| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/22/2002 | WO2002043124A3 Method for making a substrate in particular for optics, electronics or optoelectronics and resulting substrate |
| 08/22/2002 | WO2002043115A3 Surface preparation prior to deposition |
| 08/22/2002 | WO2002041339A3 Method for producing ferroelectric capacitors and integrated ferroelectric semiconductor memory arrangement |
| 08/22/2002 | WO2002037538A3 Amorphous carbon layer for improved adhesion of photoresist |
| 08/22/2002 | WO2002027768A3 Fabrication of semiconductor devices |
| 08/22/2002 | WO2002025375A3 Pinhole defect repair by resist flow |
| 08/22/2002 | WO2002023674A3 Thick film millimeter wave transceiver module |
| 08/22/2002 | WO2002023611A3 Integration of silicon etch and chamber cleaning processes |
| 08/22/2002 | WO2002021573A3 Ccd image sensor and method of manufacturing same |
| 08/22/2002 | WO2002018653A3 Method for depositing nitride layers |
| 08/22/2002 | WO2002017364A3 Micromechanical multichip module and method of making same |
| 08/22/2002 | WO2002017019A3 Oxime sulfonate and n-oxyimidosulfonate photoacid generators and photoresists comprising same |
| 08/22/2002 | WO2002012350A3 Photoinitiated reactions |
| 08/22/2002 | WO2002011182A3 Fine pattern drawing method |
| 08/22/2002 | WO2002007233A3 Group iii nitride compound semiconductor device |
| 08/22/2002 | WO2002006901A3 Photoresist composition for deep uv and process thereof |
| 08/22/2002 | WO2002001613A3 Method and apparatus for wafer cleaning |
| 08/22/2002 | WO2001080281A3 Stand alone plasma vacuum pump |
| 08/22/2002 | WO2001065608A3 Trench gate dmos field-effect transistor and method of making the same |
| 08/22/2002 | WO2001063655A8 Chemical-mechanical polishing device, damascene wiring forming device, and damascene wiring forming method |
| 08/22/2002 | WO2000042638A3 Device for positioning a wafer |
| 08/22/2002 | WO2000032713A9 Stabilized slurry compositions |
| 08/22/2002 | WO2000028278A9 Electronics assembly apparatus with height sensing sensor |
| 08/22/2002 | WO2000022198A9 Thermally annealed, low defect density single crystal silicon |
| 08/22/2002 | US20020116697 Methods for calculating, correcting, and displaying segmented reticle patterns for use in charged-particle-beam microlithography, and screen editors utilizing such methods |
| 08/22/2002 | US20020116691 Semi-physical modeling of HEMT high frequency noise equivalent circuit models |
| 08/22/2002 | US20020116687 Optimization method for element placement |
| 08/22/2002 | US20020116686 Continuously variable dummy pattern density generating systems, methods and computer program products for patterning integrated circuits |
| 08/22/2002 | US20020116685 Timing closure methodology |
| 08/22/2002 | US20020116674 Boundary scan delay chain for cross-chip delay measurement |
| 08/22/2002 | US20020116671 Alarm display unit of IC tester |
| 08/22/2002 | US20020116086 Installation for processing wafers |
| 08/22/2002 | US20020116083 System and method for automated monitoring and assessment of fabrication facility |
| 08/22/2002 | US20020116076 Substrate processing apparatus and information storage apparatus and method |
| 08/22/2002 | US20020115886 Tantalum tertiary amylimido tris (dimethylamide), a process for producing the same, a solution of starting material for MOCVD using the same, and a method of forming a tantalum nitride film using the same |
| 08/22/2002 | US20020115741 Alkali-soluble resin,such as a phenolic resin, that has been modified with aniline or an aniline derivative |
| 08/22/2002 | US20020115580 Method for stripping copper in damascene interconnects |
| 08/22/2002 | US20020115397 System and method for CMP head having multi-pressure annular zone subcarrier material removal control |
| 08/22/2002 | US20020115392 Wafer planarization apparatus and planarization method thereof |
| 08/22/2002 | US20020115387 Double-side polishing process with reduced scratch rate and device for carrying out the process |
| 08/22/2002 | US20020115384 Fixed-abrasive chemical-mechanical planarization of titanium nitride |
| 08/22/2002 | US20020115380 Polishing end point detecting device for wafer polishing apparatus |
| 08/22/2002 | US20020115379 Polishing disk with end-point detection port |
| 08/22/2002 | US20020115310 Etching mask, process for forming contact holes using same, and semiconductor device made by the process |
| 08/22/2002 | US20020115309 Heat-resistant core and a core covering comprising a carbon based yarn. The knitted garment is heat treated to at least partially decompose the carbon based yarn to form activated charcoal |
| 08/22/2002 | US20020115308 Semiconductor device with porous interlayer insulating film |
| 08/22/2002 | US20020115307 Manufacturing method for ferroelectric thin film using sol-gel process |
| 08/22/2002 | US20020115306 Method for forming a thin film |
| 08/22/2002 | US20020115305 Method for stabilizing low dielectric constant materials |
| 08/22/2002 | US20020115304 Manufacturing method for a field-effect transistor, manufacturing method for a semiconductor device, and apparatus therefor |
| 08/22/2002 | US20020115303 Semiconductor device and method of producing the same |
| 08/22/2002 | US20020115302 Aggregate dielectric layer to reduce nitride consumption |
| 08/22/2002 | US20020115299 Method of etching metallic thin film on thin film resistor |
| 08/22/2002 | US20020115298 Thin film transistor array panel for a liquid crystal display |
| 08/22/2002 | US20020115297 Process for manufacturing reflective TFT-LCD with rough diffuser |
| 08/22/2002 | US20020115296 Method for avoiding erosion of conductor structure during removing etching residues |
| 08/22/2002 | US20020115295 Process of manufacturing semiconductor device |
| 08/22/2002 | US20020115294 Epitaxial semiconductor wafer manufacturing method |
| 08/22/2002 | US20020115292 Method for forming electromigration-resistant structures by doping |
| 08/22/2002 | US20020115291 Method of fabricating node contacts |
| 08/22/2002 | US20020115290 Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same |
| 08/22/2002 | US20020115289 Method for decreasing the resistivity of the gate and the leaky junction of the source/drain |
| 08/22/2002 | US20020115288 Method for decreasing the resistivity of the gate and the leaky junction of the source/drain |
| 08/22/2002 | US20020115287 Method and apparatus for forming improved metal interconnects |
| 08/22/2002 | US20020115286 Integrated circuit device with MIM capacitance circuit and method of manufacturing the same |
| 08/22/2002 | US20020115285 Mechanically reinforced highly porous low dielectric constant films |
| 08/22/2002 | US20020115284 Method of cleaning a dual damascene structure |
| 08/22/2002 | US20020115283 Planarization by selective electro-dissolution |
| 08/22/2002 | US20020115282 Chip structure and process for forming the same |
| 08/22/2002 | US20020115281 Semiconductor integrated circuit device and method for making the same |
| 08/22/2002 | US20020115279 Use of palladium in IC manufacturing |
| 08/22/2002 | US20020115278 Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier |
| 08/22/2002 | US20020115276 A method of etching polycrystalline silicon film by using two consecutive dry-etching processes |
| 08/22/2002 | US20020115275 Method for forming a dielectric layer of a semiconductor device and a capacitor using the same |
| 08/22/2002 | US20020115274 Semiconductor device and method of manufacturing the same |
| 08/22/2002 | US20020115272 Manufacturing method for improving reliability of polysilicon thin film transistors |
| 08/22/2002 | US20020115271 Method of manufacturing a semiconductor device |
| 08/22/2002 | US20020115270 Methods of fabricating high-reliability and high-efficiency trench isolation for semiconductor devices |
| 08/22/2002 | US20020115269 Method of depositing amorphous silicon based films having controlled conductivity |
| 08/22/2002 | US20020115268 Silicon-on-insulator (SOI) substrate and method for manufacturing the same |
| 08/22/2002 | US20020115267 Semiconductor thin film, semiconductor element and semiconductor device, and fabrication methods thereof |
| 08/22/2002 | US20020115266 Method and a system for sealing an epitaxial silicon layer on a substrate |
| 08/22/2002 | US20020115265 Method of transferring a device, a method of producing a device holding substrate, and a device holding substrate |
| 08/22/2002 | US20020115264 Controlled cleavage process using pressurized fluid |
| 08/22/2002 | US20020115263 Method and related apparatus of processing a substrate |
| 08/22/2002 | US20020115262 Self-aligned silicide process for reduction of Si consumption in shallow junction and thin SOI electronic devices |
| 08/22/2002 | US20020115261 Semiconductor processing methods of forming a plurality of capacitors on a substrate, bit line contacts and method of forming bit line contacts |
| 08/22/2002 | US20020115260 Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same |
| 08/22/2002 | US20020115258 Overcoating electrode with tantalum oxynitride; heat treatment; low pressure vapor deposition |
| 08/22/2002 | US20020115257 Insulated gate type semiconductor device and method for fabricating the same |
| 08/22/2002 | US20020115256 Non-volatile memory device having a bit line contact pad and method for manufacturing the same |
| 08/22/2002 | US20020115255 Method of fabricating a non-volatile memory device |
| 08/22/2002 | US20020115254 Semiconductor devices having a non-volatile memory transistor and methods for manufacturing the same |
| 08/22/2002 | US20020115253 Method for fabricating a semiconductor memory component |
| 08/22/2002 | US20020115252 Dielectric interface films and methods therefor |
| 08/22/2002 | US20020115251 Method of fabricating a semiconductor device |
| 08/22/2002 | US20020115249 Method for manufacturing gate spacer for self-aligned contact |
| 08/22/2002 | US20020115248 Semiconductor processing methods of forming a contact opening to a conductive line and methods of forming substrate active area source/drain regions |
| 08/22/2002 | US20020115247 Process for fabricating a deep submicron complementary metal oxide semiconductor having ultra shallow junctions |
| 08/22/2002 | US20020115246 Method for crystallizing silicon film and thin film transistor and fabricating method using the same |