002 | CN1364309A Semiconductor wafer and production method therefor |
| 08/14/2002 | CN1364300A Magnetic field element having a biasing magnetic layer structure |
| 08/14/2002 | CN1364107A Method and apparatus for polishing outer peripheral chamfered part of wafer |
| 08/14/2002 | CN1364097A Method and device for processing PFC |
| 08/14/2002 | CN1364053A Improved structure and method for packing image sensor |
| 08/14/2002 | CN1364051A Flexible distributing board and manufacture thereof |
| 08/14/2002 | CN1364050A Structure and method for packaging image sensor |
| 08/14/2002 | CN1363958A Aluminium nitride and aluminum oxide/nitride grid laminated FET and forming method thereof |
| 08/14/2002 | CN1363956A Semiconductor memory and manufacture and drive method thereof |
| 08/14/2002 | CN1363955A Semiconductor storaging device |
| 08/14/2002 | CN1363954A Semiconductor device, manufacturing method and design method |
| 08/14/2002 | CN1363953A Process for preparing slot isolation not containing nitride |
| 08/14/2002 | CN1363952A Wafer-class packaging technology and its chip structure |
| 08/14/2002 | CN1363951A Diffusion-type wafer package system |
| 08/14/2002 | CN1363950A Manufacturing method for semiconductor device |
| 08/14/2002 | CN1363949A Method for forming metal grids in semiconductor device |
| 08/14/2002 | CN1363948A Foundation treating system and method |
| 08/14/2002 | CN1363936A Process for preparing organic conducting wire by electric induced growth techinque |
| 08/14/2002 | CN1363935A Semiconductor storaging device for shortening test time |
| 08/14/2002 | CN1363841A Examination method for integrated circuit |
| 08/14/2002 | CN1363730A Process for controlling polarity of GaN |
| 08/14/2002 | CN1363721A Processing method and apparatus for plasma |
| 08/14/2002 | CN1363720A Chemical gas phase depositation of copper film for organic metal copper complex |
| 08/14/2002 | CN1363719A Treatment of plasma |
| 08/14/2002 | CN1363718A Processing apparatus for plasma |
| 08/14/2002 | CN1363417A Method and apparatus for preparing polycrysalline silcon |
| 08/14/2002 | CN1089190C Silicon on insulator substrate with improved insulation patterns |
| 08/14/2002 | CN1089186C Fast magnetic scanning of heavy ion beams |
| 08/13/2002 | US6434730 Pattern forming method |
| 08/13/2002 | US6434727 Methods of making hard macro cell using timing interval |
| 08/13/2002 | US6434725 Method and system for semiconductor testing using yield correlation between global and class parameters |
| 08/13/2002 | US6434722 Method of changing logic circuit portion into gated clock portion and recording medium storing a program for carrying out the method |
| 08/13/2002 | US6434440 Production estimate management system |
| 08/13/2002 | US6434327 Rapid thermal heating apparatus and method including an infrared camera to measure substrate temperature |
| 08/13/2002 | US6434063 Method of repairing semiconductor memory, electron-beam memory repairing apparatus and redundancy memory circuit to which the method of repairing semiconductor memory is applicable |
| 08/13/2002 | US6434053 Nonvolatile semiconductor memory device and method of operation thereof |
| 08/13/2002 | US6434052 Nonvolatile memory devices having alternative programming |
| 08/13/2002 | US6434047 Semiconductor memory system |
| 08/13/2002 | US6434038 Non-volatile memory using ferroelectric material and manufacturing method thereof |
| 08/13/2002 | US6434017 Semiconductor device and electronic apparatus |
| 08/13/2002 | US6433995 Apparatus for forming electrode of chip-like electronic part |
| 08/13/2002 | US6433994 Multilayer; pattern masking structure |
| 08/13/2002 | US6433983 High performance output buffer with ESD protection |
| 08/13/2002 | US6433878 Method and apparatus for the determination of mask rules using scatterometry |
| 08/13/2002 | US6433872 Exposure method and apparatus |
| 08/13/2002 | US6433765 Liquid crystal display |
| 08/13/2002 | US6433721 Current source cell arrangement, method of selecting current source cell and current addition type digital-to-analog converter |
| 08/13/2002 | US6433714 Apparatus and method for precision trimming of a semiconductor device |
| 08/13/2002 | US6433619 Pump circuit boosting a supply voltage |
| 08/13/2002 | US6433617 Configuration for reducing the number of measuring pads on a semiconductor chip |
| 08/13/2002 | US6433606 Clock driver circuit and method of routing clock interconnections |
| 08/13/2002 | US6433594 Semiconductor integrated circuit and semiconductor integrated circuit system |
| 08/13/2002 | US6433585 Overvoltage-tolerant interface for integrated circuits |
| 08/13/2002 | US6433580 Architecture and interconnect scheme for programmable logic circuits |
| 08/13/2002 | US6433578 Heterogeneous programmable gate array |
| 08/13/2002 | US6433575 Check abnormal contact and via holes by electroplating method |
| 08/13/2002 | US6433573 Method and apparatus for measuring parameters of an electronic device |
| 08/13/2002 | US6433566 Probing method and probing system |
| 08/13/2002 | US6433563 Probe card with rigid base having apertures for testing semiconductor device, and semiconductor device test method using probe card |
| 08/13/2002 | US6433553 Method and apparatus for eliminating displacement current from current measurements in a plasma processing system |
| 08/13/2002 | US6433523 Semiconductor integrated circuit and method for generating internal supply voltage |
| 08/13/2002 | US6433484 Wafer area pressure control |
| 08/13/2002 | US6433441 Area array type semiconductor device |
| 08/13/2002 | US6433439 Device with security integrated circuit |
| 08/13/2002 | US6433438 Semiconductor integrated circuit device |
| 08/13/2002 | US6433437 Manufacturing process for semiconductor device, photomask, and manufacturing apparatus for semiconductor device |
| 08/13/2002 | US6433436 Dual-RIE structure for via/line interconnections |
| 08/13/2002 | US6433435 Multilayer; dielectric layer with aperture overcoating with barrier layer |
| 08/13/2002 | US6433434 Apparatus having a titanium alloy layer |
| 08/13/2002 | US6433433 Semiconductor device with misaligned via hole |
| 08/13/2002 | US6433432 Semiconductor device having fluorined insulating film and reduced fluorine at interconnection interfaces and method of manufacturing the same |
| 08/13/2002 | US6433430 Titanium silicide undercoating |
| 08/13/2002 | US6433429 Reduced electromigration |
| 08/13/2002 | US6433428 Semiconductor device with a dual damascene type via contact structure and method for the manufacture of same |
| 08/13/2002 | US6433426 Semiconductor device having a semiconductor with bump electrodes |
| 08/13/2002 | US6433424 Semiconductor device package and lead frame with die overhanging lead frame pad |
| 08/13/2002 | US6433422 Semiconductor integrated circuit having semiconductor packages for mounting integrated circuit chips on both sides of a substrate |
| 08/13/2002 | US6433420 Semiconductor package with heat sink having air vent |