Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2002
08/20/2002US6436605 Reactive ion etching resistance of radiation sensitive resist composition is enhanced by adding at least one organometallic compound to polymers with patterns
08/20/2002US6436602 Method of repairing a defective portion in an electronic device
08/20/2002US6436594 Electron-beam exposure method utilizing specific alignment mask selection
08/20/2002US6436593 A polyimide precursor or a polyoxazole precursor having a group represented by--or, acid generation with radiation
08/20/2002US6436587 Method of making a multi-level reticle using bi-level photoresist, including a phase-shifted multi-level reticle
08/20/2002US6436586 Pellicle with a filter and method for production thereof
08/20/2002US6436526 Magneto-resistance effect element, magneto-resistance effect memory cell, MRAM and method for performing information write to or read from the magneto-resistance effect memory cell
08/20/2002US6436488 Defining a plasma volume in a process chamber, defining a total flow rate of a mixture of gases introduced into the process chamber, the mixture of gases including a silicon containing precursor; wherein the total flow rate is the sum
08/20/2002US6436487 Film deposition process wherein a plasma generation chamber is divided from a deposition chamber, radicals are extracted from the plasma
08/20/2002US6436482 Upper and lower heaters for the top and bottom surfaces of the substrate, and a thermoconductive heater block on whidch the substrate is placed for independently setting the temperatures of the upper and lower heaters
08/20/2002US6436472 Method of applying a coating solution to a substrate surface using a rotary coater
08/20/2002US6436361 Silicon carbide and process for its production
08/20/2002US6436353 Gas recovering apparatus
08/20/2002US6436331 Method of resin sealing a gap between a semiconductor chip and a substrate
08/20/2002US6436305 Passivating etchants for metallic particles
08/20/2002US6436304 Plasma processing method
08/20/2002US6436303 Film removal employing a remote plasma source
08/20/2002US6436302 Post CU CMP polishing for reduced defects
08/20/2002US6436300 Etching metal using mixture of hydrogen peroxide and 1,2-cyclohexylenedinitrilotateaacetic acid
08/20/2002US6436267 Electroplating voidless metal interconnects in submicron semiconductor substrates; precleaning; sputtering barrier and seed layers; electrochemical deposition of highly resistive electrolyte containing copper sulfate; consistency
08/20/2002US6436251 Vault-shaped target and magnetron having both distributed and localized magnets
08/20/2002US6436249 Clamshell apparatus for electrochemically treating semiconductor wafers
08/20/2002US6436230 Process device
08/20/2002US6436229 Gas phase silicon etching with bromine trifluoride
08/20/2002US6436228 Substrate retainer
08/20/2002US6436226 Object separating apparatus and method, and method of manufacturing semiconductor substrate
08/20/2002US6436223 Process and apparatus for improved module assembly using shape memory alloy springs
08/20/2002US6436220 Process for the collective removal of resist material and side wall protective film
08/20/2002US6436196 Apparatus and method for forming an oxynitride insulating layer on a semiconductor wafer
08/20/2002US6436195 Method of fabricating a MOS device
08/20/2002US6436194 Method and a system for sealing an epitaxial silicon layer on a substrate
08/20/2002US6436193 Gas processing apparatus baffle member, and gas processing method
08/20/2002US6436192 Apparatus for aligning a wafer
08/20/2002US6435957 Wafer polishing pad centering apparatus
08/20/2002US6435956 Wafer holder and polishing device
08/20/2002US6435955 Abrasive machine
08/20/2002US6435949 Workpiece polishing apparatus comprising a fluid pressure bag provided between a pressing surface and the workpiece and method of use thereof
08/20/2002US6435947 CMP polishing pad including a solid catalyst
08/20/2002US6435944 Chemical mechanical polishing (cmp); peroxycarboxylic acid or urea peroxyacid which dissociates into oxidizer and complexing agent; abrasive slurry; minimizing overetching; prevents dishing
08/20/2002US6435943 Method of chemical mechanical polishing organic silicon material with low dielectric constant
08/20/2002US6435942 Chemical mechanical polishing processes and components
08/20/2002US6435941 Apparatus and method for chemical mechanical planarization
08/20/2002US6435869 Quartz window having reinforcing ribs
08/20/2002US6435868 Multi-function chamber for a substrate processing system
08/20/2002US6435865 Apparatus and method for positioning gas injectors in a vertical furnace
08/20/2002US6435809 Dual arm linear hand-off wafer transfer assembly
08/20/2002US6435807 Integrated edge gripper
08/20/2002US6435799 Wafer transfer arm stop
08/20/2002US6435798 Semiconductor processing apparatus with substrate-supporting mechanism
08/20/2002US6435797 Method and device for loading a susceptor
08/20/2002US6435492 Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate
08/20/2002US6435428 Showerhead apparatus for radical-assisted deposition
08/20/2002US6435414 Electronic module for chip card
08/20/2002US6435401 Apparatus and a method for removing solder from an object
08/20/2002US6435400 Bondhead lead clamp apparatus and method
08/20/2002US6435399 Method of checking wirebond condition
08/20/2002US6435398 Method for chemically reworking metal layers on integrated circuit bond pads
08/20/2002US6435396 Print head for ejecting liquid droplets
08/20/2002US6435330 In/out load port transfer mechanism
08/20/2002US6435224 Automatic refill system for ultra pure or contamination sensitive chemicals
08/20/2002US6435215 Gas panel
08/20/2002US6435200 Device and process for liquid treatment of wafer-shaped articles
08/20/2002US6435199 Treatment apparatus
08/20/2002US6435197 Method of cleaning a semiconductor fabricating apparatus
08/20/2002US6435196 Impurity processing apparatus and method for cleaning impurity processing apparatus
08/20/2002US6434817 Method for joining an integrated circuit
08/20/2002US6434775 Nozzle for rinsing the backside of a semiconductor wafer
08/20/2002CA2233028C Thin film formation process
08/15/2002WO2002063763A1 Surface acoustic wave device, its manufacturing method, and electronic circuit device
08/15/2002WO2002063697A1 Semiconductor device and its manufacturing method
08/15/2002WO2002063696A1 Semiconductor device
08/15/2002WO2002063695A1 Insulated-gate bipolar transistor, semiconductor device, method of manufacturing insulated-gate bipolar transistor, and method of manufacturing semiconductor device
08/15/2002WO2002063693A1 Carbon nanotube electronic device and electron source
08/15/2002WO2002063690A1 Semiconductor integrated circuit device and its manufacturing method
08/15/2002WO2002063686A2 High performance silicon contact for flip chip
08/15/2002WO2002063683A2 Method of manufacturing a semiconductor device and a semiconductor device obtained by means of said method
08/15/2002WO2002063679A1 Method for producing a capacitor assembly for a semiconductor memory device
08/15/2002WO2002063678A1 Chip transfer method and apparatus
08/15/2002WO2002063677A1 Formation of a tantalum-nitride layer
08/15/2002WO2002063676A2 A slot via filled dual damascene structure without middle stop layer and method for making the same
08/15/2002WO2002063674A1 Lead-free solder structure and method for high fatigue life
08/15/2002WO2002063673A1 A compact and reliable press for packaging semiconductor devices
08/15/2002WO2002063672A1 Method for multilevel copper interconnects for ultra large scale integration
08/15/2002WO2002063671A2 Method for producing a semiconductor component comprising a t-shaped contact electrode
08/15/2002WO2002063670A2 Method for removing copper from a wafer edge
08/15/2002WO2002063669A2 Method and apparatus for two-step barrier layer polishing
08/15/2002WO2002063668A1 Method of forming insulating film and method of producing semiconductor device
08/15/2002WO2002063667A1 Plasma treatment device and plasma treatment method
08/15/2002WO2002063666A1 A chemical vapor deposition method for depositing copper film using hydrogen plasma and surfactant
08/15/2002WO2002063665A2 RELAXED InXGa1-xAs LAYERS INTEGRATED WITH Si
08/15/2002WO2002063663A1 Electron beam exposure apparatus and exposure method
08/15/2002WO2002063662A1 Method for making slit, slit, and electron beam exposure system
08/15/2002WO2002063661A2 Method and apparatus for removal of surface contaminants from substrates in vacuum applications
08/15/2002WO2002063659A1 Device for treating substrates
08/15/2002WO2002063658A2 Self aligned, magnetoresitive random-access memory (mram) structure utilizing a spacer containment scheme
08/15/2002WO2002063633A1 Bi-directional capable bucket brigade circuit
08/15/2002WO2002063629A1 High speed signal path and method
08/15/2002WO2002063404A2 Multi-channel temperature control system for semiconductor processing facilities
08/15/2002WO2002063396A1 In-situ lithography mask cleaning
08/15/2002WO2002063394A1 Fabrication of structures of metal/semiconductor compound by x-ray/euv projection lithography