Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2002
08/22/2002US20020115245 Method for forming thin film transistor with lateral crystallization
08/22/2002US20020115243 Method to fabricate an intrinsic polycrystalline silicon film
08/22/2002US20020115242 Method and apparatus for fabricating thin film transistor including crystalline active layer
08/22/2002US20020115241 Thin film transistor, liquid crystal display and manufacturing method thereof
08/22/2002US20020115240 Double soi device with recess etch and epitaxy
08/22/2002US20020115239 Esd protection network used for soi technology
08/22/2002US20020115235 Substrate cutting method
08/22/2002US20020115234 Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufacture
08/22/2002US20020115233 Semiconductor device and method for fabricating the same
08/22/2002US20020115232 Semiconductor chip production method and semiconductor wafer
08/22/2002US20020115231 Method of forming noble metal pattern
08/22/2002US20020115228 Manufacturing method of a semiconductor device
08/22/2002US20020115227 Contact-making structure for a ferroelectric storage capacitor and method for fabricating the structure
08/22/2002US20020115226 Ferroelectric memory device and method for fabricating the same
08/22/2002US20020115025 Apparatus for removing photoresist film
08/22/2002US20020115024 Apparatus for removing photoresist film
08/22/2002US20020115022 Developer/rinse formulation to prevent image collapse in resist
08/22/2002US20020115021 A lithographic system for an integrated circuit includes a computer and a configurable mask which is coupled to the computer and allows light to be transmitted in the pattern controlled by a control signal from the computer
08/22/2002US20020115020 Exposing photoresists using an electron beam exposure apparatus having a variable beam-shaping system
08/22/2002US20020115004 A phase shift reticle and a trim reticle, reticle stage scans the two reticles across an illumination field, image of each reticle is projected by projection optics onto a photosensitive substrate on a wafer stage
08/22/2002US20020115003 Seed layer is formed of a chromium material containing atleast one of oxygen, nitrogen and carbon, disposed between the transparent substrate and the light-shielding film or the antireflective film
08/22/2002US20020115002 Template for room temperature, low pressure micro-and nano-imprint lithography
08/22/2002US20020115000 Method of extreme ultraviolet mask engineering
08/22/2002US20020114963 Depositing layer of chromium onto diamond component; depositing metal selected from tungsten, molybdenum, tantalum, niobium, or their alloy with chromium; depositing layer of silver or gold or copper; heating
08/22/2002US20020114957 Thin film dielectric composite materials
08/22/2002US20020114886 Method of tisin deposition using a chemical vapor deposition process
08/22/2002US20020114732 System and method for a digital mass flow controller
08/22/2002US20020114726 Electronic device
08/22/2002US20020114690 Transfer system
08/22/2002US20020114687 Materials handling system
08/22/2002US20020114686 Wafer carrier with stacking adaptor plate
08/22/2002US20020114684 Load port of a semiconductor manufacturing apparatus having integrated kinematic coupling pins and sensors, and method of loading wafers using the same
08/22/2002US20020114632 Substrate processing apparatus
08/22/2002US20020114520 Position detection device and method
08/22/2002US20020114506 Circuit pattern inspection method and apparatus
08/22/2002US20020114370 Injection seeded F2 laser with line selection and discrimination
08/22/2002US20020114224 Design method and system for semiconductor integrated circuits
08/22/2002US20020114207 Nonvolatile semiconductor memory having plural data storage portions for a bit line connected to memory cells
08/22/2002US20020114201 Semiconductor memory circuit
08/22/2002US20020114191 Semiconductor memory device and method of manufacturing the same
08/22/2002US20020114186 Semiconductor apparatus
08/22/2002US20020114185 Electrically-eraseable programmable read-only memory having reduced-page-size program and erase
08/22/2002US20020114180 Method of selectively forming local interconnects using design rules
08/22/2002US20020114179 Contactless channel write/erase flash memory cell and its fabrication method
08/22/2002US20020114144 Molded flip chip package
08/22/2002US20020114124 Electrostatic clamping of gallium arsenide and other high resistivity materials
08/22/2002US20020114123 Plasma processing apparatus for processing semiconductor wafer using plasma
08/22/2002US20020114112 Magnetic tunnel element and its manufacturing method, thin-film magnetic head, magnetic memory and magnetic sensor
08/22/2002US20020114068 Antireflection coating for ultraviolet light at large angles of incidence
08/22/2002US20020113959 Method and apparatus for inspecting resist pattern
08/22/2002US20020113958 Optical coupling for testing integrated circuits
08/22/2002US20020113954 Focusing-device for the radiation from a light source
08/22/2002US20020113953 Method of adjusting projection optical apparatus
08/22/2002US20020113914 Active matrix liquid crystal display device and switching element used therein
08/22/2002US20020113889 CCD imaging device and driving method thereof
08/22/2002US20020113790 Imaging simulation method and imaging simulation system using the same and recording medium programmed with the simulation method
08/22/2002US20020113769 Level shift circuit and semiconductor device using the same
08/22/2002US20020113738 High frequency power source, plasma processing apparatus, inspection method for plasma processing apparatus, and plasma processing method
08/22/2002US20020113653 Supply circuit
08/22/2002US20020113642 Reference voltage circuit
08/22/2002US20020113638 Termination resistor circuit for achieving highly versatile interface circuit and signal transmission system having the termination resistor circuit
08/22/2002US20020113636 Ferroelectric non-volatile logic elements
08/22/2002US20020113629 Output circuit, input circuit and input/output circuit
08/22/2002US20020113616 Semiconductor integrated circuit
08/22/2002US20020113609 Probe stylus
08/22/2002US20020113584 Method and a system for producing a power supply voltage for controlling an electronic switch
08/22/2002US20020113498 Linear motor, stage apparatus, exposure apparatus, and device manufacturing method
08/22/2002US20020113324 Method for forming three-dimensional circuitization and circuits formed
08/22/2002US20020113323 Integrated semiconductor circuit
08/22/2002US20020113321 Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufacture
08/22/2002US20020113319 Flip chip semiconductor device having signal pads arranged outside of power supply pads
08/22/2002US20020113318 Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate
08/22/2002US20020113317 A semiconductor device having hydogen diffusion and barrier layers and a method of producing the same
08/22/2002US20020113316 Semiconductor device and method of manufacturing the same
08/22/2002US20020113315 Fabrication of integrated circuits with borderless vias
08/22/2002US20020113314 Method of forming iridium conductive electrode/barrier structure
08/22/2002US20020113313 Semiconductor device bonding pad resistant to stress and method of fabricating the same
08/22/2002US20020113311 Device with at least one semiconductor component and a printed circuit board and method of establishing an electromechanical connection between the two
08/22/2002US20020113310 Conducting line of semiconductor device and manufacturing method thereof using aluminum oxide layer as hard mask
08/22/2002US20020113309 Shielding of RF devices
08/22/2002US20020113304 Dual die package and manufacturing method thereof
08/22/2002US20020113301 Leadless semiconductor package
08/22/2002US20020113297 Method and structure of a precision mim fusible circuit elements using fuses and antifuses
08/22/2002US20020113296 Wafer level hermetic sealing method
08/22/2002US20020113295 Semiconductor device and method for its manufacture
08/22/2002US20020113294 CMOS semiconductor device and method of manufacturing the same
08/22/2002US20020113293 Semiconductor component and method of manufacturing
08/22/2002US20020113292 Additional capacitance for MIM capacitors with no additional processing
08/22/2002US20020113290 Integrated inductance structure
08/22/2002US20020113288 Method and structure for providing improved thermal conduction for silicon semiconductor devices
08/22/2002US20020113287 Semiconductor integrated circuit device with capacitor formed under bonding pad
08/22/2002US20020113286 Semiconductor device
08/22/2002US20020113284 Integrated circuit with unified input device, microprocessor and display systems
08/22/2002US20020113283 Semiconductor device with contacts having uniform contact resistance and method for manufacturing the same
08/22/2002US20020113280 Metal oxynitride capacitor barrier layer
08/22/2002US20020113279 Semiconductor device, and method of forming an electrode
08/22/2002US20020113278 Stacked semiconductor integrated circuit device and manufacturing method thereof
08/22/2002US20020113277 Sub-critical-dimension integrated circuit features
08/22/2002US20020113274 Field effect semiconductor device and its production method
08/22/2002US20020113273 Semiconductor device having contact plug and method for manufacturing the same
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