Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2002
08/27/2002US6441489 Semiconductor device with tantalum nitride barrier film
08/27/2002US6441488 Fan-out translator for a semiconductor package
08/27/2002US6441487 Chip scale package using large ductile solder balls
08/27/2002US6441486 BGA substrate via structure
08/27/2002US6441485 Apparatus for electrically mounting an electronic device to a substrate without soldering
08/27/2002US6441484 Semiconductor device having switching elements around a central control circuit
08/27/2002US6441478 Semiconductor package having metal-pattern bonding and method of fabricating the same
08/27/2002US6441475 Chip scale surface mount package for semiconductor device and process of fabricating the same
08/27/2002US6441474 Semiconductor device and liquid crystal module adopting the same
08/27/2002US6441473 Flip chip semiconductor device
08/27/2002US6441469 Semiconductor memory configuration with dummy components on continuous diffusion regions
08/27/2002US6441468 Semiconductor device
08/27/2002US6441467 Semiconductor device having active element connected to an electrode metal pad via a barrier metal layer and interlayer insulating film
08/27/2002US6441466 Method and apparatus for reducing fixed charge in semiconductor device layers
08/27/2002US6441465 Scribe line structure for preventing from damages thereof induced during fabrication
08/27/2002US6441464 Gate oxide stabilization by means of germanium components in gate conductor
08/27/2002US6441463 IGBT, control circuit, and protection circuit on same substrate
08/27/2002US6441462 Self-aligned SiGe NPN with improved ESD robustness using wide emitter polysilicon extension
08/27/2002US6441461 Thin film resistor with stress compensation
08/27/2002US6441457 Fuse in semiconductor device and fabricating method thereof
08/27/2002US6441456 Semiconductor device and a process for manufacturing the same
08/27/2002US6441452 Method of reducing defects in anti-reflective coatings and semiconductor structures fabricated thereby
08/27/2002US6441448 Semiconductor storage device
08/27/2002US6441447 Co-patterning thin-film resistors of different compositions with a conductive hard mask and method for same
08/27/2002US6441445 Integrated device with bipolar transistor and electronic switch in “emitter switching” configuration
08/27/2002US6441444 Semiconductor device having a nitride barrier for preventing formation of structural defects
08/27/2002US6441442 Integrated inductive circuits
08/27/2002US6441441 Semiconductor device and method of manufacturing the same
08/27/2002US6441440 Semiconductor device and circuit having low tolerance to ionizing radiation
08/27/2002US6441437 Integrated semiconductor circuit with protective structure for protection against electrostatic discharge
08/27/2002US6441436 SOI device and method of fabrication
08/27/2002US6441435 SOI device with wrap-around contact to underside of body, and method of making
08/27/2002US6441434 Semiconductor-on-insulator body-source contact and method
08/27/2002US6441433 Method of making a multi-thickness silicide SOI device
08/27/2002US6441431 Lateral double diffused metal oxide semiconductor device
08/27/2002US6441430 Semiconductor device with floating gates
08/27/2002US6441429 Split-gate flash memory device having floating gate electrode with sharp peak
08/27/2002US6441427 NOR-type flash memory and method for manufacturing the same
08/27/2002US6441426 Nonvolatile semiconductor memory device and method of manufacturing the same
08/27/2002US6441425 Non-volatile semiconductor device and non-volatile semiconductor memory device for storing multi-value information
08/27/2002US6441424 Integrated circuit configuration having at least one capacitor and method for producing the same
08/27/2002US6441423 Trench capacitor with an intrinsically balanced field across the dielectric
08/27/2002US6441422 Structure and method for ultra-scalable hybrid DRAM cell with contacted P-well
08/27/2002US6441421 High dielectric constant materials forming components of DRAM storage cells
08/27/2002US6441420 Semiconductor device and method of fabricating the same
08/27/2002US6441419 Encapsulated-metal vertical-interdigitated capacitor and damascene method of manufacturing same
08/27/2002US6441418 Spacer narrowed, dual width contact for charge gain reduction
08/27/2002US6441417 Single c-axis PGO thin film on ZrO2 for non-volatile memory applications and methods of making the same
08/27/2002US6441415 Ferroelectric and paraelectric thin film devices using dopants which eliminate ferroelectricity
08/27/2002US6441414 Ferroelectric field effect transistor, memory utilizing same, and method of operating same
08/27/2002US6441410 MOSFET with lateral resistor ballasting
08/27/2002US6441400 Semiconductor device and method of fabricating the same
08/27/2002US6441399 Semiconductor integrated system
08/27/2002US6441398 Algorithm for detecting sloped contact holes using a critical-dimension waveform
08/27/2002US6441397 Evaluation of semiconductor chargeup damage and apparatus therefor
08/27/2002US6441396 In-line electrical monitor for measuring mechanical stress at the device level on a semiconductor wafer
08/27/2002US6441395 Column-row addressable electric microswitch arrays and sensor matrices employing them
08/27/2002US6441393 Semiconductor devices with selectively doped III-V nitride layers
08/27/2002US6441392 Device based on quantic islands and method for making same
08/27/2002US6441391 Semiconductor device having drain and gate electrodes formed to lie along few degrees of direction in relation to the substrate
08/27/2002US6441383 Charged particle beam lithography apparatus for forming pattern on semi-conductor
08/27/2002US6441351 Heating device, method for evaluating heating device and pattern forming method
08/27/2002US6441350 Temperature control system for a thermal reactor
08/27/2002US6441349 System for facilitating uniform heating temperature of photoresist
08/27/2002US6441320 Electrically conductive projections having conductive coverings
08/27/2002US6441316 Printed-circuit board and a semiconductor module, and a manufacturing process of the semiconductor module
08/27/2002US6441297 Solar cell arrangement
08/27/2002US6441072 High-melting polyamide composition for electronic applications
08/27/2002US6440879 Physical vapor deposition apparatus with modified shutter disk and cover ring
08/27/2002US6440878 Plasma enhanced chemical vapor deposition (pecvd) process is provided for depositing one or more dielectric material layers on a substrate for use in interconnect structures of integrated circuits
08/27/2002US6440876 Low-K dielectric constant CVD precursors formed of cyclic siloxanes having in-ring SI—O—C, and uses thereof
08/27/2002US6440875 Masking layer method for forming a spacer layer with enhanced linewidth control
08/27/2002US6440874 High throughput plasma resist strip process for temperature sensitive applications
08/27/2002US6440873 Post metal etch cleaning method
08/27/2002US6440872 Method for hybrid DRAM cell utilizing confined strap isolation
08/27/2002US6440871 Layer of ozonated water on the photoresist; directing at least one gas other than ozone toward the semiconductor device so as to move said layer of ozonated water across the photoresist; nitrogen, air, and gaseous hydrochloric acid
08/27/2002US6440870 Accuracy control of etching using plasma
08/27/2002US6440869 Method of forming the capacitor with HSG in DRAM
08/27/2002US6440868 Metal gate with CVD amorphous silicon layer and silicide for CMOS devices and method of making with a replacement gate process
08/27/2002US6440867 Metal gate with PVD amorphous silicon and silicide for CMOS devices and method of making the same with a replacement gate process
08/27/2002US6440866 Plasma reactor with heated source of a polymer-hardening precursor material
08/27/2002US6440865 Metal layer with an antireflection layer
08/27/2002US6440864 Substrate cleaning process
08/27/2002US6440863 Within microelectronics fabrications.
08/27/2002US6440862 Stepped photoresist profile and opening formed using the profile
08/27/2002US6440861 Method of forming dual damascene structure
08/27/2002US6440860 Semiconductor processing methods of transferring patterns from patterned photoresists to materials, and structures comprising silicon nitride
08/27/2002US6440859 Method for etching passivation layer of wafer
08/27/2002US6440858 Multi-layer hard mask for deep trench silicon etch
08/27/2002US6440857 Planarizing a wafer surface of aluminum and a ti/tin barrier layer; undesired surface nonplanarity after the cmp process, such as metal dishing and corrosion of dielectric layers with complicated pattern geometry, can be avoided
08/27/2002US6440856 Cleaning agent for semiconductor parts and method for cleaning semiconductor parts
08/27/2002US6440855 Method of processing surface of workpiece and method of forming semiconductor thin layer
08/27/2002US6440854 Deposited by physical vapor deposition
08/27/2002US6440853 Integrated circuit
08/27/2002US6440852 Integrated circuit including passivated copper interconnection lines and associated manufacturing methods
08/27/2002US6440851 Method and structure for controlling the interface roughness of cobalt disilicide
08/27/2002US6440849 Substantially eliminates the grain growth of copper due to self annealing;
08/27/2002US6440848 Low resistance.
08/27/2002US6440847 Method for forming a via and interconnect in dual damascene
08/27/2002US6440846 Method for forming semiconductor device